SWRS233 October   2019 CC3235MODAS , CC3235MODASF

ADVANCE INFORMATION for pre-production products; subject to change without notice.  

  1. Module Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagrams
  2. Revision History
  3. Device Comparison
    1. 3.1 Related Products
  4. Terminal Configuration and Functions
    1. 4.1 CC3235MODAx Pin Diagram
    2. 4.2 Pin Attributes and Pin Multiplexing
      1. Table 4-1 Module Pin Descriptions
    3. 4.3 Signal Descriptions
    4. 4.4 Drive Strength and Reset States for Analog-Digital Multiplexed Pins
    5. 4.5 Pad State After Application of Power to Chip, but Before Reset Release
    6. 4.6 Connections for Unused Pins
  5. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Current Consumption (CC3235MODAS)
      1. Table 5-1 Current Consumption Summary (CC3235MODAS) 2.4 GHz RF Band
      2. Table 5-2 Current Consumption Summary (CC3235MODAS) 5 GHz RF Band
    5. 5.5  Current Consumption (CC3235MODASF)
      1. Table 5-3 Current Consumption Summary (CC3235MODASF) 2.4 GHz RF Band
      2. Table 5-4 Current Consumption Summary (CC3235MODAS) 5 GHz RF Band
    6. 5.6  TX Power Control for 2.4 GHz Band
    7. 5.7  TX Power Control for 5 GHz
    8. 5.8  Brownout and Blackout Conditions
    9. 5.9  Electrical Characteristics for GPIO Pins
      1. 5.9.1 GPIO Pins Except 25, 26, 42, and 44 (25°C)
      2. 5.9.2 GPIO Pins 25, 26, 42, and 44 (25°C)
      3. 5.9.3 Pin Internal Pullup and Pulldown (25°C)
    10. 5.10 CC3235MODAx Antenna Characteristics
    11. 5.11 WLAN Receiver Characteristics
      1. Table 5-6 WLAN Receiver Characteristics: 2.4 GHz Band
      2. Table 5-7 WLAN Receiver Characteristics: 5 GHz Band
    12. 5.12 WLAN Transmitter Characteristics
      1. Table 5-8 WLAN Transmitter Characteristics: 2.4 GHz Band
      2. Table 5-9 WLAN Transmitter Characteristics: 5 GHz Band
    13. 5.13 BLE and WLAN Coexistence Requirements
    14. 5.14 Reset Requirement
    15. 5.15 Thermal Resistance Characteristics for MOB and MON Packages
    16. 5.16 Timing and Switching Characteristics
      1. 5.16.1 Power-Up Sequencing
      2. 5.16.2 Power-Down Sequencing
      3. 5.16.3 Device Reset
      4. 5.16.4 Wake Up From Hibernate Timing
      5. 5.16.5 Peripherals Timing
        1. 5.16.5.1  SPI
          1. 5.16.5.1.1 SPI Master
          2. 5.16.5.1.2 SPI Slave
        2. 5.16.5.2  I2S
          1. 5.16.5.2.1 I2S Transmit Mode
          2. 5.16.5.2.2 I2S Receive Mode
        3. 5.16.5.3  GPIOs
          1. 5.16.5.3.1 GPIO Input Transition Time Parameters
        4. 5.16.5.4  I2C
        5. 5.16.5.5  IEEE 1149.1 JTAG
        6. 5.16.5.6  ADC
        7. 5.16.5.7  Camera Parallel Port
        8. 5.16.5.8  UART
        9. 5.16.5.9  External Flash Interface
        10. 5.16.5.10 SD Host
        11. 5.16.5.11 Timers
  6. Detailed Description
    1. 6.1  Overview
    2. 6.2  Functional Block Diagram
    3. 6.3  Arm® Cortex®-M4 Processor Core Subsystem
    4. 6.4  Wi-Fi® Network Processor Subsystem
      1. 6.4.1 WLAN
      2. 6.4.2 Network Stack
    5. 6.5  Security
    6. 6.6  FIPS 140-2 Level 1 Certification
    7. 6.7  Power-Management Subsystem
      1. 6.7.1 VBAT Wide-Voltage Connection
    8. 6.8  Low-Power Operating Mode
    9. 6.9  Memory
      1. 6.9.1 Internal Memory
        1. 6.9.1.1 SRAM
        2. 6.9.1.2 ROM
        3. 6.9.1.3 Flash Memory
        4. 6.9.1.4 Memory Map
    10. 6.10 Restoring Factory Default Configuration
    11. 6.11 Boot Modes
      1. 6.11.1 Boot Mode List
    12. 6.12 Hostless Mode
    13. 6.13 Device Certification and Qualification
      1. 6.13.1 FCC Certification and Statement
      2. 6.13.2 IC/ISED Certification and Statement
      3. 6.13.3 ETSI/CE Certification
      4. 6.13.4 MIC Certification
    14. 6.14 SRRC Certification and Statement
    15. 6.15 Module Markings
    16. 6.16 End Product Labeling
    17. 6.17 Manual Information to the End User
  7. Applications, Implementation, and Layout
    1. 7.1 Typical Application
      1. 7.1.1 BLE/2.4 GHz Radio Coexistence
      2. 7.1.2 Typical Application Schematic
    2. 7.2 Device Connection and Layout Fundamentals
      1. 7.2.1 Power Supply Decoupling and Bulk Capacitors
      2. 7.2.2 Reset
      3. 7.2.3 Unused Pins
    3. 7.3 PCB Layout Guidelines
      1. 7.3.1 General Layout Recommendations
      2. 7.3.2 CC3235MODAx RF Layout Recommendations
  8. Environmental Requirements and SMT Specifications
    1. 8.1 PCB Bending
    2. 8.2 Handling Environment
      1. 8.2.1 Terminals
      2. 8.2.2 Falling
    3. 8.3 Storage Condition
      1. 8.3.1 Moisture Barrier Bag Before Opened
      2. 8.3.2 Moisture Barrier Bag Open
    4. 8.4 PCB Assembly Guide
      1. 8.4.1 PCB Land Pattern & Thermal Vias
      2. 8.4.2 SMT Assembly Recommendations
      3. 8.4.3 PCB Surface Finish Requirements
      4. 8.4.4 Solder Stencil
      5. 8.4.5 Package Placement
      6. 8.4.6 Solder Joint Inspection
      7. 8.4.7 Rework and Replacement
      8. 8.4.8 Solder Joint Voiding
    5. 8.5 Baking Conditions
    6. 8.6 Soldering and Reflow Condition
  9. Device and Documentation Support
    1. 9.1  Third-Party Products Disclaimer
    2. 9.2  Development Tools and Software
    3. 9.3  Firmware Updates
    4. 9.4  Device Nomenclature
    5. 9.5  Documentation Support
    6. 9.6  Related Links
    7. 9.7  Support Resources
    8. 9.8  Trademarks
    9. 9.9  Electrostatic Discharge Caution
    10. 9.10 Export Control Notice
    11. 9.11 Glossary
  10. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Mechanical, Land, and Solder Paste Drawings
    2. 10.2 Package Option Addendum
      1. 10.2.1 CC3235MODAx Tape and Reel Information
      2. 10.2.2 CC3235MODAx Tape Specifications
      3. 10.2.3 CC3235MODAx Tape Specifications

パッケージ・オプション

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メカニカル・データ(パッケージ|ピン)
  • MON|63
サーマルパッド・メカニカル・データ
発注情報

Module Overview