SBOS813 August   2016 OPA857-DIE

PRODUCTION DATA.  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Electrostatic Discharge Caution
  5. 5Bare Die Information

Package Options

Mechanical Data (Package|Pins)
  • TD|0
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Internal Midscale Reference Voltage
  • Pseudo-Differential Output Voltage
  • Wide Dynamic Range
  • Closed-Loop Transimpedance Bandwidth:
    • 125 MHz (5-kΩ Transimpedance Gain, 1.5-pF External Parasitic Capacitance)
    • 105 MHz (20-kΩ Transimpedance Gain, 1.5-pF External Parasitic Capacitance)
  • Ultralow Input-Referred Current Noise (Brickwall Filter BW = 135 MHz):
    • 15 nARMS (20-kΩ Transimpedance)
  • Very Fast Overload Recovery Time: < 25 ns
  • Internal Input Protection Diode
  • Power Supply:
    • Voltage: 2.7 V to 3.6 V
    • Current: 23.4 mA
  • Extended Temperature Range: –40°C to +85°C

2 Applications

  • Photodiode Monitoring
  • High-Speed I/V Conversions
  • Optical Amplifiers
  • CAT-Scanner Front-Ends

3 Description

The OPA857-DIE is a wideband, fast overdrive recovery, fast-settling, ultralow-noise transimpedance amplifier targeted at photodiode monitoring applications. With selectable feedback resistance, the OPA857-DIE simplifies the design of high-performance optical systems. Very fast overload recovery time and internal input protection provide the best combination to protect the remainder of the signal chain from overdrive while minimizing recovery time. The two selectable transimpedance gain configurations allow high dynamic range and flexibility required in modern transimpedance amplifier applications.

The device is characterized for operation over the full industrial temperature range from –40°C to +85°C.

Ordering Information(1)

PRODUCT PACKAGE
DESIGNATOR		 PACKAGE ORDERABLE PART NUMBER PACKAGE QUANTITY
OPA857-DIE TD Bare die in gel pak VR(2) OPA857TD1 324
OPA857TD2 10
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com.
(2) Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum.