JAJSH48 March   2019 SN74AXCH4T245

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     機能ブロック図
  4. 4 改訂履歴
  5. 5 概要（続き）
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Switching Characteristics, VCCA = 0.7 ± 0.05 V
    7. 7.7  Switching Characteristics, VCCA = 0.8 ± 0.04 V
    8. 7.8  Switching Characteristics, VCCA = 0.9 ± 0.045 V
    9. 7.9  Switching Characteristics, VCCA = 1.2 ± 0.1 V
    10. 7.10 Switching Characteristics, VCCA = 1.5 ± 0.1 V
    11. 7.11 Switching Characteristics, VCCA = 1.8 ± 0.15 V
    12. 7.12 Switching Characteristics, VCCA = 2.5 ± 0.2 V
    13. 7.13 Switching Characteristics, VCCA = 3.3 ± 0.3 V
    14. 7.14 Operating Characteristics: TA = 25°C
    15. 7.15 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Load Circuit and Voltage Waveforms
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Standard CMOS Inputs
      2. 9.3.2  Balanced High-Drive CMOS Push-Pull Outputs
      3. 9.3.3  Partial Power Down (Ioff)
      4. 9.3.4  VCC Isolation
      5. 9.3.5  Over-voltage Tolerant Inputs
      6. 9.3.6  Glitch-free Power Supply Sequencing
      7. 9.3.7  Negative Clamping Diodes
      8. 9.3.8  Fully Configurable Dual-Rail Design
      9. 9.3.9  Supports High-Speed Translation
      10. 9.3.10 Bus-Hold Data Inputs
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13デバイスおよびドキュメントのサポート
    1. 13.1 関連資料
    2. 13.2 ドキュメントの更新通知を受け取る方法
    3. 13.3 コミュニティ・リソース
    4. 13.4 商標
    5. 13.5 静電気放電に関する注意事項
    6. 13.6 Glossary
  14. 14メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7.4 Thermal Information

THERMAL METRIC(1) SN74AXCH4T245 UNIT
PW (TSSOP) RSV (UQFN)
16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 126.9 130.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 49.3 70.3 °C/W
RθJB Junction-to-board thermal resistance 74.3 57.4 °C/W
ψJT Junction-to-top characterization parameter 8.1 4.6 °C/W
ψJB Junction-to-board characterization parameter 73.4 55.8 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.