SLLS983J June   2009  – September 2019 ISO1050

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Simplified Schematic
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: Supply Current
    6. 6.6  Electrical Characteristics: Driver
    7. 6.7  Electrical Characteristics: Receiver
    8. 6.8  Switching Characteristics: Device
    9. 6.9  Switching Characteristics: Driver
    10. 6.10 Switching Characteristics: Receiver
    11. 6.11 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 CAN Bus States
      2. 8.3.2 Digital Inputs and Outputs
      3. 8.3.3 Protection Features
        1. 8.3.3.1 TXD Dominant Time-Out (DTO)
        2. 8.3.3.2 Thermal Shutdown
        3. 8.3.3.3 Undervoltage Lockout and Fail-Safe
        4. 8.3.3.4 Floating Pins
        5. 8.3.3.5 CAN Bus Short-Circuit Current Limiting
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Bus Loading, Length and Number of Nodes
        2. 9.2.2.2 CAN Termination
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
    1. 10.1 General Recommendations
    2. 10.2 Power Supply Discharging
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Material
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ(パッケージ|ピン)
  • DUB|8
  • DW|16
サーマルパッド・メカニカル・データ
発注情報

Thermal Information

THERMAL METRIC(1) ISO1050 UNIT
DW DUB
16 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 76.0 73.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 41 63.2
RθJB Junction-to-board thermal resistance 47.7 43.0
ψJT Junction-to-top characterization parameter 14.4 27.4
ψJB Junction-to-board characterization parameter 38.2 42.7
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report (SPRA953).