JAJSEV0C August   2016  – April 2018 DP83822H , DP83822HF , DP83822I , DP83822IF

PRODUCTION DATA.  

  1. 特長
  2. アプリケーション
  3. 概要
    1.     Device Images
      1.      概略回路図
  4. 改訂履歴
  5. デバイス比較表
  6. Pin Configuration and Functions
    1.     Pin Functions
    2. 6.1 IO Pins State During Reset
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Timing Requirements, Power-Up Timing
    7. 7.7  Timing Requirements, Reset Timing
    8. 7.8  Timing Requirements, Serial Management Timing
    9. 7.9  Timing Requirements, 100 Mbps MII Transmit Timing
    10. 7.10 Timing Requirements, 100 Mbps MII Receive Timing
    11. 7.11 Timing Requirements, 10 Mbps MII Transmit Timing
    12. 7.12 Timing Requirements, 10 Mbps MII Receive Timing
    13. 7.13 Timing Requirements, RMII Transmit Timing
    14. 7.14 Timing Requirements, RMII Receive Timing
    15. 7.15 Timing Requirements, RGMII
    16. 7.16 Normal Link Pulse Timing
    17. 7.17 Auto-Negotiation Fast Link Pulse (FLP) Timing
    18. 7.18 10BASE-Te Jabber Timing
    19. 7.19 MII: 100BASE-TX Transmit Latency Timing
    20. 7.20 MII: 100BASE-TX Receive Latency Timing
    21. 7.21 Timing Diagrams
    22. 7.22 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Energy Efficient Ethernet
        1. 8.3.1.1 EEE Overview
        2. 8.3.1.2 EEE Negotiation
      2. 8.3.2 Wake-on-LAN Packet Detection
        1. 8.3.2.1 Magic Packet Structure
        2. 8.3.2.2 Magic Packet Example
        3. 8.3.2.3 Wake-on-LAN Configuration and Status
      3. 8.3.3 Start of Frame Detect for IEEE 1588 Time Stamp
      4. 8.3.4 Clock Output
    4. 8.4 Device Functional Modes
      1. 8.4.1  MAC Interfaces
        1. 8.4.1.1 Media Independent Interface (MII)
        2. 8.4.1.2 Reduced Media Independent Interface (RMII)
        3. 8.4.1.3 Reduced Gigabit Media Independent Interface (RGMII)
      2. 8.4.2  Serial Management Interface
        1. 8.4.2.1 Extended Register Space Access
        2. 8.4.2.2 Write Address Operation
        3. 8.4.2.3 Read Address Operation
        4. 8.4.2.4 Write (No Post Increment) Operation
        5. 8.4.2.5 Read (No Post Increment) Operation
        6. 8.4.2.6 Write (Post Increment) Operation
        7. 8.4.2.7 Read (Post Increment) Operation
        8. 8.4.2.8 Example Write Operation (No Post Increment)
        9. 8.4.2.9 Example Read Operation (No Post Increment)
      3. 8.4.3  100BASE-TX
        1. 8.4.3.1 100BASE-TX Transmitter
          1. 8.4.3.1.1 Code-Group Encoding and Injection
          2. 8.4.3.1.2 Scrambler
          3. 8.4.3.1.3 NRZ to NRZI Encoder
          4. 8.4.3.1.4 Binary to MLT-3 Converter
        2. 8.4.3.2 100BASE-TX Receiver
      4. 8.4.4  100BASE-FX
        1. 8.4.4.1 100BASE-FX Transmit
        2. 8.4.4.2 100BASE-FX Receive
      5. 8.4.5  10BASE-Te
        1. 8.4.5.1 Squelch
        2. 8.4.5.2 Normal Link Pulse Detection and Generation
        3. 8.4.5.3 Jabber
        4. 8.4.5.4 Active Link Polarity Detection and Correction
      6. 8.4.6  Auto-Negotiation (Speed / Duplex Selection)
      7. 8.4.7  Auto-MDIX Resolution
      8. 8.4.8  Loopback Modes
        1. 8.4.8.1 Near-End Loopback
        2. 8.4.8.2 MII Loopback
        3. 8.4.8.3 PCS Loopback
        4. 8.4.8.4 Digital Loopback
        5. 8.4.8.5 Analog Loopback
        6. 8.4.8.6 Far-End (Reverse) Loopback
      9. 8.4.9  BIST Configurations
      10. 8.4.10 Cable Diagnostics
        1. 8.4.10.1 TDR
      11. 8.4.11 Fast Link Down Functionality
    5. 8.5 Programming
      1. 8.5.1 Hardware Bootstrap Configurations
      2. 8.5.2 LED Configuration
      3. 8.5.3 PHY Address Configuration
    6. 8.6 Register Maps
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 TPI Network Circuit
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Fiber Network Circuit
        1. 9.2.2.1 Design Requirements
          1. 9.2.2.1.1 Clock Requirements
            1. 9.2.2.1.1.1 Oscillator
            2. 9.2.2.1.1.2 Crystal
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 MII Layout Guidelines
          2. 9.2.2.2.2 RMII Layout Guidelines
          3. 9.2.2.2.3 RGMII Layout Guidelines
          4. 9.2.2.2.4 MDI Layout Guidelines
        3. 9.2.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power Supply Characteristics
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Signal Traces
      2. 11.1.2 Return Path
      3. 11.1.3 Transformer Layout
        1. 11.1.3.1 Transformer Recommendations
      4. 11.1.4 Metal Pour
      5. 11.1.5 PCB Layer Stacking
    2. 11.2 Layout Example
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 関連リンク
    2. 12.2 ドキュメントの更新通知を受け取る方法
    3. 12.3 コミュニティ・リソース
    4. 12.4 商標
    5. 12.5 静電気放電に関する注意事項
    6. 12.6 Glossary
  13. 13メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

特長

  • IEEE 802.3u準拠: 100BASE-FX、100BASE-TX、10BASE-Te
  • MII/RMII/RGMII MACインターフェイス
  • 低消費電力の単一電源オプション
    • 1.8V AVD < 120mW
    • 3.3V AVD < 220mW
  • ±16kVのHBM ESD保護
  • ±8kVのIEC 61000-4-2 ESD保護
  • IEEE 1588タイム・スタンプのフレーム・スタート検出
  • 高速なリンク・ダウンのタイミング
  • 強制モードでの自動クロスオーバー
  • 動作温度範囲: -40℃~+125℃
  • I/O電圧: 3.3V、2.5V、1.8V
  • パワー・セービング機能
    • Energy Efficient Ethernet (EEE) IEEE 802.3az
    • WoL (Wake-on-LAN)サポートとマジック・パケット検出
    • 省エネルギー・モードをプログラム可能
  • ケーブル診断
  • BIST (内蔵セルフ・テスト)
  • MDC/MDIOインターフェイス