DLPS025E August   2012  – August 2018 DLP9500

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Simplified Schematic
  4. Revision History
  5. Description (continued)
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  Storage Conditions
    3. 7.3  ESD Ratings
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Thermal Information
    6. 7.6  Electrical Characteristics
    7. 7.7  LVDS Timing Requirements
    8. 7.8  LVDS Waveform Requirements
    9. 7.9  Serial Control Bus Timing Requirements
    10. 7.10 Systems Mounting Interface Loads
    11. 7.11 Micromirror Array Physical Characteristics
    12. 7.12 Micromirror Array Optical Characteristics
    13. 7.13 Window Characteristics
    14. 7.14 Chipset Component Usage Specification
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 DLPC410 - Digital Controller for DLP Discovery 4100 Chipset
      2. 8.3.2 DLPA200 - DMD Micromirror Drivers
      3. 8.3.3 DLPR410 - PROM for DLP Discovery 4100 Chipset
      4. 8.3.4 DLP9500 - DLP 0.95 1080p 2xLVDS Type-A DMD 1080p DMD
        1. 8.3.4.1 DLP9500 1080p Chipset Interfaces
          1. 8.3.4.1.1 DLPC410 Interface Description
            1. 8.3.4.1.1.1 DLPC410 IO
            2. 8.3.4.1.1.2 Initialization
            3. 8.3.4.1.1.3 DMD Device Detection
            4. 8.3.4.1.1.4 Power Down
          2. 8.3.4.1.2 DLPC410 to DMD Interface
            1. 8.3.4.1.2.1 DLPC410 to DMD IO Description
            2. 8.3.4.1.2.2 Data Flow
          3. 8.3.4.1.3 DLPC410 to DLPA200 Interface
            1. 8.3.4.1.3.1 DLPA200 Operation
            2. 8.3.4.1.3.2 DLPC410 to DLPA200 IO Description
          4. 8.3.4.1.4 DLPA200 to DLP9500 Interface
            1. 8.3.4.1.4.1 DLPA200 to DLP9500 Interface Overview
      5. 8.3.5 Measurement Conditions
    4. 8.4 Device Functional Modes
      1. 8.4.1 Single Block Mode
      2. 8.4.2 Dual Block Mode
      3. 8.4.3 Quad Block Mode
      4. 8.4.4 Global Block Mode
    5. 8.5 Window Characteristics and Optics
      1. 8.5.1 Optical Interface and System Image Quality
      2. 8.5.2 Numerical Aperture and Stray Light Control
      3. 8.5.3 Pupil Match
      4. 8.5.4 Illumination Overfill
    6. 8.6 Micromirror Array Temperature Calculation
      1. 8.6.1 Thermal Test Points
      2. 8.6.2 Micromirror Array Temperature Calculation - Lumens Based
      3. 8.6.3 Micromirror Array Temperature Calculation - Power Density Based
    7. 8.7 Micromirror Landed-On and Landed-Off Duty Cycle
      1. 8.7.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 8.7.2 Landed Duty Cycle and Useful Life of the DMD
      3. 8.7.3 Landed Duty Cycle and Operational DMD Temperature
      4. 8.7.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Device Description
      2. 9.2.2 Detailed Design Procedure
  10. 10Power Supply Recommendations
    1. 10.1 Power-Up Sequence (Handled by the DLPC410)
    2. 10.2 DMD Power-Up and Power-Down Procedures
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Impedance Requirements
      2. 11.1.2 PCB Signal Routing
      3. 11.1.3 Fiducials
      4. 11.1.4 PCB Layout Guidelines
        1. 11.1.4.1 DMD Interface
          1. 11.1.4.1.1 Trace Length Matching
        2. 11.1.4.2 DLP9500 Decoupling
          1. 11.1.4.2.1 Decoupling Capacitors
        3. 11.1.4.3 VCC and VCC2
        4. 11.1.4.4 DMD Layout
        5. 11.1.4.5 DLPA200
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Device Nomenclature
      2. 12.1.2 Device Marking
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Links
    4. 12.4 Receiving Notification of Documentation Updates
    5. 12.5 Community Resources
    6. 12.6 Trademarks
    7. 12.7 Electrostatic Discharge Caution
    8. 12.8 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Features

  • 0.95-Inch Diagonal Micromirror Array
    • 1920 × 1080 Array of Aluminum, Micrometer-Sized Mirrors (1080p Resolution)
    • 10.8-µm Micromirror Pitch
    • ±12° Micromirror Tilt Angle (Relative to Flat State)
    • Designed for Corner Illumination
  • Designed for Use with Visible Light
    (400 to 700 nm):
    • Window Transmission 96% (Single Pass, Through Two Window Surfaces)
    • Micromirror Reflectivity 89%
    • Array Diffraction Efficiency 87%
    • Array Fill Factor 94%
  • Four 16-Bit, Low-Voltage Differential Signaling (LVDS), Double Data Rate (DDR) Input Data Buses
  • Up to 400-MHz Input Data Clock Rate
  • 42.2-mm × 42.2-mm × 7-mm Package Footprint
  • Hermetic Package