SWRS199A April   2016  – November 2016 CC2564C

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 VQFN-MR Pin Diagram
      1. 4.1.1 Pin Attributes (VQFN-MR Package)
      2. 4.1.2 Connections for Unused Signals (VQFN-MR Package)
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Power-On Hours
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Power Consumption Summary
      1. 5.5.1 Static Current Consumption
      2. 5.5.2 Dynamic Current Consumption
        1. 5.5.2.1 Current Consumption for Different Bluetooth BR and EDR Scenarios
        2. 5.5.2.2 Current Consumption for Different Low-Energy Scenarios
    6. 5.6 Electrical Characteristics
    7. 5.7 Thermal Resistance Characteristics for VQFN-MR (RVM) Package
    8. 5.8 Timing and Switching Characteristics
      1. 5.8.1 Device Power Supply
        1. 5.8.1.1 Power Sources
        2. 5.8.1.2 Device Power-Up and Power-Down Sequencing
        3. 5.8.1.3 Power Supplies and Shutdown—Static States
        4. 5.8.1.4 I/O States in Various Power Modes
        5. 5.8.1.5 nSHUTD Requirements
      2. 5.8.2 Clock Specifications
        1. 5.8.2.1 Slow Clock Requirements
        2. 5.8.2.2 External Fast Clock Crystal Requirements and Operation
        3. 5.8.2.3 Fast Clock Source Requirements (-40°C to +85°C)
      3. 5.8.3 Peripherals
        1. 5.8.3.1 UART
        2. 5.8.3.2 PCM
      4. 5.8.4 RF Performance
        1. 5.8.4.1 Bluetooth BR and EDR RF Performance
          1. 5.8.4.1.1 Bluetooth Receiver—In-Band Signals
          2. 5.8.4.1.2 Bluetooth Receiver—General Blocking
          3. 5.8.4.1.3 Bluetooth Transmitter—GFSK
          4. 5.8.4.1.4 Bluetooth Transmitter—EDR
          5. 5.8.4.1.5 Bluetooth Modulation—GFSK
          6. 5.8.4.1.6 Bluetooth Modulation—EDR
          7. 5.8.4.1.7 Bluetooth Transmitter—Out-of-Band and Spurious Emissions
        2. 5.8.4.2 Bluetooth low energy RF Performance
          1. 5.8.4.2.1 Bluetooth low energy Receiver—In-Band Signals
          2. 5.8.4.2.2 Bluetooth low energy Receiver—General Blocking
          3. 5.8.4.2.3 Bluetooth low energy Transmitter
          4. 5.8.4.2.4 Bluetooth low energy Modulation
          5. 5.8.4.2.5 Bluetooth low energy Transceiver, Out-Of-Band and Spurious Emissions
  6. 6Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Clock Inputs
      1. 6.3.1 Slow Clock
      2. 6.3.2 Fast Clock Using External Clock Source
        1. 6.3.2.1 External FREF DC-Coupled
        2. 6.3.2.2 External FREF Sine Wave, AC-Coupled
        3. 6.3.2.3 Fast Clock Using External Crystal
    4. 6.4 Functional Blocks
      1. 6.4.1 RF
        1. 6.4.1.1 Receiver
        2. 6.4.1.2 Transmitter
      2. 6.4.2 Host Controller Interface
        1. 6.4.2.1 4-Wire UART Interface—H4 Protocol
        2. 6.4.2.2 3-Wire UART Interface—H5 Protocol
      3. 6.4.3 Digital Codec Interface
        1. 6.4.3.1 Hardware Interface
        2. 6.4.3.2 I2S
        3. 6.4.3.3 Data Format
        4. 6.4.3.4 Frame-Idle Period
        5. 6.4.3.5 Clock-Edge Operation
        6. 6.4.3.6 Two-Channel Bus Example
      4. 6.4.4 Assisted Modes
        1. 6.4.4.1 Assisted HFP 1.6 (WBS)
        2. 6.4.4.2 Assisted A2DP
          1. 6.4.4.2.1 Assisted A2DP Sink
          2. 6.4.4.2.2 Assisted A2DP Source
    5. 6.5 Bluetooth BR and EDR Features
    6. 6.6 Bluetooth low energy Description
    7. 6.7 Bluetooth Transport Layers
    8. 6.8 Changes from the CC2564B Device to the CC2564C Device
  7. 7Applications, Implementation, and Layout
    1. 7.1 Reference Design Schematics and BOM for Power and Radio Connections
    2. 7.2 PCB Layout Guidelines
      1. 7.2.1 General PCB Guidelines
      2. 7.2.2 Power Supply Guidelines
      3. 7.2.3 User Interfaces
      4. 7.2.4 Clock Interfaces
      5. 7.2.5 RF Interface
  8. 8Device and Documentation Support
    1. 8.1 Third-Party Products Disclaimer
    2. 8.2 Tools and Software
    3. 8.3 Device Nomenclature
    4. 8.4 Community Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  9. 9Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ(パッケージ|ピン)
  • RVM|76
サーマルパッド・メカニカル・データ
発注情報

Device Overview

Features

  • TI's Single-Chip Bluetooth® Solution With Bluetooth Basic Rate (BR), Enhanced Data Rate (EDR), and Low Energy (LE) Support
  • Bluetooth 4.2 Component Qualified (Declaration ID: D032801); Compliant up to the HCI Layer
  • Highly Optimized for Size-Constrained and Low-Cost Designs:
    • Single-Ended 50-Ω RF Interface
    • Package Footprint: 76 Terminals, 0.6-mm Pitch, 8-mm × 8-mm (VQFNP-MR)
  • BR and EDR Features Include:
    • Up to Seven Active Devices
    • Scatternet: Up to Three Piconets Simultaneously, One as Master and Two as Slaves
    • Up to Two Synchronous Connection Oriented (SCO) Links on the Same Piconet
    • Support for All Voice Air-Coding—Continuously Variable Slope Delta (CVSD), A-Law, µ-Law, Modified Subband Coding (mSBC), and Transparent (Uncoded)
    • Provide an Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power
    • Support of Multiple Bluetooth Profiles With Enhanced QoS
  • Low Energy Features Include:
    • Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption
    • Independent Buffering for Low Energy Allows Large Numbers of Multiple Connections Without Affecting BR or EDR Performance
    • Built-In Coexistence and Prioritization Handling for BR, EDR, and Low Energy
    • Capabilities of Link Layer Topology Scatternet—Can Act Concurrently as Peripheral and Central
    • Network Support for up to 10 Devices
    • Time Line Optimization Algorithms to Achieve Maximum Channel Utliization
  • Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)
    • Class 1 TX Power up to +12 dBm
    • Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required
    • Improved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation Time
    • Longer Range, Including Twice the Range of Other Low-Energy-Only Solutions
  • Advanced Power Management for Extended Battery Life and Ease of Design
    • On-Chip Power Management, Including Direct Connection to Battery
    • Low Power Consumption for Active, Standby, and Scan Bluetooth Modes
    • Shutdown and Sleep Modes to Minimize Power Consumption
  • Physical Interfaces:
    • UART Interface With Support for Maximum Bluetooth Data Rates
      • UART Transport Layer (H4) With Maximum Rate of 4 Mbps
      • Three-Wire UART Transport Layer (H5) With Maximum Rate of 4 Mbps
    • Fully Programmable Digital Pulse-Code Modulation (PCM)–Inter-IC Sound (I2S) Codec Interface
  • Flexibility for Easy Stack Integration and Validation Into MCUs and MPUs
  • CC256x Bluetooth Hardware Evaluation Tool:
    PC-Based Application to Evaluate RF Performance of the Device and Configure Service Pack

Applications

  • Wireless Audio Solutions
  • mPOS
  • Medical Devices
  • Set-Top Boxes (STBs)
  • Wearable Devices
  • Sensor Hub, Sensor Gateway
    • Home and Factory Automation

Description

The TI CC2564C device is a complete Bluetooth® BR, EDR, and low energy HCI solution that reduces design effort and enables fast time to market. Based on TI’s seventh-generation Bluetooth core, the CC2564C device provides a product-proven solution that is Bluetooth 4.2 compliant. When coupled with a microcontroller unit (MCU), this HCI device offers best-in-class RF performance with about twice the range of other Bluetooth low-energy solutions. Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR, EDR, and low energy modes of operation.

The TI dual-mode Bluetooth stack software is certified and provided royalty free for MCUs and MPUs. The iPod® (MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode Bluetooth Stack. Multiple profiles and sample applications are supported including the following:

Serial port profile (SPP)

Advanced audio distribution profile (A2DP)

Audio/video remote control profile (AVRCP)

Hands-free profile (HFP)

Human interface device (HID)

Generic attribute profile (GATT)

Several Bluetooth low energy profiles and services

Device Information(1)

PART NUMBER PACKAGE BODY SIZE
CC2564CRVM RVM (76) 8.00 mm × 8.00 mm × 0.60 mm
For more information on these devices, see Section 9.

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Functional Block Diagram

CC2564C CC2564C_FBD.gif

NOTE:

The following technologies and assisted modes cannot be used simultaneously with the coprocessor: Bluetooth low energy, assisted HFP 1.6 (WBS), and assisted A2DP. Only one technology or assisted mode can be used at a time.
Figure 1-1 Functional Block Diagram