SWRS207B January   2018  – January 2019 CC2652R

ADVANCE INFORMATION for pre-production products; subject to change without notice.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Comparison
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram – RGZ Package (Top View)
    2. 4.2 Signal Descriptions – RGZ Package
    3. 4.3 Pin Diagram – YBG Package (Top View)
    4. 4.4 Signal Descriptions – YBG Package
    5. 4.5 Connections for Unused Pins and Modules
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Power Supply and Modules
    5. 5.5  Power Consumption - Power Modes
    6. 5.6  Power Consumption - Radio Modes
    7. 5.7  Nonvolatile (Flash) Memory Characteristics
    8. 5.8  Bluetooth Low Energy — Receive (RX)
    9. 5.9  Bluetooth Low Energy — Transmit (TX)
    10. 5.10 Zigbee and Thread — IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) — RX
    11. 5.11 Zigbee and Thread — IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) — TX
    12. 5.12 Thermal Resistance Characteristics
    13. 5.13 Timing and Switching Characteristics
      1. Table 5-1 Reset Timing
      2. Table 5-2 Wakeup Timing
      3. 5.13.1    Clock Specifications
        1. Table 5-3 48-MHz Crystal Oscillator (XOSC_HF)
        2. Table 5-4 48-MHz RC Oscillator (RCOSC_HF)
        3. Table 5-5 2-MHz RC Oscillator (RCOSC_MF)
        4. Table 5-6 32.768-kHz Crystal Oscillator (XOSC_LF)
        5. Table 5-7 32-kHz RC Oscillator (RCOSC_LF)
      4. 5.13.2    Synchronous Serial Interface (SSI) Characteristics
        1. Table 5-8 Synchronous Serial Interface (SSI) Characteristics
      5. 5.13.3    UART
        1. Table 5-9 UART Characteristics
    14. 5.14 Peripheral Characteristics
      1. 5.14.1 ADC
        1. Table 5-10 ADC Characteristics
      2. 5.14.2 DAC
        1. Table 5-11 Digital-to-Analog Converter (DAC) Characteristics
      3. 5.14.3 Temperature and Battery Monitor
        1. Table 5-12 Temperature Sensor
        2. Table 5-13 Battery Monitor
      4. 5.14.4 Comparators
        1. Table 5-14 Continuous Time Comparator
        2. Table 5-15 Low-Power Clocked Comparator
      5. 5.14.5 Current Source
        1. Table 5-16 Programmable Current Source
      6. 5.14.6 GPIO
        1. Table 5-17 GPIO DC Characteristics
  6. 6Detailed Description
    1. 6.1  Overview
    2. 6.2  Functional Block Diagram
    3. 6.3  System CPU
    4. 6.4  Radio (RF Core)
      1. 6.4.1 Bluetooth 5 low energy
      2. 6.4.2 802.15.4 (Thread, Zigbee, 6LoWPAN)
    5. 6.5  Memory
    6. 6.6  Sensor Controller
    7. 6.7  Cryptography
    8. 6.8  Timers
    9. 6.9  Serial Peripherals and I/O
    10. 6.10 Battery and Temperature Monitor
    11. 6.11 µDMA
    12. 6.12 Debug
    13. 6.13 Power Management
    14. 6.14 Clock Systems
    15. 6.15 Network Processor
  7. 7Application, Implementation, and Layout
    1. 7.1 LaunchPad™ Development Kit Reference Design
  8. 8Device and Documentation Support
    1. 8.1 Development Support
    2. 8.2 Documentation Support
      1. 8.2.1 TI SimpleLink™
      2. 8.2.2 TI Design Network
    3. 8.3 Community Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  9. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGZ|48
Orderable Information

Device Overview