JAJSF33B August   2017  – July 2018 THS3491

PRODUCTION DATA.  

  1. 特長
  2. アプリケーション
  3. 概要
    1.     Device Images
      1.      標準的な任意波形発生器の出力駆動回路
      2.      高調波歪みと周波数との関係
  4. 改訂履歴
  5. Device Comparison Table
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: VS = ±15 V
    6. 7.6 Electrical Characteristics: VS = ±7.5 V
    7. 7.7 Typical Characteristics: ±15 V
    8. 7.8 Typical Characteristics: ±7.5 V
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power-Down (PD) Pin
      2. 8.3.2 Power-Down Reference (REF) Pin
      3. 8.3.3 Internal Junction Temperature Sense (TJ_SENSE) Pin
    4. 8.4 Device Functional Modes
      1. 8.4.1 Wideband Noninverting Operation
      2. 8.4.2 Wideband, Inverting Operation
      3. 8.4.3 Single-Supply Operation
      4. 8.4.4 Maximum Recommended Output Voltage
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Driving Capacitive Loads
      2. 9.1.2 Video Distribution
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PowerPAD™ Integrated Circuit Package Design Considerations (DDA Package Only)
        1. 11.1.1.1 PowerPAD™ Integrated Circuit Package Layout Considerations
        2. 11.1.1.2 Power Dissipation and Thermal Considerations
    2. 11.2 Layout Example
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 ドキュメントのサポート
      1. 12.1.1 関連資料
    2. 12.2 ドキュメントの更新通知を受け取る方法
    3. 12.3 コミュニティ・リソース
    4. 12.4 商標
    5. 12.5 静電気放電に関する注意事項
    6. 12.6 Glossary
  13. 13メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
発注情報

Typical Characteristics: ±7.5 V

at +VS = 7.5 V, –VS = –7.5 V, TA ≈ 25°C, RLOAD = 100 Ω to midsupply, noninverting gain (G) = 5 V/V  RGT package: RF = 576 Ω, RG = 143 Ω, or DDA package: RF = 798 Ω, RG = 200 Ω (unless otherwise noted)
THS3491 D023_SBOS875.gif
VO = 2 VPP
Figure 42. Noninverting Small-Signal Frequency Response
THS3491 D024_SBOS875.gif
VO = 2 VPP
Figure 44. HD2 vs Frequency
THS3491 D026_SBOS875.gif
Figure 46. HD2 vs Frequency Across Output Swing
THS3491 D028_SBOS875.gif
Figure 48. HD2 vs Output Swing
THS3491 D030_SBOS875.gif
VO = 2 VPP RLOAD = 1 kΩ
Figure 50. Harmonic Distortion vs Frequency
THS3491 D063_SBOS875.gif
±100-kHz frequency spacing
Figure 52. IMD2 vs Output Voltage Swing
THS3491 D034_SBOS875.gif
VO = 5 VPP
Figure 54. G = 5 V/V Pulse Response
THS3491 D036_SBOS875.gif
VO = 5 VPP
Figure 56. G = –5 V/V Pulse Response
THS3491 D022_SBOS875.gif
Figure 58. Overdrive Recovery Time
THS3491 D049_SBOS875_Input-offset-voltage-Drift-15V.gif
Flash tested to keep TJ as close to TA as possible
Figure 60. Input Offset Voltage Over Temperature
THS3491 D068_SBOS875.gif
VO = 2 VPP
Figure 43. Inverting Small-Signal Frequency Response
THS3491 D025_SBOS875.gif
VO = 2 VPP
Figure 45. HD3 vs Frequency
THS3491 D027_SBOS875.gif
Figure 47. HD3 vs Frequency Across Output Swing
THS3491 D029_SBOS875.gif
Figure 49. HD3 vs Output Swing
THS3491 D039_SBOS875.gif
VO = 2.5 VPP per tone ±100-kHz frequency spacing
Figure 51. Intermodulation Distortion vs Frequency
THS3491 D064_SBOS875.gif
±100-kHz frequency spacing
Figure 53. IMD3 vs Output Voltage Swing
THS3491 D035_SBOS875.gif
VO = 10 VPP
Figure 55. G = 5 V/V Pulse Response
THS3491 D037_SBOS875.gif
VO = 10 VPP
Figure 57. G = –5 V/V Pulse Response
THS3491 D044_SBOS875_Output-Swing-vs-Load-15V.gif
Measured with devices soldered on TI EVM. Devices not turned off at any read points but load applied for a few msec to measure VOUT and then removed.
Figure 59. Output Voltage Swing vs Output Current