JAJSE27 October   2017 MSP432E401Y

PRODUCTION DATA.  

  1. 1デバイスの概要
    1. 1.1 特長
    2. 1.2 アプリケーション
    3. 1.3 概要
    4. 1.4 機能ブロック図
  2. 2改訂履歴
  3. 3Device Characteristics
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram
    2. 4.2 Pin Attributes
    3. 4.3 Signal Descriptions
      1. Table 4-3 Signal Descriptions
    4. 4.4 GPIO Pin Multiplexing
    5. 4.5 Buffer Type
    6. 4.6 Connections for Unused Pins
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Recommended DC Operating Conditions
    5. 5.5  Recommended GPIO Operating Characteristics
    6. 5.6  Recommended Fast GPIO Pad Operating Conditions
    7. 5.7  Recommended Slow GPIO Pad Operating Conditions
    8. 5.8  GPIO Current Restrictions
    9. 5.9  I/O Reliability
    10. 5.10 Current Consumption
    11. 5.11 Peripheral Current Consumption
    12. 5.12 LDO Regulator Characteristics
    13. 5.13 Power Dissipation
    14. 5.14 Thermal Resistance Characteristics, 128-Pin PDT (TQFP) Package
    15. 5.15 Timing and Switching Characteristics
      1. 5.15.1  Load Conditions
      2. 5.15.2  Power Supply Sequencing
        1. 5.15.2.1 Power and Brownout
          1. Table 5-3 Power and Brownout Levels
          2. 5.15.2.1.1 VDDA Levels
          3. 5.15.2.1.2 VDD Levels
          4. 5.15.2.1.3 VDDC Levels
          5. 5.15.2.1.4 VDD Glitch Response
          6. 5.15.2.1.5 VDD Droop Response
      3. 5.15.3  Reset Timing
        1. Table 5-4 Reset Characteristics
      4. 5.15.4  Clock Specifications
        1. 5.15.4.1 PLL Specifications
          1. Table 5-5 Phase Locked Loop (PLL) Characteristics
          2. 5.15.4.1.1 PLL Configuration
        2. 5.15.4.2 PIOSC Specifications
        3. 5.15.4.3 Low-Frequency Oscillator Specifications
          1. Table 5-9 Low-Frequency Oscillator Characteristics
        4. 5.15.4.4 Hibernation Low-Frequency Oscillator Specifications
          1. Table 5-10 Hibernation External Oscillator (XOSC) Input Characteristics
          2. Table 5-11 Hibernation Internal Low-Frequency Oscillator Clock Characteristics
        5. 5.15.4.5 Main Oscillator Specifications
          1. Table 5-12 Main Oscillator Input Characteristics
        6. 5.15.4.6 Main Oscillator Specification WIth ADC
          1. Table 5-14 System Clock Characteristics With ADC Operation
        7. 5.15.4.7 System Clock Characteristics With USB Operation
          1. Table 5-15 System Clock Characteristics With USB Operation
      5. 5.15.5  Sleep Modes
        1. Table 5-16 Wake From Sleep Characteristics
        2. Table 5-17 Wake From Deep Sleep Characteristics
      6. 5.15.6  Hibernation Module
        1. Table 5-18 Hibernation Module Battery Characteristics
        2. Table 5-19 Hibernation Module Characteristics
        3. Table 5-20 Hibernation Module Tamper I/O Characteristics
      7. 5.15.7  Flash Memory
        1. Table 5-21 Flash Memory Characteristics
      8. 5.15.8  EEPROM
        1. Table 5-22 EEPROM Characteristics
      9. 5.15.9  Input/Output Pin Characteristics
        1. Table 5-23 Fast GPIO Module Characteristics
        2. Table 5-24 Slow GPIO Module Characteristics
        3. 5.15.9.1    Types of I/O Pins and ESD Protection
          1. 5.15.9.1.1 Hibernate WAKE pin
            1. Table 5-25 Pad Voltage and Current Characteristics for Hibernate WAKE Pin
          2. 5.15.9.1.2 Nonpower I/O Pins
            1. Table 5-26 Nonpower I/O Pad Voltage and Current Characteristics
      10. 5.15.10 External Peripheral Interface (EPI)
        1. Table 5-28 EPI SDRAM Characteristics
        2. Table 5-29 EPI SDRAM Interface Characteristics
        3. Table 5-30 EPI Host-Bus 8 and Host-Bus 16 Interface Characteristics
        4. Table 5-31 EPI General-Purpose Interface Characteristics
        5. Table 5-32 EPI PSRAM Interface Characteristics
      11. 5.15.11 Analog-to-Digital Converter (ADC)
        1. Table 5-33 Electrical Characteristics for ADC at 1 Msps
        2. Table 5-34 Electrical Characteristics for ADC at 2 Msps
      12. 5.15.12 Synchronous Serial Interface (SSI)
        1. Table 5-35 SSI Characteristics
        2. Table 5-36 Bi- and Quad-SSI Characteristics
      13. 5.15.13 Inter-Integrated Circuit (I2C) Interface
        1. Table 5-37 I2C Characteristics
      14. 5.15.14 Ethernet Controller
        1. 5.15.14.1 DC Characteristics
          1. Table 5-38 Ethernet PHY DC Characteristics
        2. 5.15.14.2 Clock Characteristics for Ethernet
          1. Table 5-39 MOSC 25-MHz Crystal Specification
          2. Table 5-40 MOSC Single-Ended 25-MHz Oscillator Specification
        3. 5.15.14.3 AC Characteristics
          1. Table 5-41 Ethernet Controller Enable and Software Reset Timing
          2. Table 5-42 100Base-TX Transmit Timing
          3. Table 5-43 10Base-T Normal Link Pulse Timing
          4. Table 5-44 Auto-Negotiation Fast Link Pulse (FLP) Timing
          5. Table 5-45 100Base-TX Signal Detect Timing
      15. 5.15.15 Universal Serial Bus (USB) Controller
        1. Table 5-46 ULPI Interface Timing
      16. 5.15.16 Analog Comparator
        1. Table 5-47 Analog Comparator Characteristics
        2. Table 5-48 Analog Comparator Characteristics
        3. Table 5-49 Analog Comparator Voltage Reference Characteristics
        4. Table 5-50 Analog Comparator Voltage Reference Characteristics
      17. 5.15.17 Pulse-Width Modulator (PWM)
        1. Table 5-51 PWM Timing Characteristics
      18. 5.15.18 Emulation and Debug
        1. Table 5-52 JTAG Characteristics
  6. 6Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Arm Cortex-M4F Processor Core
      1. 6.3.1 Processor Core
      2. 6.3.2 System Timer (SysTick)
      3. 6.3.3 Nested Vectored Interrupt Controller (NVIC)
      4. 6.3.4 System Control Block (SCB)
      5. 6.3.5 Memory Protection Unit (MPU)
      6. 6.3.6 Floating-Point Unit (FPU)
    4. 6.4 On-Chip Memory
      1. 6.4.1 SRAM
      2. 6.4.2 Flash Memory
      3. 6.4.3 ROM
      4. 6.4.4 EEPROM
      5. 6.4.5 Memory Map
    5. 6.5 Peripherals
      1. 6.5.1  External Peripheral Interface (EPI)
      2. 6.5.2  Cyclical Redundancy Check (CRC)
      3. 6.5.3  Advanced Encryption Standard (AES) Accelerator
      4. 6.5.4  Data Encryption Standard (DES) Accelerator
      5. 6.5.5  Secure Hash Algorithm/Message Digest Algorithm (SHA/MD5) Accelerator
      6. 6.5.6  Serial Communications Peripherals
        1. 6.5.6.1 Ethernet MAC and PHY
        2. 6.5.6.2 Controller Area Network (CAN)
        3. 6.5.6.3 Universal Serial Bus (USB)
        4. 6.5.6.4 Universal Asynchronous Receiver/Transmitter (UART)
        5. 6.5.6.5 Inter-Integrated Circuit (I2C)
        6. 6.5.6.6 Quad Synchronous Serial Interface (QSSI)
      7. 6.5.7  System Integration
        1. 6.5.7.1 Direct Memory Access (DMA)
        2. 6.5.7.2 System Control and Clocks
        3. 6.5.7.3 Programmable Timers
        4. 6.5.7.4 Capture Compare PWM (CCP) Pins
        5. 6.5.7.5 Hibernation (HIB) Module
        6. 6.5.7.6 Watchdog Timers
        7. 6.5.7.7 Programmable GPIOs
      8. 6.5.8  Advanced Motion Control
        1. 6.5.8.1 Pulse Width Modulation (PWM)
        2. 6.5.8.2 Quadrature Encoder With Index (QEI) Module
      9. 6.5.9  Analog
        1. 6.5.9.1 ADC
        2. 6.5.9.2 Analog Comparators
      10. 6.5.10 JTAG and Arm Serial Wire Debug
      11. 6.5.11 Peripheral Memory Map
    6. 6.6 Identification
    7. 6.7 Boot Modes
  7. 7Applications, Implementation, and Layout
    1. 7.1 System Design Guidelines
  8. 8デバイスおよびドキュメントのサポート
    1. 8.1 使い始めと次の手順
    2. 8.2 デバイスの項目表記
    3. 8.3 ツールとソフトウェア
    4. 8.4 ドキュメントのサポート
    5. 8.5 Community Resources
    6. 8.6 商標
    7. 8.7 静電気放電に関する注意事項
    8. 8.8 Export Control Notice
    9. 8.9 Glossary
  9. 9メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
  • PDT|128
サーマルパッド・メカニカル・データ
発注情報

Table 5-35 SSI Characteristics

over operating free-air temperature (unless otherwise noted) (see Figure 5-28, Figure 5-29, and Figure 5-30)
NO. PARAMETERMINTYPMAXUNIT
S1 tCLK_PER SSIClk cycle time As master(1) 16.67 ns
As slave(2) 100
S2 tCLK_HIGH SSIClk high time As master 8.33 ns
As slave 50
S3 tCLK_LOW SSIClk low time As master 8.33 ns
As slave 50
S4 tCLKR SSIClk rise time(3) 1.25 ns
S5 tCLKF SSIClk fall time (3) 1.25 ns
S6 tTXDMOV Master mode: master Tx data output (to slave) valid time from edge of SSIClk 4.00 ns
S7 tTXDMOH Master mode: master Tx data output (to slave) hold time after next SSIClk 0.60 ns
S8 tRXDMS Master mode: master Rx data In (from slave) setup time 7.89 ns
S9 tRXDMH Master mode: master Rx data In (from slave) hold time 0 ns
S10 tTXDSOV Slave mode: master Tx data output (to master) valid time from edge of SSIClk 47.60(4) ns
S11 tTXDSOH Slave mode: slave Tx data output (to master) hold time from next SSIClk 37.4(5) ns
S13 tRXDSSU Slave mode: Rx data in (from master) setup time 0 ns
S14 tRXDSH Slave mode: Rx data in (from master) hold time 37.03(6) ns
(1) In master mode, the system clock must be at least twice as fast as the SSIClk.
(2) In slave mode, the system clock must be at least 12 times faster than the SSIClk.
(3) The delays shown are using 12-mA drive strength.
(4) This MAX value is for the minimum slave mode tSYSCLK period (8.33 ns). To find the MAX tTXDSOV value for a larger tSYSCLK, use the equation: 4 × tSYSCLK + 14.25.
(5) This MIN value is for the minimum slave mode tSYSCLK (8.33 ns). To find the MIN tTXDSOH value for a larger tSYSCLK, use the equation: 4 × tSYSCLK + 4.08.
(6) This MIN value is for the minimum slave mode tSYSCLK (8.33 ns). To find the MIN tTXDSH value for a larger tSYSCLK, use the equation: 4 × tSYSCLK + 3.70.
MSP432E401Y LMI-SSI-Timing_ti_blizzard.gifFigure 5-28 SSI Timing for TI Frame Format (FRF = 01), Single Transfer Timing Measurement
MSP432E401Y SSI_Timing_SPI_blizzard-master.gifFigure 5-29 Master Mode SSI Timing for SPI Frame Format (FRF = 00), With SPH = 1
MSP432E401Y SSI_Timing_SPI_blizzard-slave.gifFigure 5-30 Slave Mode SSI Timing for SPI Frame Format (FRF = 00), With SPH = 1

Table 5-36 lists the characteristics for Bi-SSI and Quad-SSI.