JAJSEU0G March   2003  – February 2018 TLV2460-Q1 , TLV2460A-Q1 , TLV2461-Q1 , TLV2461A-Q1 , TLV2462-Q1 , TLV2462A-Q1 , TLV2463-Q1 , TLV2463A-Q1 , TLV2464A-Q1

PRODUCTION DATA.  

  1. 特長
  2. アプリケーション
  3. 概要
    1.     代表的なアプリケーション
  4. 改訂履歴
  5. Pin Configuration and Functions
    1.     Pin Functions
    2.     Pin Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information: TLV2460x-Q1
    5. 6.5  Thermal Information: TLV2461x-Q1
    6. 6.6  Thermal Information: TLV2462-Q1
    7. 6.7  Thermal Information: TLV2462A-Q1
    8. 6.8  Thermal Information: TLV2463x-Q1
    9. 6.9  Electrical Characteristics: VDD = 3 V
    10. 6.10 Electrical Characteristics: VDD = 5 V
    11. 6.11 Operating Characteristics: VDD = 3 V
    12. 6.12 Operating Characteristics: VDD = 5 V
    13. 6.13 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Driving a Capacitive Load
      2. 8.3.2 Offset Voltage
      3. 8.3.3 General Configurations
      4. 8.3.4 General Power Dissipation Considerations
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Function
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Macromodel Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 ドキュメントのサポート
      1. 12.1.1 関連資料
    2. 12.2 関連リンク
    3. 12.3 コミュニティ・リソース
    4. 12.4 商標
    5. 12.5 静電気放電に関する注意事項
    6. 12.6 Glossary
  13. 13メカニカル、パッケージ、および注文情報

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ(パッケージ|ピン)
  • PW|8
サーマルパッド・メカニカル・データ
発注情報

Layout Guidelines

To achieve the levels of high performance of the TLV246x-Q1, follow proper printed-circuit board design techniques. A general set of guidelines is shown in the following list.

  • TI recommends using a ground plane on the board to provide all components with a low inductive ground connection. However, in the areas of the amplifier inputs and output, the ground plane is removed to minimize the stray capacitance.
  • Use a 6.8-μF tantalum capacitor in parallel with a 0.1-μF ceramic capacitor on each supply terminal. It may be possible to share the tantalum among several amplifiers depending on the application, but a 0.1-μF ceramic capacitor must always be used on the supply terminal of every amplifier. In addition, the 0.1-μF capacitor must be placed as close as possible to the supply terminal. As this distance increases, the inductance in the connecting trace makes the capacitor less effective. The designer must strive for distances of less than 0.1 inches between the device power terminals and the ceramic capacitors.
  • TI does not recommend using sockets. The additional lead inductance in the socket pins often leads to stability problems. For best implementation, solder surface-mount packages directly to the printed circuit board.
  • Optimum high performance is achieved when stray series inductance is minimized. The circuit layout must be made as compact as possible, which minimizes the length of all trace runs. Take care to pay attention to the inverting input of the amplifier; keep the length as short as possible. This minimizes stray capacitance at the input of the amplifier.
  • TI recommends using surface mount passive components for high performance amplifier circuits. Stray series inductance is reduced because of the low lead inductance of surface mount components.. The small size of surface-mount components leads to a compact layout, which minimizes stray inductance and capacitance. TI recommends that lead lengths be kept as short as possible if leaded components are used.