SNOSCY5B August   2014  – April 2015 FDC1004

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Typical Application
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristicsnote to Electrical Characteristics table
    6. 7.6 I2C Interface Voltage Level
    7. 7.7 I2C Interface Timing
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 The Shield
      2. 8.3.2 The CAPDAC
      3. 8.3.3 Capacitive System Offset Calibration
      4. 8.3.4 Capacitive Gain Calibration
    4. 8.4 Device Functional Modes
      1. 8.4.1 Single Ended Measurement
      2. 8.4.2 Differential Measurement
    5. 8.5 Programming
      1. 8.5.1 Serial Bus Address
      2. 8.5.2 Read/Write Operations
      3. 8.5.3 Device Usage
        1. 8.5.3.1 Measurement Configuration
        2. 8.5.3.2 Triggering Measurements
        3. 8.5.3.3 Wait for Measurement Completion
        4. 8.5.3.4 Read of Measurement Result
    6. 8.6 Register Maps
      1. 8.6.1 Registers
        1. 8.6.1.1 Capacitive Measurement Registers
      2. 8.6.2 Measurement Configuration Registers
      3. 8.6.3 FDC Configuration Register
      4. 8.6.4 Offset Calibration Registers
      5. 8.6.5 Gain Calibration Registers
      6. 8.6.6 Manufacturer ID Register
      7. 8.6.7 Device ID Register
  9. 9 Applications and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Liquid Level Sensor
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Performance Plot
    3. 9.3 Do's and Don'ts
    4. 9.4 Initialization Set Up
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

5 Revision History

Changes from A Revision (October 2014) to B Revision

  • Changed max temp range from 85C to 125C throughout Go
  • Added VSSOP package typeGo
  • Deleted WSON DAP explicit assignment to GND in diagramGo
  • Added VSSOP package diagram Go
  • Changed table from Handling Ratings to ESD Ratings and moved Storage Temp to Absolute Maximum Ratings Go
  • Added JA thermal resistance for VSSOP package Go
  • Added JC thermal resistance for WSON package Go
  • Added JC thermal resistance for VSSOP package Go
  • Added JC thermal resistance for WSON package Go
  • Added JB thermal resistance for VSSOP package Go
  • Added note to Electrical Characteristics table Go
  • Added note to Electrical Characteristics limits Go
  • Changed TcCOFF to "46" from "30"Go
  • Changed GERR to "0.2" from "0.07" Go
  • Changed gain error unit to "%" from "% of full scale"Go
  • Changed tcG to "-37.5" from "2.1" Go
  • Changed tcG unit to "ppm/°C" from "ppm of full scale/°C"Go
  • Added testing for PSRR conditionGo
  • Changed PSRR to "13.6" from "11" Go
  • Changed FRCAPDACto "96.9" from "96.875" Go
  • Deleted CAPDAC resolution from EC tableGo
  • Changed TcCOFFCAPDAC to "30" from "1" Go
  • Changed TcCOFFCAPDACto "fF" from "ppm of FS/°C" Go
  • Changed DRV value of 400pF from typ and moved to max limitGo
  • Changed plot for Active Supply Current vs Temperature due to change in temperature range Go
  • Changed plot for Stand-by Supply Current vs Temperature due to change in temperature range Go
  • Changed plot for Gain Drift vs Temperature due to change in temperature range and gain drift unit Go
  • Changed plot for Offset Drift vs Temperature due to change in temperature range Go
  • Added capacitance vs voltage plot Go
  • Changed shield configuration example for differential mode from "CIN2-CIN1, where CHA=CIN2 and CHB=CIN1" to "CIN1-CIN2, where CHA=CIN1 and CHB=CIN2" Go
  • Changed shield configuration example for differential mode from "CIN2-CIN1, where CHA=CIN2 and CHB=CIN1" to "CIN1-CIN2, where CHA=CIN1 and CHB=CIN2" Go

Changes from * Revision (August 2014) to A Revision

  • Added Parameter not tested in production Go
  • Changed CINx to CINn throughout Go
  • Added note for Applications and Implementation section.Go