SLUS822C June   2008  – August 2016 UCC27200-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Stages
        1. 7.3.1.1 Undervoltage Lockout (UVLO)
        2. 7.3.1.2 Level Shift
        3. 7.3.1.3 Boot Diode
        4. 7.3.1.4 Output Stages
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Switching the MOSFETs
      2. 8.1.2 Dynamic Switching of the MOSFETs
      3. 8.1.3 Delay Matching and Narrow Pulse Widths
      4. 8.1.4 Boot-Diode Performance
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Threshold Type
        2. 8.2.2.2 VDD Bias Supply Voltage
        3. 8.2.2.3 Peak Source and Sink Currents
        4. 8.2.2.4 Propagation Delay
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Power Dissipation
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resource
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

1 Features

  • Qualified for Automotive Applications
  • AEC-Q100 Qualified With the Following Results:
    • Device Temperature Grade 1:
      –40°C to 125°C Ambient Operating Temperature Range
    • Device HBM ESD Classification Level 2
    • Device CDM ESD Classification Level C5
  • Drives Two N-Channel MOSFETs in High-Side and Low-Side Configuration
  • Maximum Boot Voltage: 120 V
  • Maximum VDD Voltage: 20 V
  • On-Chip 0.65-V VF, 0.6-Ω RD Bootstrap Diode
  • Greater than 1 MHz of Operation
  • 20-ns Propagation Delay Times
  • 3-A Sink, 3-A Source Output Currents
  • 8-ns Rise and 7-ns Fall Time With 1000-pF Load
  • 1-ns Delay Matching
  • Specified from –40°C to 140°C (Junction Temperature)

2 Applications

  • Power Supplies for Telecom, Datacom, and Merchant Markets
  • Half-Bridge Applications and Full-Bridge Converters
  • Isolated Bus Architecture
  • Two-Switch Forward Converters
  • Active-Clamp Forward Converters
  • High-Voltage Synchronous-Buck Converters
  • Class-D Audio Amplifiers

3 Description

The UCC2720x-Q1 family of high-frequency N-channel MOSFET drivers include a 120-V bootstrap diode and high-side and low-side drivers with independent inputs for maximum control flexibility. This allows for N-channel MOSFET control in half-bridge, full-bridge, two-switch forward, and active-clamp forward converters. The low-side and the high-side gate drivers are independently controlled and matched to 1 ns between the turnon and turnoff of each other.

An on-chip bootstrap diode eliminates the external discrete diodes. Undervoltage lockout is provided for both the high-side and the low-side drivers, forcing the outputs low if the drive voltage is below the specified threshold.

Two versions of the UCC2720x-Q1 are offered – the UCC27200-Q1 has high-noise-immune CMOS input thresholds, and the UCC27201-Q1 has TTL-compatible thresholds.

Both devices are offered in the 8-pin SO PowerPAD™ (DDA) package.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
UCC2720x-Q1 SO PowerPAD (8) 4.89 mm × 3.90 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.

Simplified Application Diagram

UCC27200-Q1 UCC27201-Q1 symapp_lus746.gif