1 Abstract

This application note describes a methodology to predict the thermal response of the TPIC7218-Q1 in a realistic ABS environment. The methodology presented provides system and hardware engineers a clear and insightful method to analyze a system that adequately cools the TPIC7218-Q1 before PCBs are manufactured. Ideas are presented that explain how to convert electrical behavior during an ABS event into a format useful for thermal analysis. The resulting power profile, in conjunction with the system hardware profile are then used estimate junction temperatures. Finally, junction and PCB temperature data provide a view into a system’s likely thermal performance.