SBOS547A June   2011  – August 2015 INA226

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Basic ADC Functions
        1. 7.3.1.1 Power Calculation
        2. 7.3.1.2 Alert Pin
    4. 7.4 Device Functional Modes
      1. 7.4.1 Averaging and Conversion Time Considerations
      2. 7.4.2 Filtering and Input Considerations
    5. 7.5 Programming
      1. 7.5.1 Programming the Calibration Register
      2. 7.5.2 Programming the Power Measurement Engine
        1. 7.5.2.1 Calibration Register and Scaling
      3. 7.5.3 Simple Current Shunt Monitor Usage (No Programming Necessary)
      4. 7.5.4 Default Settings
      5. 7.5.5 Bus Overview
        1. 7.5.5.1 Serial Bus Address
        2. 7.5.5.2 Serial Interface
        3. 7.5.5.3 Writing to and Reading from the INA226
          1. 7.5.5.3.1 High-Speed I2C Mode
        4. 7.5.5.4 SMBus Alert Response
    6. 7.6 Register Maps
      1. 7.6.1  Configuration Register (00h) (Read/Write)
      2. 7.6.2  Shunt Voltage Register (01h) (Read-Only)
      3. 7.6.3  Bus Voltage Register (02h) (Read-Only)
      4. 7.6.4  Power Register (03h) (Read-Only)
      5. 7.6.5  Current Register (04h) (Read-Only)
      6. 7.6.6  Calibration Register (05h) (Read/Write)
      7. 7.6.7  Mask/Enable Register (06h) (Read/Write)
      8. 7.6.8  Alert Limit Register (07h) (Read/Write)
      9. 7.6.9  Manufacturer ID Register (FEh) (Read-Only)
      10. 7.6.10 Die ID Register (FFh) (Read-Only)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 High-Side Sensing Circuit Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

11 Device and Documentation Support

11.1 Device Support

11.1.1 Development Support

  • INA226EVM Evaluation Board and Software Tutorial (SBOU113)

11.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.3 Trademarks

E2E is a trademark of Texas Instruments.

I2C is a trademark of NXP Semiconductors.

All other trademarks are the property of their respective owners.

11.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.