TIBPAL20L8-20M

アクティブ

高性能 Impact PAL 回路

製品詳細

Supply voltage (min) (V) 4.75 Supply voltage (max) (V) 5.25 Clock frequency (max) (MHz) 40 Supply current (max) (µA) 100000 Rating Military Operating temperature range (°C) -55 to 125
Supply voltage (min) (V) 4.75 Supply voltage (max) (V) 5.25 Clock frequency (max) (MHz) 40 Supply current (max) (µA) 100000 Rating Military Operating temperature range (°C) -55 to 125
CDIP (JT) 24 221.44 mm² 32 x 6.92 LCCC (FD) 28 130.6449 mm² 11.43 x 11.43 LCCC (FK) 28 130.6449 mm² 11.43 x 11.43
  • High-Performance: fmax (w/o feedback)
    • TIBPAL20R’ -15C Series . . . 45 MHz
    • TIBPAL20R’ -20M Series . . . 41.6 MHz
  • High-Performance . . . 45 MHz Min
  • Reduced ICC of 180 mA Max
  • Functionally Equivalent, but Faster Than
    PAL20L8, PAL20R4, PAL20R6, PAL20R8
  • Power-Up Clear on Registered Devices (All Register Outputs are
    Set Low, but Voltage Levels at the Output Pins Go High)
  • Preload Capability on Output Registers Simplifies Testing
  • Package Options Include Both Plastic and Ceramic Chip Carriers
    in Addition to Plastic and Ceramic DIPs

IMPACT is a trademark of Texas Instruments Incorporated.
PAL is a registered trademark of Advanced Micro Devices Inc.

  • High-Performance: fmax (w/o feedback)
    • TIBPAL20R’ -15C Series . . . 45 MHz
    • TIBPAL20R’ -20M Series . . . 41.6 MHz
  • High-Performance . . . 45 MHz Min
  • Reduced ICC of 180 mA Max
  • Functionally Equivalent, but Faster Than
    PAL20L8, PAL20R4, PAL20R6, PAL20R8
  • Power-Up Clear on Registered Devices (All Register Outputs are
    Set Low, but Voltage Levels at the Output Pins Go High)
  • Preload Capability on Output Registers Simplifies Testing
  • Package Options Include Both Plastic and Ceramic Chip Carriers
    in Addition to Plastic and Ceramic DIPs

IMPACT is a trademark of Texas Instruments Incorporated.
PAL is a registered trademark of Advanced Micro Devices Inc.

These programmable array logic devices feature high speed and functional equivalency when compared with currently available devices. These IMPACT™ circuits combine the latest Advanced Low-Power Schottky technology with proven titanium-tungsten fuses to provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allows for quick design of custom functions and typically results in a more compact circuit board. In addition, chip carriers are available for futher reduction in board space.

Extra circuitry has been provided to allow loading of each register asynchronously to either a high or low state. This feature simplifies testing because the registers can be set to an initial state prior to executing the test sequence.

The TIBPAL20’ C series is characterized from 0°C to 75°C. The TIBPAL20’ M series is characterized for operation over the full military temperature range of ’55°C to 125°C.

These programmable array logic devices feature high speed and functional equivalency when compared with currently available devices. These IMPACT™ circuits combine the latest Advanced Low-Power Schottky technology with proven titanium-tungsten fuses to provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allows for quick design of custom functions and typically results in a more compact circuit board. In addition, chip carriers are available for futher reduction in board space.

Extra circuitry has been provided to allow loading of each register asynchronously to either a high or low state. This feature simplifies testing because the registers can be set to an initial state prior to executing the test sequence.

The TIBPAL20’ C series is characterized from 0°C to 75°C. The TIBPAL20’ M series is characterized for operation over the full military temperature range of ’55°C to 125°C.

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種類 タイトル 最新の英語版をダウンロード 日付
* データシート HighPerformance Impact Programmable Array Logic Circuits データシート (Rev. A) 2011年 1月 5日

設計と開発

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パッケージ ピン数 ダウンロード
CDIP (JT) 24 オプションの表示
LCCC (FD) 28 オプションの表示
LCCC (FK) 28 オプションの表示

購入と品質

記載されている情報:
  • RoHS
  • REACH
  • デバイスのマーキング
  • リード端子の仕上げ / ボールの原材料
  • MSL 定格 / ピーク リフロー
  • MTBF/FIT 推定値
  • 材質成分
  • 認定試験結果
  • 継続的な信頼性モニタ試験結果
記載されている情報:
  • ファブの拠点
  • 組み立てを実施した拠点

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