SLLU149E June   2011  – February 2016 TUSB7320 , TUSB7340

 

  1.   TUSB73x0 Board Design and Layout Guidelines
    1.     Trademarks
    2.     Related Documentation
  2. 1 Typical System Implementation
    1. 1.1 Overview
  3. 2 Power
    1. 2.1 Overview
    2. 2.2 Digital Supplies
    3. 2.3 Analog Supplies
    4. 2.4 Ground Terminal
    5. 2.5 Capacitor Selection Recommendations
    6. 2.6 USB VBUS
  4. 3 Device Reset
    1. 3.1 Overview
  5. 4 General High Speed Layout Guidelines
    1. 4.1 Printed Circuit Board Stackup (FR-4 Example)
    2. 4.2 Return Current and Plane References
    3. 4.3 Split Planes – What to Avoid
    4. 4.4 Avoiding Crosstalk
  6. 5 USB Connection
    1. 5.1 Overview
    2. 5.2 Internal Chip Trace Length Mismatch
    3. 5.3 High-Speed Differential Routing
    4. 5.4 SuperSpeed Differential Routing
  7. 6 Package and Breakout
    1. 6.1 Package Drawing
    2. 6.2 Routing Between Pads
    3. 6.3 Pads
    4. 6.4 Land Pattern Recommendation
    5. 6.5 Solder Stencil
  8. 7 PCI Express Connection
    1. 7.1 Internal Chip Trace Length Mismatch
    2. 7.2 Transmit and Receive Links
    3. 7.3 PCI-Express Reference Clock Input
    4. 7.4 PCI Express Reset
    5. 7.5 PCI Express WAKE/CLKREQ
      1. 7.5.1 Leakage Current on Pins WAKE# and CLKREQ#
      2. 7.5.2 Recommendations
  9. 8 Wake from S3
    1. 8.1 Overview
  10. 9 Device Input Clock
    1. 9.1 Overview
  11. 10JTAG Interface
    1. 10.1 Overview
  12. 11Differential Pair ESD Protection
    1. 11.1 Overview
  13. 12SuperSpeed Redriver
    1. 12.1 Overview
  14. 13SMI Pin Implementation
    1. 13.1 Overview
  15. 14Schematics
    1. 14.1 Overview
    2. 14.2 TUSB7320 DEMO EVM REVB Schematics
    3. 14.3 TUSB7340 DEMO EVM REVB Schematics
  16.   Revision History

TUSB73x0 Board Design and Layout Guidelines

These guidelines are intended to provide developers with the resources needed to properly layout the TUSB7320/TUSB7340. They are intended as a follow-on document to the USB 2.0 Board Design and Layout Guidelines (SPRAAR7) which describes general PCB design and layout guidelines for the USB 2.0 differential pair (DP/DM). A layout for the TUSB7340 will seamlessly accommodate the TUSB7320.

This document is focused on the layout and routing of the USB 3.0 SuperSpeed USB and PCI Express. It is intended for developers familiar with high-speed PCB design and layout. Knowledge of the USB 3.0 and PCI Express specifications and protocols are required as well.