SLAS679A December   2011  – September 2015 TLV320AIC3262

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Thermal Information
    5. 8.5  Electrical Characteristics, SAR ADC
    6. 8.6  Electrical Characteristics, ADC
    7. 8.7  Electrical Characteristics, Bypass Outputs
    8. 8.8  Electrical Characteristics, Microphone Interface
    9. 8.9  Electrical Characteristics, Audio DAC Outputs
    10. 8.10 Electrical Characteristics, Class-D Outputs
    11. 8.11 Electrical Characteristics, Miscellaneous
    12. 8.12 Electrical Characteristics, Logic Levels
    13. 8.13 I2S/LJF/RJF Timing in Master Mode (see )
    14. 8.14 I2S/LJF/RJF Timing in Slave Mode (see )
    15. 8.15 DSP/Mono PCM Timing in Slave Mode (see )
    16. 8.16 I2C Interface Timing (see )
    17. 8.17 SPI Interface Timing
    18. 8.18 Dissipation Ratings
    19. 8.19 Typical Characteristics
      1. 8.19.1 Audio ADC Performance
      2. 8.19.2 Audio DAC Performance
      3. 8.19.3 Class-D Driver Performance
      4. 8.19.4 MICBIAS Performance
  9. 9 Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1  Digital Pins
      2. 10.3.2  Analog Pins
      3. 10.3.3  Multifunction Pins
      4. 10.3.4  Analog Audio I/O
        1. 10.3.4.1  Analog Low Power Bypass
        2. 10.3.4.2  ADC Bypass Using Mixer Amplifiers
        3. 10.3.4.3  Headphone Outputs
        4. 10.3.4.4  Using the Headphone Amplifier
        5. 10.3.4.5  Ground-Centered Headphone Amplifier Configuration
        6. 10.3.4.6  Circuit Topology
        7. 10.3.4.7  Charge Pump Set-Up and Operation
        8. 10.3.4.8  Output Power Optimization
        9. 10.3.4.9  Offset Correction and Start-Up
        10. 10.3.4.10 Ground-Centered Headphone Setup
          1. 10.3.4.10.1 High Audio Output Power, High Performance Setup
          2. 10.3.4.10.2 High Audio Output Power, Low Power Consumption Setup
          3. 10.3.4.10.3 Medium Audio Output Power, High Performance Setup
          4. 10.3.4.10.4 Lowest Power Consumption, Medium Audio Output Power Setup
        11. 10.3.4.11 Stereo Unipolar Configuration
          1. 10.3.4.11.1 Circuit Topology
          2. 10.3.4.11.2 Unipolar Turn-On Transient (Pop) Reduction
        12. 10.3.4.12 Mono Differential DAC to Mono Differential Headphone Output
        13. 10.3.4.13 Stereo Line Outputs
        14. 10.3.4.14 Line Out Amplifier Configurations
        15. 10.3.4.15 Differential Receiver Output
        16. 10.3.4.16 Stereo Class-D Speaker Outputs
      5. 10.3.5  ADC / Digital Microphone Interface
        1. 10.3.5.1 ADC Processing Blocks - Overview
          1. 10.3.5.1.1 ADC Processing Blocks
      6. 10.3.6  DAC
        1. 10.3.6.1 DAC Processing Blocks — Overview
          1. 10.3.6.1.1 DAC Processing Blocks
      7. 10.3.7  Powertune
      8. 10.3.8  Clock Generation and PLL
      9. 10.3.9  Interfaces
        1. 10.3.9.1 Control Interfaces
          1. 10.3.9.1.1 I2C Control
          2. 10.3.9.1.2 SPI Control
        2. 10.3.9.2 Digital Audio Interfaces
        3. 10.3.9.3 miniDSP
          1. 10.3.9.3.1 miniDSP
          2. 10.3.9.3.2 Software
        4. 10.3.9.4 Asynchronous Sample Rate Conversion (ASRC)
      10. 10.3.10 Device Special Functions
      11. 10.3.11 Device Power Consumption
      12. 10.3.12 Powertune
      13. 10.3.13 Clock Generation and PLL
      14. 10.3.14 Interfaces
        1. 10.3.14.1 Control Interfaces
        2. 10.3.14.2 I2C Control
        3. 10.3.14.3 SPI Control
        4. 10.3.14.4 Digital Audio Interfaces
      15. 10.3.15 miniDSP
      16. 10.3.16 Device Special Functions
    4. 10.4 Device Functional Modes
      1. 10.4.1 Recording Mode
      2. 10.4.2 Playback Mode
      3. 10.4.3 Analog Low Power Bypass Modes
    5. 10.5 Register Maps
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
      2. 11.2.2 Detailed Design Procedure
        1. 11.2.2.1 Charge Pump Flying and Holding Capacitor
        2. 11.2.2.2 Reference Filtering Capacitor
        3. 11.2.2.3 MICBIAS
      3. 11.2.3 Application Curves
  12. 12Power Supply Recommendations
    1. 12.1 Device Power Consumption
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Examples
  14. 14Device and Documentation Support
    1. 14.1 Documentation Support
      1. 14.1.1 Related Documentation
    2. 14.2 Community Resources
    3. 14.3 Trademarks
    4. 14.4 Electrostatic Discharge Caution
    5. 14.5 Glossary
  15. 15Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

11 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.

11.1 Application Information

These typical connection diagrams highlight the required external components and system level connections for proper operation of the device in several popular use cases.

Each of these configurations can be realized using the Evaluation Modules (EVMs) for the device. These flexible modules allow full evaluation of the device in all available modes of operation. Additionally, some of the application circuits are available as reference designs and can be found on the TI website. Also see the TLV320AIC3262 product page for information on ordering the EVM. Not all configurations are available as reference designs; however, any design variation can be supported by TI through schematic and layout reviews. Visit www.support.ti.com for additional design assistance. Also, join the audio converters discussion forum at http://e2e.ti.com.

11.2 Typical Application

Figure 33 shows a typical circuit configuration for a system utilizing TLV320AIC3262. Note that while this circuit configuration shows all three Audio Serial Interfaces connected to a single Host Processor, it is also quite common for these Audio Serial Interfaces to connect to separate devices (for example Host Processor on Audio Serial Interface number 1, and modems and/or Bluetooth devices on the other audio serial interfaces).

TLV320AIC3262 AIC3262_App_Reference_Diagram.gif Figure 33. Typical Circuit Configuration

11.2.1 Design Requirements

This section gives the power-consumption values for various PowerTune modes. All measurements were taken with the PLL turned off and the ADC configured for single-ended input.

Table 14. ADC, Stereo, 48 kHz, Highest Performance, DVDD = IOVDD = 1.8 V, AVDDx_18 = 1.8 V(1)

DEVICE COMMON MODE SETTING = 0.75 V DEVICE COMMON MODE SETTING = 0.9 V UNIT
PTM_R1 PTM_R2 PTM_R3 PTM_R4 PTM_R1 PTM_R2 PTM_R3 PTM_R4
0-dB full-scale X 375 375 375 X 500 500 500 mVRMS
Maximum allowed input level w.r.t. 0 dB full scale X –12 0 0 X –12 0 0 dB full scale
Effective SNR w.r.t. maximum allowed input level X 78.2 91.2 91 X 79.5 93.1 93 dB
Power consumption X 12.3 14.6 18.8 X 12.3 14.6 18.8 mW
(1) AOSR = 128, Processing Block = PRB_R1 (Decimation Filter A)

Table 15. Alternative Processing Blocks

PROCESSING BLOCK FILTER ESTIMATED POWER CHANGE (mW)
PRB_R2 A +1.2
PRB_R3 A +0.8

Table 16. ADC, Stereo, 48 kHz, Lowest Power Consumption(1)

PTM_R1
CM = 0.75 V
AVdd = 1.5 V 		PTM_R3
CM = 0.9 V
AVdd = 1.8 V 		UNIT
0-dB full-scale 375 500 mVRMS
Maximum allowed input level w.r.t. 0 dB full scale –2 0 dB full scale
Effective SNR w.r.t. maximum allowed input level 85.9 90.8 dB
Power consumption 5.6 9.5 mW
(1) AOSR = 64, Processing Block = PRB_R7 (Decimation Filter B), DVdd = 1.26 V

Table 17. Alternative Processing Blocks

PROCESSING BLOCK FILTER ESTIMATED POWER CHANGE (mW)
PRB_R8 B +0.4
PRB_R9 B +0.2
PRB_R1 A +1.2
PRB_R2 A +1.8
PRB_R3 A +1.6

Table 18. DAC, Stereo, 48 kHz, Highest Performance, DVDD = IOVDD = 1.8 V, AVDDx_18 = 1.8 V(1)

DEVICE COMMON MODE SETTING = 0.75 V DEVICE COMMON MODE SETTING = 0.9 V UNIT
PTM_P1 PTM_P2 PTM_P3 PTM_P4 PTM_P1 PTM_P2 PTM_P3 PTM_P4
0-dB full-scale 75 225 375 375 100 300 500 500 mVRMS
Lineout Effective SNR w.r.t. 0 dB full scale 89.5 96.3 99.3 99.2 91.7 98.4 101.2 101.2 dB
Power consumption 11.3 11.9 12.4 12.4 11.5 12.2 12.9 12.9 mW
(1) DOSR = 128, Processing Block = PRB_P8 (Interpolation Filter B)

Table 19. Alternative Processing Blocks

PROCESSING BLOCK FILTER ESTIMATED POWER CHANGE (mW)
PRB_P1 A –0.1
PRB_P2 A +2.6
PRB_P3 A +1.1
PRB_P7 B –2.8
PRB_P9 B –1.7
PRB_P10 B +0.6
PRB_P11 B –1.2
PRB_P23 A –0.1
PRB_P24 A +2.8
PRB_P25 A +3.6

Table 20. DAC, Stereo, 48 kHz, Lowest Power Consumption(1)

CM = 0.75 V
AVdd = 1.5 V
PRB_P26
PTM_P1		 CM = 0.9 V
AVdd = 1.8 V
PRB_P26
PTM_P1		 CM = 0.75 V
AVdd = 1.5 V
PRB_P7
PTM_P4		 UNIT
0-dB full-scale 75 100 375 mVRMS
Lineout Effective SNR w.r.t. 0-dB full-scale 88.6 90.7 99.2 dB
Power consumption 2.7 3.3 5.2 mW
(1) DOSR = 64, Interpolation Filter D, DVdd = 1.26 V

Table 21. Alternative Processing Blocks

PROCESSING BLOCK FILTER ESTIMATED POWER CHANGE (mW)(1)
PRB_P1 A +3.1
PRB_P2 A +4.4
PRB_P3 A +3.6
PRB_P7 B +1.7
PRB_P9 B +2.3
PRB_P10 B +3.4
PRB_P11 B +2.5
PRB_P23 A +3.1
PRB_P24 A +4.5
PRB_P25 A +4.8
(1) Estimated power change is w.r.t. PRB_P26.

For more possible configurations and measurements, please consult the TLV320AIC3262 Applications Reference Guide, SLAU309.

11.2.2 Detailed Design Procedure

For more detailed information see the TLV320AIC3262 Applications Reference Guide, SLAU309.

11.2.2.1 Charge Pump Flying and Holding Capacitor

The TLV320AIC3262 features a built-in charge-pump to generate a negative supply rail, VNEG from CPVDD_18. The negative voltage is used by the headphone amplifier to enable driving the output signal biased around ground potential. For proper operation of the charge pump and headphone amplifier, TI recommends that the flying capacitor connected between CPFCP and CPFCM pins and the holding capacitor connected between VNEG and ground be of X7R type. TI recommends to use 2.2 μF as capacitor value. Failure to use X7R type capacitor can result in degraded performance of charge pump and headphone amplifier.

11.2.2.2 Reference Filtering Capacitor

The TLV320AIC3262 has a built-in bandgap used to generate reference voltages and currents for the device. To achieve high SNR, the reference voltage on VREF_AUDIO should be filtered using a 10-μF capacitor from VREF_AUDIO pin to ground.

11.2.2.3 MICBIAS

TLV320AIC3262 has a built-in bias voltage output for biasing of microphones. No intentional capacitors should be connected directly to the MICBIAS output for filtering

11.2.3 Application Curves

TLV320AIC3262 G001_ADC_SNR_channel_gain.png Figure 34. ADC SNR vs Channel Gain Input-Referred
TLV320AIC3262 G008_DAC_REC_THDN_Pout.png Figure 35. Total Harmonic Distortion + Noise vs Differential Receiver Output Power 32-Ω Load