SLAS679A December   2011  – September 2015 TLV320AIC3262

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Thermal Information
    5. 8.5  Electrical Characteristics, SAR ADC
    6. 8.6  Electrical Characteristics, ADC
    7. 8.7  Electrical Characteristics, Bypass Outputs
    8. 8.8  Electrical Characteristics, Microphone Interface
    9. 8.9  Electrical Characteristics, Audio DAC Outputs
    10. 8.10 Electrical Characteristics, Class-D Outputs
    11. 8.11 Electrical Characteristics, Miscellaneous
    12. 8.12 Electrical Characteristics, Logic Levels
    13. 8.13 I2S/LJF/RJF Timing in Master Mode (see )
    14. 8.14 I2S/LJF/RJF Timing in Slave Mode (see )
    15. 8.15 DSP/Mono PCM Timing in Slave Mode (see )
    16. 8.16 I2C Interface Timing (see )
    17. 8.17 SPI Interface Timing
    18. 8.18 Dissipation Ratings
    19. 8.19 Typical Characteristics
      1. 8.19.1 Audio ADC Performance
      2. 8.19.2 Audio DAC Performance
      3. 8.19.3 Class-D Driver Performance
      4. 8.19.4 MICBIAS Performance
  9. 9 Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1  Digital Pins
      2. 10.3.2  Analog Pins
      3. 10.3.3  Multifunction Pins
      4. 10.3.4  Analog Audio I/O
        1. 10.3.4.1  Analog Low Power Bypass
        2. 10.3.4.2  ADC Bypass Using Mixer Amplifiers
        3. 10.3.4.3  Headphone Outputs
        4. 10.3.4.4  Using the Headphone Amplifier
        5. 10.3.4.5  Ground-Centered Headphone Amplifier Configuration
        6. 10.3.4.6  Circuit Topology
        7. 10.3.4.7  Charge Pump Set-Up and Operation
        8. 10.3.4.8  Output Power Optimization
        9. 10.3.4.9  Offset Correction and Start-Up
        10. 10.3.4.10 Ground-Centered Headphone Setup
          1. 10.3.4.10.1 High Audio Output Power, High Performance Setup
          2. 10.3.4.10.2 High Audio Output Power, Low Power Consumption Setup
          3. 10.3.4.10.3 Medium Audio Output Power, High Performance Setup
          4. 10.3.4.10.4 Lowest Power Consumption, Medium Audio Output Power Setup
        11. 10.3.4.11 Stereo Unipolar Configuration
          1. 10.3.4.11.1 Circuit Topology
          2. 10.3.4.11.2 Unipolar Turn-On Transient (Pop) Reduction
        12. 10.3.4.12 Mono Differential DAC to Mono Differential Headphone Output
        13. 10.3.4.13 Stereo Line Outputs
        14. 10.3.4.14 Line Out Amplifier Configurations
        15. 10.3.4.15 Differential Receiver Output
        16. 10.3.4.16 Stereo Class-D Speaker Outputs
      5. 10.3.5  ADC / Digital Microphone Interface
        1. 10.3.5.1 ADC Processing Blocks - Overview
          1. 10.3.5.1.1 ADC Processing Blocks
      6. 10.3.6  DAC
        1. 10.3.6.1 DAC Processing Blocks — Overview
          1. 10.3.6.1.1 DAC Processing Blocks
      7. 10.3.7  Powertune
      8. 10.3.8  Clock Generation and PLL
      9. 10.3.9  Interfaces
        1. 10.3.9.1 Control Interfaces
          1. 10.3.9.1.1 I2C Control
          2. 10.3.9.1.2 SPI Control
        2. 10.3.9.2 Digital Audio Interfaces
        3. 10.3.9.3 miniDSP
          1. 10.3.9.3.1 miniDSP
          2. 10.3.9.3.2 Software
        4. 10.3.9.4 Asynchronous Sample Rate Conversion (ASRC)
      10. 10.3.10 Device Special Functions
      11. 10.3.11 Device Power Consumption
      12. 10.3.12 Powertune
      13. 10.3.13 Clock Generation and PLL
      14. 10.3.14 Interfaces
        1. 10.3.14.1 Control Interfaces
        2. 10.3.14.2 I2C Control
        3. 10.3.14.3 SPI Control
        4. 10.3.14.4 Digital Audio Interfaces
      15. 10.3.15 miniDSP
      16. 10.3.16 Device Special Functions
    4. 10.4 Device Functional Modes
      1. 10.4.1 Recording Mode
      2. 10.4.2 Playback Mode
      3. 10.4.3 Analog Low Power Bypass Modes
    5. 10.5 Register Maps
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
      2. 11.2.2 Detailed Design Procedure
        1. 11.2.2.1 Charge Pump Flying and Holding Capacitor
        2. 11.2.2.2 Reference Filtering Capacitor
        3. 11.2.2.3 MICBIAS
      3. 11.2.3 Application Curves
  12. 12Power Supply Recommendations
    1. 12.1 Device Power Consumption
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Examples
  14. 14Device and Documentation Support
    1. 14.1 Documentation Support
      1. 14.1.1 Related Documentation
    2. 14.2 Community Resources
    3. 14.3 Trademarks
    4. 14.4 Electrostatic Discharge Caution
    5. 14.5 Glossary
  15. 15Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

5 Description (continued)

The TLV320AIC3262 features two fully-programmable miniDSP cores that support application-specific algorithms in the record and/or the playback path of the device. The miniDSP cores are fully software programmable. Targeted miniDSP algorithms, such as noise suppression or advanced DSP filtering, are loaded into the device after power-up.

Combined with the advanced PowerTune technology, the device can execute operations from 8-kHz mono voice playback to stereo 192-kHz DAC playback, making it ideal for portable battery-powered audio and telephony applications.

The record path of the TLV320AIC3262 covers operations from 8-kHz mono to 192-kHz stereo recording, and contains programmable input channel configurations which cover single-ended and differential set-ups, as well as floating or mixing input signals. It also provides a digitally-controlled stereo microphone preamplifier and integrated microphone bias. One application of the digital signal processing blocks is removable of audible noise that may be introduced by mechanical coupling, for example optical zooming in a digital camera. The record path can also be configured as a stereo digital microphone Pulse Density Modulation (PDM) interface typically used at 64 Fs or 128 Fs.

The playback path offers signal processing blocks for filtering and effects; headphone, line, receiver, and Class-D speaker outputs; flexible mixing of DAC; and analog input signals as well as programmable volume controls. The playback path contains two high-power DirectPathTM headphone output drivers which eliminate the need for AC coupling capacitors. A built-in charge pump generates the negative supply for the ground centered headphone drivers. These headphone output drivers can be configured in multiple ways, including stereo, and mono BTL. In addition, playback audio can be routed to integrated stereo Class-D speaker drivers or a differential receiver amplifier.

The integrated PowerTune technology allows the device to be tuned to just the right power-performance trade-off. Mobile applications frequently have multiple use cases requiring very low-power operation while being used in a mobile environment. When used in a docked environment power consumption typically is less of a concern while lowest possible noise is important. With PowerTune the TLV320AIC3262 can address both cases.

The required internal clock of the TLV320AIC3262 can be derived from multiple sources, including the MCLK1 pin, the MCLK2 pin, the BCLK1 pin, the BCLK2 pin, several general purpose I/O pins or the output of the internal PLL, where the input to the PLL again can be derived from similar pins. Although using the internal fractional PLL ensures the availability of a suitable clock signal, TI does not recommend for the lowest power settings. The PLL is highly programmable and can accept available input clocks in the range of 512 kHz to 50 MHz. To enable even lower clock frequencies, an integrated low-frequency clock multiplier can also be used as an input to the PLL.

The TLV320AIC3262 has a 12-bit SAR ADC converter that supports system voltage measurements. These system voltage measurements can be sourced from three dedicated analog inputs (IN1L/AUX1, IN1R/AUX2, or VBAT pins), or, alternatively, an on-chip temperature sensor that can be read by the SAR ADC.

The TLV320AIC3262 also features three full Digital Audio Serial Interfaces, each supporting I2S, DSP/TDM, RJF, LJF, and mono PCM formats. This enables three simultaneous digital playback and record paths to three independent digital audio buses or chips. Additionally, the general purpose interrupt pins can be used to connect to a fourth digital audio bus, allowing the end system to easily switch in this fourth audio bus to one of the three Digital Audio Serial Interfaces.

The device is available in the 4.81 mm x 4.81 mm x 0.625 mm 81-Ball WCSP (YZF) package.