Quality & reliability


Material content search

Details for "OPA353UA/2K5"

Choose a download method for component information:

Or

Current Product Information

TI part number Lead/ball finish MSL / reflow ratings Assembly site Package | pins Package body size (mm) Total device mass (mg) *
OPA353UA/2K5 CU NIPDAU Level-2-260C-1 YEAR TI MALAYSIA A/T D | 8 3.91x4.9x1.58 84.700000

*Total device mass (mg)
The summary mass is a rounded value and will be within approximately +/- 10% of the detailed mass value.

Environmental Ratings Information

RoHS status REACH status Green status IEC 62474 DB
Y Y Y Y

Component Information

  Homogeneous Material Level Component Level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Other Nonferrous Metals and Alloys Calcium 7440-70-2 0.000002 0.002000 20 0.000002 0
Other Nonferrous Metals and Alloys Copper 7440-50-8 0.000150 0.150000 1500 0.000180 2
Precious Metals Gold 7440-57-5 0.098997 98.997990 989980 0.116867 1169
Precious Metals Palladium 7440-05-3 0.000850 0.850010 8500 0.001000 10
Sub-Total     0.099999 100 1000000 0.118050 1180
Die Attach Adhesive
Precious Metals Silver 7440-22-4 0.185342 80.000173 800002 0.218798 2188
Thermoplastics Epoxy 85954-11-6 0.046335 19.999827 199998 0.054699 547
Sub-Total     0.231677 100 1000000 0.273497 2735
Lead Frame
Copper and Its Alloys Copper 7440-50-8 24.255090 97.410000 974100 28.633410 286334
Copper and Its Alloys Iron 7439-89-6 0.597600 2.400000 24000 0.705500 7055
Copper and Its Alloys Phosphorus 7723-14-0 0.007470 0.030000 300 0.008820 88
Other Nonferrous Metals and Alloys Lead 7439-92-1 0.007470 0.030000 300 0.008820 88
Other Nonferrous Metals and Alloys Tin 7440-31-5 0.007470 0.030000 300 0.008820 88
Zinc and Its Alloys Zinc 7440-66-6 0.024900 0.100000 1000 0.029400 294
Sub-Total     24.900000 100 1000000 29.394730 293947
Lead Frame Plating
Nickel and Its Alloys Nickel 7440-02-0 0.355273 95.119946 951199 0.419404 4194
Precious Metals Gold 7440-57-5 0.002913 0.779920 7799 0.003439 34
Precious Metals Palladium 7440-05-3 0.015314 4.100134 41001 0.018078 181
Sub-Total     0.373500 100 1000000 0.440921 4409
Mold Compound
Other Inorganic Materials Fused Silica 60676-86-0 51.344151 88.000000 880000 60.612357 606124
Other Plastics and Rubber Carbon Black 1333-86-4 0.175037 0.300000 3000 0.206633 2066
Other Plastics and Rubber Organic Phosphorus 1330-78-5 0.320901 0.550000 5500 0.378827 3788
Thermoplastics Epoxy 85954-11-6 6.505537 11.149999 111500 7.679861 76799
Sub-Total     58.345626 100 1000000 68.877679 688777
Semiconductor Device
Ceramics / Glass Doped Silicon 7440-21-3 0.758246 100.000000 1000000 0.895118 8951
Sub-Total     0.758246 100 1000000 0.895118 8951

Total

    84.709048     100 1000000

Important Information/Disclaimer

TI bases its material content information on information provided by third-party suppliers and has taken, and continues to take, reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers may consider certain information to be proprietary, and thus certain information may not be available for release by TI. The material content information is provided by TI "as is."
For additional information, please contactTI customer support