SWRS194A January   2018  – July 2018 CC2642R

ADVANCE INFORMATION for pre-production products; subject to change without notice.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Comparison
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram – RGZ Package (Top Side View)
    2. 4.2 Signal Descriptions – RGZ Package
    3. 4.3 Connections for Unused Pins and Modules
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Power Consumption - Power Modes
    5. 5.5  Power Consumption - Radio Modes
    6. 5.6  Nonvolatile (Flash) Memory Characteristics
    7. 5.7  Bluetooth low energy — Receive (RX)
    8. 5.8  Bluetooth low energy — Transmit (TX)
    9. 5.9  Thermal Resistance Characteristics
    10. 5.10 Timing and Switching Characteristics
      1. Table 5-1 Reset Timing
      2. Table 5-2 Wakeup Timing
      3. 5.10.1     Clock Specifications
        1. Table 5-3 48-MHz Crystal Oscillator (XOSC_HF)
        2. Table 5-4 32.768-kHz Crystal Oscillator (XOSC_LF)
        3. Table 5-5 48-MHz RC Oscillator (RCOSC_HF)
        4. Table 5-6 2-MHz RC Oscillator (RCOSC_MF)
        5. Table 5-7 32-kHz RC Oscillator (RCOSC_LF)
      4. 5.10.2     Synchronous Serial Interface (SSI) Characteristics
        1. Table 5-8 Synchronous Serial Interface (SSI) Characteristics
      5. 5.10.3     UART
        1. Table 5-9 UART Characteristics
    11. 5.11 Peripheral Characteristics
      1. 5.11.1 ADC
        1. Table 5-10 ADC Characteristics
      2. 5.11.2 Temperature and Battery Monitor
        1. Table 5-11 Temperature Sensor
        2. Table 5-12 Battery Monitor
      3. 5.11.3 Comparators
        1. Table 5-13 Continuous Time Comparator
        2. Table 5-14 Low-Power Clocked Comparator
      4. 5.11.4 Current Source
        1. Table 5-15 Programmable Current Source
      5. 5.11.5 GPIO
        1. Table 5-16 GPIO DC Characteristics
  6. 6Detailed Description
    1. 6.1  Overview
    2. 6.2  Functional Block Diagram
    3. 6.3  System CPU
    4. 6.4  Radio (RF Core)
      1. 6.4.1 Bluetooth 5 low energy
    5. 6.5  Memory
    6. 6.6  Sensor Controller
    7. 6.7  Cryptography
    8. 6.8  Timers
    9. 6.9  Serial Peripherals and I/O
    10. 6.10 Battery and Temperature Monitor
    11. 6.11 µDMA
    12. 6.12 Debug
    13. 6.13 Power Management
    14. 6.14 Clock Systems
    15. 6.15 Network Processor
  7. 7Application, Implementation, and Layout
    1. 7.1 LaunchPad™ Development Kit Reference Design
  8. 8Device and Documentation Support
    1. 8.1 Tools and Software
    2. 8.2 Documentation Support
      1. 8.2.1 TI SimpleLink™
      2. 8.2.2 TI Design Network
    3. 8.3 Community Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  9. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Orderable Information

Device Overview