SNVSBA9B May   2019  – November 2020 LMR34215-Q1

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 System Characteristics
    8. 7.8 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power-Good Flag Output
      2. 8.3.2 Enable and Start-up
      3. 8.3.3 Current Limit and Short Circuit
      4. 8.3.4 Undervoltage Lockout and Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Auto Mode
      2. 8.4.2 Forced PWM Operation
      3. 8.4.3 Dropout
      4. 8.4.4 Minimum Switch On-Time
      5. 8.4.5 Spread Spectrum Operation
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Ground and Thermal Considerations
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Features

  • AEC-Q100-qualified for automotive applications:
    • Temperature grade 1: –40°C to +125°C, TA
  • Functional Safety-Capable
  • Designed for automotive applications
    • Junction temperature range –40°C to +150°C
    • 0.4-V dropout with 1.5-A load (typical)
    • ±1.5% reference voltage tolerance
    • 5-V fixed-output, adjustable output voltage options
  • Suited for scalable power supplies
  • Integration reduces solution size and cost
    • Small, 2-mm × 3-mm VQFN package with wettable flanks
    • Few external components
  • Low power dissipation across load spectrum
    • 93% efficiency at 400 kHz (12 VIN, 5 VOUT, 1 A)
    • Increased light load efficiency in PFM
    • Low operating quiescent current of 24 µA
  • Optmized for ultra low EMI requirements
    • Meets CISPR25 class 5 standard
    • Hotrod™ package minimizes switch node ringing
    • Parallel input path minimizes parasitic inductance
    • Spread spectrum reduces peak emissions