JAJSFH5C May 2018 – December 2018 TAS5805M
The Thermal Foldback (TFB), is designed to protect TAS5805M from excessive die temperature increases, in case the device operates beyond the recommended temperature/power limit, or with a weaker thermal system design than recommended. It allows the TAS5805M to play as loud as possible without triggering unexpected thermal shutdown. When the die temperature triggers the over-temperature warning (OTW) level (135C typ), an internal AGL (Automatic Gain Limiter) will reduce the digital gain automatically. Once the die temperature drops below the OTW, the device’s digital gain gradually returns to the former setting. Both the attenuation gain and adjustable rate are programmable. The TFB gain regulation speed (attack rate and release rate) settings are the same as a regular AGL, which is also configurable with TAS5805M App in PurePathTM Console3.