JAJSB44G October   2011  – July 2018 LMZ10500

PRODUCTION DATA.  

  1. 特長
  2. アプリケーション
  3. 概要
    1.     Device Images
      1.      VIN = 3.6Vでの標準的な効率
      2.      放射EMI (CISPR22) VIN = 5V、VOUT = 1.8V、IOUT = 650mA
  4. 改訂履歴
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 System Characteristics
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Current Limit
      2. 7.3.2 Start-up Behavior and Soft Start
      3. 7.3.3 Output Short Circuit Protection
      4. 7.3.4 Thermal Overload Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Circuit Operation
      2. 7.4.2 Input Undervoltage Detection
      3. 7.4.3 Shutdown Mode
      4. 7.4.4 EN Pin Operation
      5. 7.4.5 Internal Synchronous Rectification
      6. 7.4.6 High Duty Cycle Operation
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Setting the Output Voltage
          1. 8.2.2.2.1 RT and RB Selection for Fixed VOUT
          2. 8.2.2.2.2 Output Voltage Accuracy Optimization
        3. 8.2.2.3 Dynamic Output Voltage Scaling
        4. 8.2.2.4 Integrated Inductor
        5. 8.2.2.5 Input and Output Capacitor Selection
      3. 8.2.3 Application Curves
        1. 8.2.3.1 VOUT = 1.2 V
        2. 8.2.3.2 VOUT = 1.8 V
        3. 8.2.3.3 VOUT = 2.5 V
        4. 8.2.3.4 VOUT = 3.3 V
  9. Power Supply Recommendations
    1. 9.1 Voltage Range
    2. 9.2 Current Capability
    3. 9.3 Input Connection
      1. 9.3.1 Voltage Drops
      2. 9.3.2 Stability
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Package Considerations
  11. 11デバイスおよびドキュメントのサポート
    1. 11.1 デバイス・サポート
      1. 11.1.1 WEBENCH®ツールによるカスタム設計
    2. 11.2 ドキュメントのサポート
    3. 11.3 ドキュメントの更新通知を受け取る方法
    4. 11.4 コミュニティ・リソース
    5. 11.5 商標
    6. 11.6 静電気放電に関する注意事項
    7. 11.7 Glossary
  12. 12メカニカル、パッケージ、および注文情報

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ(パッケージ|ピン)
  • SIL|8
発注情報

Package Considerations

Use the following recommendations when utilizing machine placement :

  • Use 1.06 mm (42 mil) or smaller nozzle size. The pickup area is the top of the inductor, which is 1.6 mm × 2 mm.
  • Soft tip pick and place nozzle is recommended.
  • Add 0.05 mm to the component thickness so that the device will be released 0.05 mm (2 mil) into the solder paste without putting pressure or splashing the solder paste.
  • Slow the pick arm when picking the part from the tape and reel carrier and when depositing the IC on the board.
  • If the machine releases the component by force, use minimum force or no more than 3 Newtons.

For manual placement:

  • Use a vacuum pick up hand tool with soft tip head.
  • If vacuum pick up tool is not available, use non-metal tweezers and hold the part by sides.
  • Use minimal force when picking and placing the module on the board.
  • Using hot air station provides better temperature control and better controlled air flow than a heat gun.
  • Go to the video section at www.ti.com/product/lmz10500 for a quick video on how to solder rework the LMZ10500.