SLVSD18C June   2015  – August 2017 DRV8880

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Simplified System Diagram
      2.      Microstepping Current Waveform
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Indexer Timing Requirements
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Stepper Motor Driver Current Ratings
        1. 7.3.1.1 Peak Current Rating
        2. 7.3.1.2 RMS Current Rating
        3. 7.3.1.3 Full-Scale Current Rating
      2. 7.3.2  PWM Motor Drivers
      3. 7.3.3  Microstepping Indexer
      4. 7.3.4  Current Regulation
      5. 7.3.5  Decay Modes
        1. 7.3.5.1 Mode 1: Slow Decay for Increasing and Decreasing Current
        2. 7.3.5.2 Mode 2: Slow Decay for Increasing Current, Mixed Decay for Decreasing current
        3. 7.3.5.3 Mode 3: Mixed Decay for Increasing and Decreasing Current
        4. 7.3.5.4 Mode 4: Slow Decay for Increasing Current, Fast Decay for Decreasing current
        5. 7.3.5.5 Mode 5: Fast Decay for Increasing and Decreasing Current
      6. 7.3.6  Smart Tune
      7. 7.3.7  Adaptive Blanking Time
      8. 7.3.8  Charge Pump
      9. 7.3.9  LDO Voltage Regulator
      10. 7.3.10 Logic and Tri-Level Pin Diagrams
      11. 7.3.11 Power Supplies and Input Pins
      12. 7.3.12 Protection Circuits
      13. 7.3.13 VM UVLO (UVLO2)
      14. 7.3.14 Logic Undervoltage (UVLO1)
      15. 7.3.15 VCP Undervoltage Lockout (CPUV)
      16. 7.3.16 Thermal Shutdown (TSD)
      17. 7.3.17 Overcurrent Protection (OCP)
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Stepper Motor Speed
        2. 8.2.2.2 Current Regulation
        3. 8.2.2.3 Decay Modes
        4. 8.2.2.4 Sense Resistor
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
    1. 9.1 Bulk Capacitance Sizing
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ(パッケージ|ピン)
  • RHR|28
  • PWP|28
サーマルパッド・メカニカル・データ
発注情報

Device and Documentation Support

Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

Trademarks

AutoTune, PowerPAD, E2E are trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

Glossary

SLYZ022TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.