SNAS519H July   2011  – August 2015 ADC12D1000RF , ADC12D1600RF

PRODUCTION DATA.  

  1. Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. Revision History
  3. Pin Configuration and Functions
    1. 3.1 Pin Attributes
  4. Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  ESD Ratings
    3. 4.3  Recommended Operating Conditions
    4. 4.4  Thermal Information
    5. 4.5  Electrical Characteristics: Static Converter
    6. 4.6  Electrical Characteristics: Dynamic Converter
    7. 4.7  Electrical Characteristics: Analog Input/Output and Reference
    8. 4.8  Electrical Characteristics: I-Channel to Q-Channel
    9. 4.9  Electrical Characteristics: Sampling Clock
    10. 4.10 Electrical Characteristics: AutoSync Feature
    11. 4.11 Electrical Characteristics: Digital Control and Output Pin
    12. 4.12 Electrical Characteristics: Power Supply
    13. 4.13 Electrical Characteristics: AC
    14. 4.14 Timing Requirements: Serial Port Interface
    15. 4.15 Timing Requirements: Calibration
    16. 4.16 Typical Characteristics
  5. Detailed Description
    1. 5.1 Overview
    2. 5.2 Functional Block Diagram
    3. 5.3 Feature Description
      1. 5.3.1 Input Control and Adjust
        1. 5.3.1.1 AC- and DC-coupled Mode
        2. 5.3.1.2 Input Full-Scale Range Adjust
        3. 5.3.1.3 Input Offset Adjust
        4. 5.3.1.4 DES Timing Adjust
        5. 5.3.1.5 Sampling Clock Phase Adjust
      2. 5.3.2 Output Control and Adjust
        1. 5.3.2.1 SDR / DDR Clock
        2. 5.3.2.2 LVDS Output Differential Voltage
        3. 5.3.2.3 LVDS Output Common-Mode Voltage
        4. 5.3.2.4 Output Formatting
        5. 5.3.2.5 Test Pattern Mode
        6. 5.3.2.6 Time Stamp
      3. 5.3.3 Calibration Feature
        1. 5.3.3.1 Calibration Control Pins and Bits
        2. 5.3.3.2 How to Execute a Calibration
        3. 5.3.3.3 Power-on Calibration
        4. 5.3.3.4 On-Command Calibration
        5. 5.3.3.5 Calibration Adjust
        6. 5.3.3.6 Read/Write Calibration Settings
        7. 5.3.3.7 Calibration and Power Down
        8. 5.3.3.8 Calibration and the Digital Outputs
      4. 5.3.4 Power Down
    4. 5.4 Device Functional Modes
      1. 5.4.1 DES and Non-DES Mode
      2. 5.4.2 Demux and Non-Demux Mode
    5. 5.5 Programming
      1. 5.5.1 Control Modes
        1. 5.5.1.1 Non-Extended Control Mode
          1. 5.5.1.1.1  Dual Edge Sampling Pin (DES)
          2. 5.5.1.1.2  Non-Demultiplexed Mode Pin (NDM)
          3. 5.5.1.1.3  Dual Data Rate Phase Pin (DDRPh)
          4. 5.5.1.1.4  Calibration Pin (CAL)
          5. 5.5.1.1.5  Calibration Delay Pin (CalDly)
          6. 5.5.1.1.6  Power-Down I-channel Pin (PDI)
          7. 5.5.1.1.7  Power-Down Q-channel Pin (PDQ)
          8. 5.5.1.1.8  Test Pattern Mode Pin (TPM)
          9. 5.5.1.1.9  Full-Scale Input Range Pin (FSR)
          10. 5.5.1.1.10 AC- and DC-Coupled Mode Pin (VCMO)
          11. 5.5.1.1.11 LVDS Output Common-mode Pin (VBG)
        2. 5.5.1.2 Extended Control Mode
          1. 5.5.1.2.1 The Serial Interface
    6. 5.6 Register Maps
  6. Application and Implementation
    1. 6.1 Application Information
      1. 6.1.1 The Analog Inputs
        1. 6.1.1.1 Acquiring the Input
        2. 6.1.1.2 Driving the ADC in DES Mode
        3. 6.1.1.3 FSR and the Reference Voltage
        4. 6.1.1.4 Out-Of-Range Indication
        5. 6.1.1.5 Maximum Input Range
        6. 6.1.1.6 AC-Coupled Input Signals
        7. 6.1.1.7 DC-Coupled Input Signals
        8. 6.1.1.8 Single-Ended Input Signals
      2. 6.1.2 The Clock Inputs
        1. 6.1.2.1 CLK Coupling
        2. 6.1.2.2 CLK Frequency
        3. 6.1.2.3 CLK Level
        4. 6.1.2.4 CLK Duty Cycle
        5. 6.1.2.5 CLK Jitter
        6. 6.1.2.6 CLK Layout
      3. 6.1.3 The LVDS Outputs
        1. 6.1.3.1 Common-Mode and Differential Voltage
        2. 6.1.3.2 Output Data Rate
        3. 6.1.3.3 Terminating Unused LVDS Output Pins
      4. 6.1.4 Synchronizing Multiple ADC12D1x00RFS in a System
        1. 6.1.4.1 AutoSync Feature
        2. 6.1.4.2 DCLK Reset Feature
      5. 6.1.5 Recommended System Chips
        1. 6.1.5.1 Temperature Sensor
        2. 6.1.5.2 Clocking Device
        3. 6.1.5.3 Amplifiers for the Analog Input
        4. 6.1.5.4 Balun Recommendations for Analog Input
    2. 6.2 Typical Application
      1. 6.2.1 Design Requirements
      2. 6.2.2 Detailed Design Procedure
      3. 6.2.3 Application Curves
  7. Power Supply Recommendations
    1. 7.1 System Power-on Considerations
      1. 7.1.1 Power-on, Configuration, and Calibration
      2. 7.1.2 Power-on and Data Clock (DCLK)
    2. 7.2 Supply Voltage
  8. Layout
    1. 8.1 Layout Guidelines
      1. 8.1.1 Power Planes
      2. 8.1.2 Bypass Capacitors
      3. 8.1.3 Ground Planes
      4. 8.1.4 Power System Example
    2. 8.2 Layout Example
    3. 8.3 Thermal Management
  9. Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
      2. 9.1.2 Device Nomenclature
        1. 9.1.2.1 Specification Definitions
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Related Links
    4. 9.4 Community Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

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5 Detailed Description

5.1 Overview

The ADC12D1x00RF device is a versatile A/D converter with an innovative architecture which permits very high-speed operation. The controls available ease the application of the device to circuit solutions. Optimum performance requires adherence to the provisions discussed here and in Application Information. This section covers an overview, a description of control modes (Extended Control Mode and Non-Extended Control Mode), and features.

The ADC12D1x00RF uses a calibrated folding and interpolating architecture that achieves a high Effective Number of Bits (ENOB). The use of folding amplifiers greatly reduces the number of comparators and power consumption. Interpolation reduces the number of front-end amplifiers required, minimizing the load on the input signal and further reducing power requirements. In addition to correcting other non-idealities, ON-chip calibration reduces the INL bow often seen with folding architectures. The result is an extremely fast, high performance, low power converter.

The analog input signal (which is within the converter's input voltage range) is digitized to twelve bits at speeds of 150/150 MSPS to 3.2/2.0 GSPS, typical. Differential input voltages below negative full-scale will cause the output word to consist of all zeroes. Differential input voltages above positive full-scale will cause the output word to consist of all ones. Either of these conditions at the I- or Q-input will cause the Out-of-Range I-channel or Q-channel output (ORI or ORQ), respectively, to output a logic-high signal.

In ECM, an expanded feature set is available through the Serial Interface. The ADC12D1x00RF builds upon previous architectures, introducing a new DES Mode timing adjust feature, AutoSync feature for multi-chip synchronization and increasing to 15-bit for gain and 12-bit plus sign for offset the independent programmable adjustment for each channel.

Each channel has a selectable output demultiplexer which feeds two LVDS buses. If the 1:2 Demux Mode is selected, the output data rate is reduced to half the input sample rate on each bus. When Non-Demux Mode is selected, the output data rate on each channel is at the same rate as the input sample clock and only one 12-bit bus per channel is active.

5.2 Functional Block Diagram

ADC12D1000RF ADC12D1600RF 30164411.png

5.3 Feature Description

The ADC12D1x00RF offers many features to make the device convenient to use in a wide variety of applications. Table 5-1 is a summary of the features available, as well as details for the control mode chosen. "N/A" means "Not Applicable."

Table 5-1 Features and Modes

FEATURE NON-ECM CONTROL PIN
ACTIVE IN ECM
ECM DEFAULT ECM STATE
INPUT CONTROL AND ADJUST
AC/DC-coupled Mode Selection Selected through VCMO
(Pin C2)
Yes Not available N/A
Input Full-scale Range Adjust Selected through FSR
(Pin Y3)
No Selected through the Config Reg
(Addr: 3h and Bh)
Mid FSR value
Input Offset Adjust Setting Not available N/A Selected through the Config Reg
(Addr: 2h and Ah)
Offset = 0 mV
DES / Non-DES Mode Selection Selected through DES
(Pin V5)
No Selected through the DES Bit
(Addr: 0h; Bit: 7)
Non-DES Mode
DES Mode Input Selection Not available N/A Selected through the DEQ, DIQ Bits
(Addr: 0h; Bits: 6:5)
N/A
DESCLKIQ Mode Not available N/A Selected through the DCK Bit
(Addr: Eh; Bit: 6)
N/A
DES Timing Adjust Not available N/A Selected through the DES Timing Adjust Reg
(Addr: 7h)
Mid skew offset
Sampling Clock Phase Adjust Not available N/A Selected through the Config Reg
(Addr: Ch and Dh)
tAD adjust disabled
OUTPUT CONTROL AND ADJUST
DDR Clock Phase Selection Selected through DDRPh (Pin W4) No Selected through the DPS Bit
(Addr: 0h; Bit: 14)
0° Mode
DDR / SDR DCLK Selection Not available N/A Selected through the SDR Bit
(Addr: 0h; Bit: 2)
DDR Mode
SDR Rising / Falling DCLK Selection Not available N/A Selected through the DPS Bit
(Addr: 0h; Bit: 14)
N/A
LVDS Differential Voltage Amplitude Selection Higher amplitude only N/A Selected through the OVS Bit
(Addr: 0h; Bit: 13)
Higher amplitude
LVDS Common-Mode Voltage Amplitude Selection Selected through VBG
(Pin B1)
Yes Not available N/A
Output Formatting Selection Offset Binary only N/A Selected through the 2SC Bit
(Addr: 0h; Bit: 4)
Offset Binary
Test Pattern Mode at Output Selected through TPM
(Pin A4)
No Selected through the TPM Bit
(Addr: 0h; Bit: 12)
TPM disabled
Demux/Non-Demux Mode Selection Selected through NDM
(Pin A5)
Yes Not available N/A
AutoSync Not available N/A Selected through the Config Reg
(Addr: Eh)
Master Mode,
RCOut1/2 disabled
DCLK Reset Not available N/A Selected through the Config Reg
(Addr: Eh; Bit: 0)
DCLK Reset disabled
Time Stamp Not available N/A Selected through the TSE Bit
(Addr: 0h; Bit: 3)
Time Stamp disabled
CALIBRATION
On-command Calibration Selected through CAL
(Pin D6)
Yes Selected through the CAL Bit
(Addr: 0h; Bit: 15)
N/A
(CAL = 0)
Power-on Calibration Delay Selection Selected through CalDly
(Pin V4)
Yes Not available N/A
Calibration Adjust Not available N/A Selected through the Config Reg
(Addr: 4h)
tCAL
Read/Write Calibration Settings Not available N/A Selected through the SSC Bit
(Addr: 4h; Bit: 7)
R/W calibration values disabled
POWER DOWN
Power-down I-channel Selected through PDI
(Pin U3)
Yes Selected through the PDI Bit
(Addr: 0h; Bit: 11)
I-channel operational
Power-down Q-channel Selected through PDQ
(Pin V3)
Yes Selected through the PDQ Bit
(Addr: 0h; Bit: 10)
Q-channel operational

5.3.1 Input Control and Adjust

There are several features and configurations for the input of the ADC12D1x00RF so that it may be used in many different applications. This section covers AC/DC-coupled Mode, input full-scale range adjust, input offset adjust, DES/Non-DES Mode, and sampling clock phase adjust.

5.3.1.1 AC- and DC-coupled Mode

The analog inputs may be AC- or DC-coupled. See AC/DC-Coupled Mode Pin (VCMO) for information on how to select the desired mode and DC-coupled Input Signals and AC-coupled Input Signals for applications information.

5.3.1.2 Input Full-Scale Range Adjust

The input full-scale range for the ADC12D1x00RF may be adjusted through Non-ECM or ECM. In Non-ECM, a control pin selects a higher or lower value; see Full-Scale Input Range Pin (FSR). In ECM, the input full-scale range may be adjusted with 15-bits of precision. See VIN_FSR in Electrical Characteristics: Analog Input/Output and Reference for electrical specification details. The higher and lower full-scale input range settings in Non-ECM correspond to the mid and min full-scale input range settings in ECM. It is necessary to execute an on-command calibration following a change of the input full-scale range. See Memory for information about the registers.

5.3.1.3 Input Offset Adjust

The input offset adjust for the ADC12D1x00RF may be adjusted with 12-bits of precision plus sign through ECM. See Memory for information about the registers.

5.3.1.4 DES Timing Adjust

The performance of the ADC12D1x00RF in DES Mode depends on how well the two channels are interleaved, that is, that the clock samples either channel with precisely a 50% duty-cycle, each channel has the same offset (nominally code 2047/2048), and each channel has the same full-scale range. The ADC12D1x00RF includes an automatic clock phase background adjustment in DES Mode to automatically and continuously adjust the clock phase of the I- and Q-channels. In addition to this, the residual fixed timing skew offset may be further manually adjusted, and further reduce timing spurs for specific applications. See the DES Timing Adjust (Addr: 7h). As the DES Timing Adjust is programmed from 0d to 127d, the magnitude of the Fs/2-Fin timing interleaving spur will decrease to a local minimum and then increase again. The default, nominal setting of 64d may or may not coincide with this local minimum. The user may manually skew the global timing to achieve the lowest possible timing interleaving spur.

5.3.1.5 Sampling Clock Phase Adjust

The sampling clock (CLK) phase may be delayed internally to the ADC up to 825 ps in ECM. This feature is intended to help the system designer remove small imbalances in clock distribution traces at the board level when multiple ADCs are used, or to simplify complex system functions such as beam steering for phase array antennas.

Additional delay in the clock path also creates additional jitter when using the sampling clock phase adjust. Because the sampling clock phase adjust delays all clocks, including the DCLKs and output data, the user is strongly advised to use the minimal amount of adjustment and verify the net benefit of this feature in his system before relying on it.

5.3.2 Output Control and Adjust

There are several features and configurations for the output of the ADC12D1x00RF so that it may be used in many different applications. This section covers DDR clock phase, LVDS output differential and common-mode voltage, output formatting, Demux/Non-demux Mode, Test Pattern Mode, and Time Stamp.

5.3.2.1 SDR / DDR Clock

The ADC12D1x00RF output data can be delivered in Double Data Rate (DDR) or Single Data Rate (SDR). For DDR, the DCLK frequency is half the data rate and data is sent to the outputs on both edges of DCLK; see Figure 5-1. The DCLK-to-Data phase relationship may be either 0° or 90°. For 0° Mode, the Data transitions on each edge of the DCLK. Any offset from this timing is tOSK; see Electrical Characteristics: AC for details. For 90° Mode, the DCLK transitions in the middle of each Data cell. Setup and hold times for this transition, tSU and tH, may also be found in Electrical Characteristics: AC. The DCLK-to-Data phase relationship may be selected through the DDRPh Pin in Non-ECM (see Dual Data Rate Phase Pin (DDRPh)) or the DPS bit in the Configuration Register (Addr: 0h; Bit: 14) in ECM.

ADC12D1000RF ADC12D1600RF 30164494.gifFigure 5-1 DDR DCLK-to-Data Phase Relationship

For SDR, the DCLK frequency is the same as the data rate and data is sent to the outputs on a single edge of DCLK; see SDR DCLK-to-Data Phase Relationship. The Data may transition on either the rising or falling edge of DCLK. Any offset from this timing is tOSK; see Electrical Characteristics: AC for details. The DCLK rising / falling edge may be selected through the SDR bit in the Configuration Register (Addr: 0h; Bit: 2) in ECM only.

ADC12D1000RF ADC12D1600RF 30164415.gifFigure 5-2 SDR DCLK-to-Data Phase Relationship

5.3.2.2 LVDS Output Differential Voltage

The ADC12D1x00RF is available with a selectable higher or lower LVDS output differential voltage. This parameter is VOD and may be found in Electrical Characteristics: Digital Control and Output Pin. The desired voltage may be selected through the OVS Bit (Addr: 0h, Bit 13). For many applications, in which the LVDS outputs are very close to an FPGA on the same board, for example, the lower setting is sufficient for good performance; this will also reduce the possibility for EMI from the LVDS outputs to other signals on the board. See Memory for more information.

5.3.2.3 LVDS Output Common-Mode Voltage

The ADC12D1x00RF is available with a selectable higher or lower LVDS output common-mode voltage. This parameter is VOS and may be found in Electrical Characteristics: Digital Control and Output Pin. See LVDS Output Common-mode Pin (VBG) for information on how to select the desired voltage.

5.3.2.4 Output Formatting

The formatting at the digital data outputs may be either offset binary or two's complement. The default formatting is offset binary, but two's complement may be selected through the 2SC Bit (Addr: 0h, Bit 4); see Memory for more information.

5.3.2.5 Test Pattern Mode

The ADC12D1x00RF can provide a test pattern at the four output buses independently of the input signal to aid in system debug. In Test Pattern Mode, the ADC is disengaged and a test pattern generator is connected to the outputs, including ORI and ORQ. The test pattern output is the same in DES Mode or Non-DES Mode. Each port is given a unique 12-bit word, alternating between 1's and 0's. When the part is programmed into the Demux Mode, the test pattern’s order is described in Table 5-2. If the I- or Q-channel is powered down, the test pattern will not be output for that channel.

Table 5-2 Test Pattern by Output Port in Demux Mode

TIME Qd Id Q I ORQ ORI COMMENTS
T0 000h 004h 008h 010h 0b 0b Pattern Sequence
n
T1 FFFh FFBh FF7h FEFh 1b 1b
T2 000h 004h 008h 010h 0b 0b
T3 FFFh FFBh FF7h FEFh 1b 1b
T4 000h 004h 008h 010h 0b 0b
T5 000h 004h 008h 010h 0b 0b Pattern Sequence
n+1
T6 FFFh FFBh FF7h FEFh 1b 1b
T7 000h 004h 008h 010h 0b 0b
T8 FFFh FFBh FF7h FEFh 1b 1b
T9 000h 004h 008h 010h 0b 0b
T10 000h 004h 008h 010h 0b 0b Pattern Sequence
n+2
T11 FFFh FFBh FF7h FEFh 1b 1b
T12 000h 004h 008h 010h 0b 0b
T13 ... ... ... ... ... ...

When the part is programmed into the Non-Demux Mode, the test pattern’s order is described in Table 5-3.

Table 5-3 Test Pattern by Output Port in Non-Demux Mode

TIME Q I ORQ ORI COMMENTS
T0 000h 004h 0b 0b Pattern Sequence
n
T1 000h 004h 0b 0b
T2 FFFh FFBh 1b 1b
T3 FFFh FFBh 1b 1b
T4 000h 004h 0b 0b
T5 FFFh FFBh 1b 1b
T6 000h 004h 0b 0b
T7 FFFh FFBh 1b 1b
T8 FFFh FFBh 1b 1b
T9 FFFh FFBh 1b 1b
T10 000h 004h 0b 0b Pattern Sequence
n+1
T11 000h 004h 0b 0b
T12 FFFh FFBh 1b 1b
T13 FFFh FFBh 1b 1b
T14 ... ... ... ...

5.3.2.6 Time Stamp

The Time Stamp feature enables the user to capture the timing of an external trigger event, relative to the sampled signal. When enabled through the TSE Bit (Addr: 0h; Bit: 3), the LSB of the digital outputs (DQd, DQ, DId, DI) captures the trigger information. In effect, the 12-bit converter becomes an 11-bit converter and the LSB acts as a 1-bit converter with the same latency as the 11-bit converter. The trigger should be applied to the DCLK_RST input. It may be asynchronous to the ADC sampling clock.

5.3.3 Calibration Feature

The ADC12D1x00RF calibration must be run to achieve specified performance. The calibration procedure is exactly the same regardless of how it was initiated or when it is run. Calibration trims the analog input differential termination resistors, the CLK input resistor, and sets internal bias currents which affect the linearity of the converter. This minimizes full-scale error, offset error, DNL, and INL, which results in the maximum dynamic performance, as measured by: SNR, THD, SINAD (SNDR) and ENOB.

5.3.3.1 Calibration Control Pins and Bits

Table 5-4 is a summary of the pins and bits used for calibration. See Ball Descriptions and Equivalent Circuits for complete pin information and Figure 4-6 for the timing diagram.

Table 5-4 Calibration Pins

PIN (BIT) NAME FUNCTION
D6
(Addr: 0h; Bit 15)
CAL
(Calibration)
Initiate calibration
V4 CalDly
(Calibration Delay)
Select power-on calibration delay
(Addr: 4h) Calibration Adjust Adjust calibration sequence
B5 CalRun
(Calibration Running)
Indicates while calibration is running
C1/D2 Rtrim+/-
(Input termination trim resistor)
External resistor used to calibrate analog and CLK inputs
C3/D3 Rext+/-
(External Reference resistor)
External resistor used to calibrate internal linearity

5.3.3.2 How to Execute a Calibration

Calibration may be initiated by holding the CAL pin low for at least tCAL_L clock cycles, and then holding it high for at least another tCAL_H clock cycles, as defined in Electrical Characteristics: Calibration. The minimum tCAL_L and tCAL_H input clock cycle sequences are required to ensure that random noise does not cause a calibration to begin when it is not desired. The time taken by the calibration procedure is specified as tCAL. The CAL Pin is active in both ECM and Non-ECM. However, in ECM, the CAL Pin is logically OR'd with the CAL Bit, so both the pin and bit are required to be set low before executing another calibration through either pin or bit.

5.3.3.3 Power-on Calibration

For standard operation, power-on calibration begins after a time delay following the application of power, as determined by the setting of the CalDly Pin and measured by tCalDly (see Electrical Characteristics: Calibration). This delay allows the power supply to come up and stabilize before the power-on calibration takes place. The best setting (short or long) of the CalDly Pin depends upon the settling time of the power supply.

TI strongly recommends setting CalDly Pin (to either logic-high or logic-low) before powering the device on because this pin affects the power-on calibration timing. This may be accomplished by setting CalDly through an external 1-kΩ resistor connected to GND or VA. If the CalDly Pin is toggled while the device is powered-on, it can execute a calibration even though the CAL Pin/Bit remains logic-low.

The power-on calibration will be not be performed if the CAL pin is logic-high at power-on. In this case, the calibration cycle will not begin until the on-command calibration conditions are met. The ADC12D1x00RF will function with the CAL pin held high at power up, but no calibration will be done and performance will be impaired.

If it is necessary to toggle the CalDly Pin before the system power-up sequence, then the CAL Pin/Bit must be set to logic-high during the toggling and afterwards for 109 Sampling Clock cycles. This will prevent the power-on calibration, so an on-command calibration must be executed or the performance will be impaired.

5.3.3.4 On-Command Calibration

In addition to the power-on calibration, TI recommends executing an on-command calibration whenever the settings or conditions to the device are altered significantly, to obtain optimal parametric performance. Some examples include: changing the FSR through either ECM or Non-ECM, power-cycling either channel, and switching into or out of DES Mode. For best performance, TI also recommends that an on-command calibration be run 20 seconds or more after application of power and whenever the operating temperature changes significantly, relative to the specific system performance requirements.

Due to the nature of the calibration feature, TI recommends avoiding unnecessary activities on the device while the calibration is taking place. For example, do not read or write to the Serial Interface or use the DCLK Reset feature while calibrating the ADC. Doing so will impair the performance of the device until it is re-calibrated correctly. Also, TI recommends not applying a strong narrow-band signal to the analog inputs during calibration because this may impair the accuracy of the calibration; broad spectrum noise is acceptable.

5.3.3.5 Calibration Adjust

The sequence of the calibration event itself may be adjusted. This feature can be used if a shorter calibration time than the default is required; see tCAL in Electrical Characteristics: Calibration. However, the performance of the device, when using this feature is not ensured.

The calibration sequence may be adjusted through CSS (Addr: 4h, Bit 14). The default setting of CSS = 1b executes both RIN and RIN_CLK Calibration (using Rtrim) and internal linearity Calibration (using Rext). Executing a calibration with CSS = 0b executes only the internal linearity Calibration. The first time that Calibration is executed, it must be with CSS = 1b to trim RIN and RIN_CLK. However, once the device is at its operating temperature and RIN has been trimmed at least one time, it will not drift significantly. To save time in subsequent calibrations, trimming RIN and RIN_CLK may be skipped, that is, by setting CSS = 0b.

5.3.3.6 Read/Write Calibration Settings

When the ADC performs a calibration, the calibration constants are stored in an array which is accessible through the Calibration Values register (Addr: 5h). To save the time which it takes to execute a calibration, tCAL, or to allow re-use of a previous calibration result, these values can be read from and written to the register at a later time. For example, if an application requires the same input impedance, RIN, this feature can be used to load a previously determined set of values. For the calibration values to be valid, the ADC must be operating under the same conditions, including temperature, at which the calibration values were originally determined by the ADC.

To read calibration values from the SPI, do the following:

1. Set ADC to desired operating conditions.

2. Set SSC (Addr: 4h, Bit 7) to 1.

3. Read exactly 240 times the Calibration Values register (Addr: 5h). The register values are R0, R1, R2... R239 where R0 is a dummy value. The contents of R<239:1> should be stored.

4. Set SSC (Addr: 4h, Bit 7) to 0.

5. Continue with normal operation.

To write calibration values to the SPI, do the following:

1. Set ADC to operating conditions at which Calibration Values were previously read.

2. Set SSC (Addr: 4h, Bit 7) to 1.

3. Write exactly 239 times the Calibration Values register (Addr: 5h). The registers should be written with stored register values R1, R2... R239.

4. Make two additional dummy writes of 0000h.

5. Set SSC (Addr: 4h, Bit 7) to 0.

6. Continue with normal operation.

5.3.3.7 Calibration and Power Down

If PDI and PDQ are simultaneously asserted during a calibration cycle, the ADC12D1x00RF will immediately power down. The calibration cycle will continue when either or both channels are powered back up, but the calibration will be compromised due to the incomplete settling of bias currents directly after power up. Therefore, a new calibration should be executed upon powering the ADC12D1x00RF back up. In general, the ADC12D1x00RF should be recalibrated when either or both channels are powered back up, or after one channel is powered down. For best results, this should be done after the device has stabilized to its operating temperature.

5.3.3.8 Calibration and the Digital Outputs

During calibration, the digital outputs (including DI, DId, DQ, DQd, and OR) are set logic-low, to reduce noise. The DCLK runs continuously during calibration. After the calibration is completed and the CalRun signal is logic-low, it takes an additional 60 Sampling Clock cycles before the output of the ADC12D1x00RF is valid converted data from the analog inputs. This is the time it takes for the pipeline to flush, as well as for other internal processes.

5.3.4 Power Down

On the ADC12D1x00RF, the I- and Q-channels may be powered down individually. This may be accomplished through the control pins, PDI and PDQ, or through ECM. In ECM, the PDI and PDQ pins are logically OR'd with the Control Register setting. See Power-Down I-channel Pin (PDI) andPower-Down Q-channel Pin (PDQ) for more information.

5.4 Device Functional Modes

5.4.1 DES and Non-DES Mode

The ADC12D1x00RF can operate in Dual-Edge Sampling (DES) or Non-DES Mode. The DES Mode allows for a single analog input to be sampled by both I- and Q-channels. One channel samples the input on the rising edge of the sampling clock and the other samples the same input signal on the falling edge of the sampling clock. A single input is thus sampled twice per clock cycle, resulting in an overall sample rate of twice the sampling clock frequency, for example, 3.2/2.0 GSPS with a 1600/1000 MHz sampling clock. Because DES Mode uses both I- and Q-channels to process the input signal, both channels must be powered up for the DES Mode to function properly.

In Non-ECM, only the I-input may be used for the DES Mode input. See Dual Edge Sampling Pin (DES) for information on how to select the DES Mode. In ECM, either the I- or Q-input may be selected by first using the DES bit (Addr: 0h, Bit 7) to select the DES Mode. The DEQ Bit (Addr: 0h, Bit: 6) is used to select the Q-input, but the I-input is used by default. Also, both I- and Q-inputs may be driven externally, that is, DESIQ Mode, by using the DIQ bit (Addr: 0h, Bit 5). See The Analog Inputs for more information about how to drive the ADC in DES Mode.

In DESCLKIQ Mode, the I- and Q-channels sample their inputs 180° out-of-phase with respect to one another, similar to the other DES Modes. DESCLKIQ Mode is similar to the DESIQ Mode, except that the I- and Q-channels remain electrically separate internal to the ADC12D1x00RF. For this reason, both I- and Q-inputs must be externally driven for the DESCLKIQ Mode. The DCK Bit (Addr: Eh, Bit: 6) is used to select the 180° sampling clock mode.

The DESCLKIQ Mode results in the best bandwidth for the interleaved modes. In general, the bandwidth decreases from Non-DES Mode to DES Mode (specifically, DESI or DESQ) because both channels are sampling off the same input signal and non-ideal effects introduced by interleaving the two channels lower the bandwidth. Driving both I- and Q-channels externally (DESIQ Mode and DESCLKIQ Mode) results in better bandwidth because each channel is being driven, which reduces routing losses. The DESCLKIQ Mode has better bandwidth than the DESIQ Mode because the routing internal to the ADC12D1600/1000 is simpler, which results in less insertion loss.

In the DES Mode, the outputs must be carefully interleaved to reconstruct the sampled signal. If the device is programmed into the 1:4 Demux DES Mode, the data is effectively demultiplexed by 1:4. If the sampling clock is 1600/1000 MHz, the effective sampling rate is doubled to 3.2/2.0 GSPS and each of the 4 output buses has an output rate of 800/500 MSPS. All data is available in parallel. To properly reconstruct the sampled waveform, the four bytes of parallel data that are output with each DCLK must be correctly interleaved. The sampling order is as follows, from the earliest to the latest: DQd, DId, DQ, DI. See Figure 4-3. If the device is programmed into the Non-Demux DES Mode, two bytes of parallel data are output with each edge of the DCLK in the following sampling order, from the earliest to the latest: DQ, DI. See Figure 4-4.

5.4.2 Demux and Non-Demux Mode

The ADC12D1x00RF may be in one of two demultiplex modes: Demux Mode or Non-Demux Mode (also sometimes referred to as 1:1 Demux Mode). In Non-Demux Mode, the data from the input is simply output at the sampling rate on one 12-bit bus. In Demux Mode, the data from the input is output at half the sampling rate, on twice the number of buses. Demux and Non-Demux Mode may only be selected by the NDM pin. In Non-DES Mode, the output data from each channel may be demultiplexed by a factor of 1:2 (1:2 Demux Non-DES Mode) or not demultiplexed (Non-Demux Non-DES Mode). In DES Mode, the output data from both channels interleaved may be demultiplexed (1:4 Demux DES Mode) or not demultiplexed (Non-Demux DES Mode).

See Table 5-5 for a selection of available modes.

Table 5-5 Supported Demux, Data Rate Modes

NON-DEMUX MODE 1:2 DEMUX MODE
DDR 0° Mode only 0° Mode / 90° Mode
SDR Not available Rising / Falling Mode

5.5 Programming

5.5.1 Control Modes

The ADC12D1x00RF may be operated in one of two control modes: Non-extended Control Mode (Non-ECM) or Extended Control Mode (ECM). In the simpler Non-ECM (also sometimes referred to as Pin Control Mode), the user affects available configuration and control of the device through the control pins. The ECM provides additional configuration and control options through a serial interface and a set of 16 registers, most of which are available to the customer.

5.5.1.1 Non-Extended Control Mode

In Non-extended Control Mode (Non-ECM), the Serial Interface is not active and all available functions are controlled through various pin settings. Non-ECM is selected by setting the ECE Pin to logic-high. For the control pins, "logic-high" and "logic-low" refer to VA and GND, respectively. Nine dedicated control pins provide a wide range of control for the ADC12D1x00RF and facilitate its operation. These control pins provide DES Mode selection, Demux Mode selection, DDR Phase selection, execute Calibration, Calibration Delay setting, Power-down I-channel, Power-down Q-channel, Test Pattern Mode selection, and Full-Scale Input Range selection. In addition to this, two dual-purpose control pins provide for AC/DC-coupled Mode selection and LVDS output common-mode voltage selection. See Table 5-6 for a summary.

Table 5-6 Non-ECM Pin Summary

PIN NAME LOGIC-LOW LOGIC-HIGH FLOATING
DEDICATED CONTROL PINS
DES Non-DES Mode DES
Mode
Not valid
NDM Demux
Mode
Non-Demux Mode Not valid
DDRPh 0° Mode / Falling Mode 90° Mode / Rising Mode Not valid
CAL See Calibration Pin (CAL) Not valid
CalDly Shorter delay Longer delay Not valid
PDI I-channel active Power Down
I-channel
Power Down
I-channel
PDQ Q-channel active Power Down
Q-channel
Power Down
Q-channel
TPM Non-Test Pattern Mode Test Pattern Mode Not valid
FSR Lower FS input Range Higher FS input Range Not valid
DUAL-PURPOSE CONTROL PINS
VCMO AC-coupled operation Not allowed DC-coupled operation
VBG Not allowed Higher LVDS common-mode voltage Lower LVDS common-mode voltage

5.5.1.1.1 Dual Edge Sampling Pin (DES)

The Dual Edge Sampling (DES) Pin selects whether the ADC12D1x00RF is in DES Mode (logic-high) or Non-DES Mode (logic-low). DES Mode means that a single analog input is sampled by both I- and Q-channels in a time-interleaved manner. One of the ADCs samples the input signal on the rising sampling clock edge (duty cycle corrected); the other ADC samples the input signal on the falling sampling clock edge (duty cycle corrected). In Non-ECM, only the I-input may be used for DES Mode, a.k.a. DESI Mode. In ECM, the Q-input may be selected through the DEQ Bit (Addr: 0h, Bit: 6), a.k.a. DESQ Mode. In ECM, both the I- and Q-inputs may be selected, a.k.a. DESIQ or DESCLKIQ Mode.

To use this feature in ECM, use the DES bit in the Configuration Register (Addr: 0h; Bit: 7). See DES/Non-DES Mode for more information.

5.5.1.1.2 Non-Demultiplexed Mode Pin (NDM)

The Non-Demultiplexed Mode (NDM) Pin selects whether the ADC12D1x00RF is in Demux Mode (logic-low) or Non-Demux Mode (logic-high). In Non-Demux Mode, the data from the input is produced at the sampled rate at a single 12-bit output bus. In Demux Mode, the data from the input is produced at half the sampled rate at twice the number of output buses. For Non-DES Mode, each I- or Q-channel will produce its data on one or two buses for Non-Demux or Demux Mode, respectively. For DES Mode, the selected channel will produce its data on two or four buses for Non-Demux or Demux Mode, respectively.

This feature is pin-controlled only and remains active during both Non-ECM and ECM. See Demux/Non-demux Mode for more information.

5.5.1.1.3 Dual Data Rate Phase Pin (DDRPh)

The Dual Data Rate Phase (DDRPh) Pin selects whether the ADC12D1x00RF is in 0° Mode (logic-low) or 90° Mode (logic-high) for DDR Mode. If the device is in SDR Mode, then the DDRPh Pin selects whether the ADC12D1x00RF is in Falling Mode (logic-low) or Rising Mode (logic-high). For DDR Mode, the Data may transition either with the DCLK transition (0° Mode) or halfway between DCLK transitions (90° Mode). The DDRPh Pin selects the mode for both the I-channel: DI- and DId-to-DCLKI phase relationship and for the Q-channel: DQ- and DQd-to-DCLKQ phase relationship.

To use this feature in ECM, use the DPS bit in the Configuration Register (Addr: 0h; Bit: 14). See SDR / DDR Clock for more information.

5.5.1.1.4 Calibration Pin (CAL)

The Calibration (CAL) Pin may be used to execute an on-command calibration or to disable the power-on calibration. The effect of calibration is to maximize the dynamic performance. To initiate an on-command calibration through the CAL pin, bring the CAL pin high for a minimum of tCAL_H input clock cycles after it has been low for a minimum of tCAL_L input clock cycles. Holding the CAL pin high upon power on will prevent execution of the power-on calibration. In ECM, this pin remains active and is logically OR'd with the CAL bit.

To use this feature in ECM, use the CAL bit in the Configuration Register (Addr: 0h; Bit: 15). See Calibration Feature for more information.

5.5.1.1.5 Calibration Delay Pin (CalDly)

The Calibration Delay (CalDly) Pin selects whether a shorter or longer delay time is present, after the application of power, until the start of the power-on calibration. The actual delay time is specified as tCalDly and may be found in Electrical Characteristics: Calibration. This feature is pin-controlled only and remains active in ECM. TI recommends selecting the desired delay time before power-on and not dynamically alter this selection.

See Calibration Feature for more information.

5.5.1.1.6 Power-Down I-channel Pin (PDI)

The Power-down I-channel (PDI) Pin selects whether the I-channel is powered down (logic-high) or active (logic-low). The digital data output pins, DI and DId, (both positive and negative) are put into a high impedance state when the I-channel is powered down. Upon return to the active state, the pipeline will contain meaningless information and must be flushed. The supply currents (typicals and limits) are available for the I-channel powered down or active and may be found in Electrical Characteristics: Power Supply. The device should be recalibrated following a power-cycle of PDI (or PDQ).

This pin remains active in ECM. In ECM, either this pin or the PDI bit (Addr: 0h; Bit: 11) in the Control Register may be used to power down the I-channel. See Power Down for more information.

5.5.1.1.7 Power-Down Q-channel Pin (PDQ)

The Power-down Q-channel (PDQ) Pin selects whether the Q-channel is powered down (logic-high) or active (logic-low). This pin functions similarly to the PDI pin, except that it applies to the Q-channel. The PDI and PDQ pins function independently of each other to control whether each I- or Q-channel is powered down or active.

This pin remains active in ECM. In ECM, either this pin or the PDQ bit (Addr: 0h; Bit: 10) in the Control Register may be used to power down the Q-channel. See Power Down for more information.

5.5.1.1.8 Test Pattern Mode Pin (TPM)

The Test Pattern Mode (TPM) Pin selects whether the output of the ADC12D1x00RF is a test pattern (logic-high) or the converted analog input (logic-low). The ADC12D1x00RF can provide a test pattern at the four output buses independently of the input signal to aid in system debug. In TPM, the ADC is disengaged and a test pattern generator is connected to the outputs, including ORI and ORQ. SeeTest Pattern Mode for more information.

5.5.1.1.9 Full-Scale Input Range Pin (FSR)

The Full-Scale Input Range (FSR) Pin selects whether the full-scale input range for both the I- and Q-channel is higher (logic-high) or lower (logic-low). The input full-scale range is specified as VIN_FSR in Electrical Characteristics: Analog Input/Output and Reference. In Non-ECM, the full-scale input range for each I- and Q-channel may not be set independently, but it is possible to do so in ECM. The device must be calibrated following a change in FSR to obtain optimal performance.

To use this feature in ECM, use the Configuration Registers (Addr: 3h and Bh). See Input Control and Adjust for more information.

5.5.1.1.10 AC- and DC-Coupled Mode Pin (VCMO)

The VCMO Pin serves a dual purpose. When functioning as an output, it provides the optimal common-mode voltage for the DC-coupled analog inputs. When functioning as an input, it selects whether the device is AC-coupled (logic-low) or DC-coupled (floating). This pin is always active, in both ECM and Non-ECM.

5.5.1.1.11 LVDS Output Common-mode Pin (VBG)

The VBG Pin serves a dual purpose. When functioning as an output, it provides the bandgap reference. When functioning as an input, it selects whether the LVDS output common-mode voltage is higher (logic-high) or lower (floating). The LVDS output common-mode voltage is specified as VOS and may be found in Electrical Characteristics: Digital Control and Output Pin. This pin is always active, in both ECM and Non-ECM.

5.5.1.2 Extended Control Mode

In Extended Control Mode (ECM), most functions are controlled through the Serial Interface. In addition to this, several of the control pins remain active. See Table 5-1 for details. ECM is selected by setting the ECE Pin to logic-low. If the ECE Pin is set to logic-high (Non-ECM), then the registers are reset to their default values. So, a simple way to reset the registers is by toggling the ECE pin. Four pins on the ADC12D1x00RF control the Serial Interface: SCS, SCLK, SDI and SDO. This section covers the Serial Interface. The Register Definitions are located at the end of the data sheet so that they are easy to find, see Memory.

5.5.1.2.1 The Serial Interface

The ADC12D1x00RF offers a Serial Interface that allows access to the sixteen control registers within the device. The Serial Interface is a generic 4-wire (optionally 3-wire) synchronous interface that is compatible with SPI type interfaces that are used on many micro-controllers and DSP controllers. Each serial interface access cycle is exactly 24 bits long. A register-read or register-write can be accomplished in one cycle. The signals are defined in such a way that the user can opt to simply join SDI and SDO signals in his system to accomplish a single, bidirectional SDI/O signal. A summary of the pins for this interface may be found in Table 5-7. See Figure 4-7 for the timing diagram and Electrical Characteristics: Serial Port Interface for timing specification details. Control register contents are retained when the device is put into power-down mode. If this feature is unused, the SCLK, SDI, and SCS pins may be left floating because they each have an internal pullup.

Table 5-7 Serial Interface Pins

PIN NAME
C4 SCS (Serial Chip Select bar)
C5 SCLK (Serial Clock)
B4 SDI (Serial Data In)
A3 SDO (Serial Data Out)

SCS: Each assertion (logic-low) of this signal starts a new register access, that is, the SDI command field must be ready on the following SCLK rising edge. The user is required to deassert this signal after the 24th clock. If the SCS is deasserted before the 24th clock, no data read/write will occur. For a read operation, if the SCS is asserted longer than 24 clocks, the SDO output will hold the D0 bit until SCS is deasserted. For a write operation, if the SCS is asserted longer than 24 clocks, data write will occur normally through the SDI input upon the 24th clock. Setup and hold times, tSCS and tHCS, with respect to the SCLK must be observed. SCS must be toggled in between register access cycles.

SCLK: This signal is used to register the input data (SDI) on the rising edge; and to source the output data (SDO) on the falling edge. The user may disable the clock and hold it at logic-low. There is no minimum frequency requirement for SCLK; see fSCLK in Electrical Characteristics: Serial Port Interface for more details.

SDI: Each register access requires a specific 24-bit pattern at this input, consisting of a command field and a data field. If the SDI and SDO wires are shared (3-wire mode), then during read operations, it is necessary to tri-state the master which is driving SDI while the data field is being output by the ADC on SDO. The master must be tri-stated before the falling edge of the 8th clock. If SDI and SDO are not shared (4-wire mode), then this is not necessary. Setup and hold times, tSH and tSSU, with respect to the SCLK must be observed.

SDO: This output is normally tri-stated and is driven only when SCS is asserted, the first 8 bits of command data have been received and it is a READ operation. The data is shifted out, MSB first, starting with the 8th clock's falling edge. At the end of the access, when SCS is deasserted, this output is tri-stated once again. If an invalid address is accessed, the data sourced will consist of all zeroes. If it is a read operation, there will be a bus turnaround time, tBSU, from when the last bit of the command field was read in until the first bit of the data field is written out.

Table 5-8 shows the Serial Interface bit definitions.

Table 5-8 Command and Data Field Definitions

BIT NO. NAME COMMENTS
1 Read/Write (R/W) 1b indicates a read operation
0b indicates a write operation
2-3 Reserved Bits must be set to 10b
4-7 A<3:0> 16 registers may be addressed. The order is MSB first
8 X This is a "don't care" bit
9-24 D<15:0> Data written to or read from addressed register

The serial data protocol is shown for a read and write operation in Figure 5-3 and Figure 5-4, respectively.

ADC12D1000RF ADC12D1600RF 30164492.gifFigure 5-3 Serial Data Protocol - Read Operation
ADC12D1000RF ADC12D1600RF 30164493.gifFigure 5-4 Serial Data Protocol - Write Operation

5.6 Register Maps

Eleven read/write registers provide several control and configuration options in the Extended Control Mode. These registers have no effect when the device is in the Non-extended Control Mode. Each register description below also shows the Power-On Reset (POR) state of each control bit. See Table 5-9 for a summary.

Table 5-9 Register Addresses

A3 A2 A1 A0 HEX REGISTER ADDRESSED
0 0 0 0 0h Configuration Register 1
0 0 0 1 1h Reserved
0 0 1 0 2h I-channel Offset Adjust
0 0 1 1 3h I-channel Full-Scale Range Adjust
0 1 0 0 4h Calibration Adjust
0 1 0 1 5h Calibration Values
0 1 1 0 6h Reserved
0 1 1 1 7h DES Timing Adjust
1 0 0 0 8h Reserved
1 0 0 1 9h Reserved
1 0 1 0 Ah Q-channel Offset Adjust
1 0 1 1 Bh Q-channel Full-Scale Range Adjust
1 1 0 0 Ch Aperture Delay Coarse Adjust
1 1 0 1 Dh Aperture Delay Fine Adjust
1 1 1 0 Eh AutoSync
1 1 1 1 Fh Reserved

Table 5-10 Configuration Register 1

Addr: 0h (0000b) POR state: 2000h
Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Name CAL DPS OVS TPM PDI PDQ Res LFS DES DEQ DIQ 2SC TSE SDR Res
POR 0 0 1 0 0 0 0 0 0 0 0 0 0 0 0 0
Bit 15 CAL: Calibration Enable. When this bit is set to 1b, an on-command calibration is initiated. This bit is not reset automatically upon completion of the calibration. Therefore, the user must reset this bit to 0b and then set it to 1b again to execute another calibration. This bit is logically OR'd with the CAL Pin; both bit and pin must be set to 0b before either is used to execute a calibration.
Bit 14 DPS: DCLK Phase Select. In DDR, set this bit to 0b to select the 0° Mode DDR Data-to-DCLK phase relationship and to 1b to select the 90° Mode. In SDR, set this bit to 0b to transition the data on the Rising edge of DCLK; set this bit to 1b to transition the data on the Falling edge of DCLK. (2)
Bit 13 OVS: Output Voltage Select. This bit sets the differential voltage level for the LVDS outputs including Data, OR, and DCLK. 0b selects the lower level and 1b selects the higher level. See VOD in Electrical Characteristics: Digital Control and Output Pin for details.
Bit 12 TPM: Test Pattern Mode. When this bit is set to 1b, the device will continually output a fixed digital pattern at the digital Data and OR outputs. When set to 0b, the device will continually output the converted signal, which was present at the analog inputs. See Test Pattern Mode for details about the TPM pattern.
Bit 11 PDI: Power-down I-channel. When this bit is set to 0b, the I-channel is fully operational; when it is set to 1b, the I-channel is powered-down. The I-channel may be powered-down through this bit or the PDI Pin, which is active, even in ECM.
Bit 10 PDQ: Power-down Q-channel. When this bit is set to 0b, the Q-channel is fully operational; when it is set to 1b, the Q-channel is powered down. The Q-channel may be powered down through this bit or the PDQ Pin, which is active, even in ECM.
Bit 9 Reserved. Must be set as shown.
Bit 8 LFS: Low-Frequency Select. If the sampling clock (CLK) is at or below 300 MHz, set this bit to 1b for improved performance.
Bit 7 DES: Dual-Edge Sampling Mode select. When this bit is set to 0b, the device will operate in the Non-DES Mode; when it is set to 1b, the device will operate in the DES Mode. See DES/Non-DES Mode for more information.
Bit 6 DEQ: DES Q-input select, a.k.a. DESQ Mode. When the device is in DES Mode, this bit selects the input that the device will operate on. The default setting of 0b selects the I-input and 1b selects the Q-input.
Bit 5 DIQ: DES I- and Q-input, a.k.a. DESIQ Mode. When in DES Mode, setting this bit to 1b shorts the I- and Q-inputs internally to the device. If the bit is left at its default 0b, the I- and Q-inputs remain electrically separate. In this mode, both the I- and Q-inputs must be externally driven; see DES/Non-DES Mode for more information.(1)
The allowed DES Modes settings are shown below. For DESCLKIQ Mode, see Addr Eh.
Mode Addr 0h, Bit<7:5> Addr Eh, Bit<6>
Non-DES Mode 000b 0b
DESI Mode 100b 0b
DESQ Mode 110b 0b
DESIQ Mode 101b 0b
DESCLKIQ Mode 000b 1b
Bit 4 2SC: Two's Complement output. For the default setting of 0b, the data is output in Offset Binary format; when set to 1b, the data is output in Two's Complement format.(2)
Bit 3 TSE: Time Stamp Enable. For the default setting of 0b, the Time Stamp feature is not enabled; when set to 1b, the feature is enabled. See Output Control and Adjust for more information about this feature.
Bit 2 SDR: Single Data Rate. For the default setting of 0b, the data is clocked in Dual Data Rate; when set to 1b, the data is clocked in Single Data Rate. See Output Control and Adjust for more information about this feature. See Table 5-5 for a selection of available modes.
Bits 1:0 Reserved. Must be set as shown.
(1) This feature functionality is not tested in production test; performance is tested in the specified/default mode only.
(2) This pin and bit functionality is not tested in production test; performance is tested in the specified and default mode only.

Table 5-11 Reserved

Addr: 1h (0001b) POR state: 2907h
Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Name Res
POR 0 0 1 0 1 0 0 1 0 0 0 0 0 1 1 1
Bits 15:0 Reserved. Must be set as shown.

Table 5-12 I-channel Offset Adjust

Addr: 2h (0010b) POR state: 0000h
Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Name Res OS OM(11:0)
POR 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
Bits 15:13 Reserved. Must be set to 0b.
Bit 12 OS: Offset Sign. The default setting of 0b incurs a positive offset of a magnitude set by Bits 11:0 to the ADC output. Setting this bet to 1b incurs a negative offset of the set magnitude.
Bits 11:0 OM(11:0): Offset Magnitude. These bits determine the magnitude of the offset set at the ADC output (straight binary coding). The range is from 0 mV for OM(11:0) = 0d to 45 mV for OM(11:0) = 4095d in steps of approximately 11 µV. Monotonicity is specified by design only for the 9 MSBs.
Code Offset [mV]
0000 0000 0000 (default) 0
1000 0000 0000 22.5
1111 1111 1111 45

Table 5-13 I-channel Full Scale Range Adjust

Addr: 3h (0011b) POR state: 4000h
Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Name Res FM(14:0)
POR 0 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0
Bit 15 Reserved. Must be set to 0b.
Bits 14:0 FM(14:0): FSR Magnitude. These bits increase the ADC full-scale range magnitude (straight binary coding.) The range is from 600 mV (0d) to 1000 mV (32767d) with the default setting at 800 mV (16384d). Monotonicity is specified by design only for the 9 MSBs. The mid-range (low) setting in ECM corresponds to the nominal (low) setting in Non-ECM. A greater range of FSR values is available in ECM, that is, FSR values greater than 800 mV. See VIN_FSR in Electrical Characteristics: Analog Input/Output and Reference for characterization details.
Code FSR [mV]
000 0000 0000 0000 600
100 0000 0000 0000 (default) 800
111 1111 1111 1111 1000

Table 5-14 Calibration Adjust

Addr: 4h (0100b) POR state: DB4Bh
Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Name Res CSS Res SSC Res
POR 1 1 0 1 1 0 1 1 0 1 0 0 1 0 1 1
Bit 15 Reserved. Must be set as shown.
Bit 14 CSS: Calibration Sequence Select. The default 1b selects the following calibration sequence: reset all previously calibrated elements to nominal values, do RIN Calibration, do internal linearity Calibration. Setting CSS = 0b selects the following calibration sequence: do not reset RIN to its nominal value, skip RIN calibration, do internal linearity Calibration. The calibration must be completed at least one time with CSS = 1b to calibrate RIN. Subsequent calibrations may be run with CSS = 0b (skip RIN calibration) or 1b (full RIN and internal linearity Calibration).
Bits 13:8 Reserved. Must be set as shown.
Bit 7 SSC: SPI Scan Control. Setting this control bit to 1b allows the calibration values, stored in Addr: 5h, to be read/written. When not reading/writing the calibration values, this control bit should left at its default 0b setting. See Calibration Feature for more information.
Bits 6:0 Reserved. Must be set as shown.

Table 5-15 Calibration Values

Addr: 5h (0101b) POR state: XXXXh
Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Name SS(15:0)
POR X X X X X X X X X X X X X X X X
Bits 15:0 SS(15:0): SPI Scan. When the ADC performs a self-calibration, the values for the calibration are stored in this register and may be read from/ written to it. Set SSC (Addr: 4h, Bit 7) to read/write. See Calibration Feature for more information.

Table 5-16 Reserved

Addr: 6h (0110b) POR state: 1C2Eh
Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Name Res
POR 0 0 0 1 1 1 0 0 0 0 1 0 1 1 1 0
Bits 15:0 Reserved. Must be set as shown.

Table 5-17 DES Timing Adjust

Addr: 7h (0111b) POR state: 8142h
Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Name DTA(6:0) Res
POR 1 0 0 0 0 0 0 1 0 1 0 0 0 0 1 0
Bits 15:9 DTA(6:0): DES Mode Timing Adjust. In the DES Mode, the time at which the falling edge sampling clock samples relative to the rising edge of the sampling clock may be adjusted; the automatic duty cycle correction continues to function. See Input Control and Adjust for more information. The nominal step size is 30fs.
Bits 8:0 Reserved. Must be set as shown.

Table 5-18 Reserved

Addr: 8h (1000b) POR state: 0F0Fh
Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Name Res
POR 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1
Bits 15:0 Reserved. Must be set as shown.

Table 5-19 Reserved

Addr: 9h (1001b) POR state: 0000h
Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Name Res
POR 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
Bits 15:0 Reserved. Must be set as shown.

Table 5-20 Q-channel Offset Adjust

Addr: Ah (1010b) POR state: 0000h
Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Name Res OS OM(11:0)
POR 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
Bits 15:13 Reserved. Must be set to 0b.
Bit 12 OS: Offset Sign. The default setting of 0b incurs a positive offset of a magnitude set by Bits 11:0 to the ADC output. Setting this bet to 1b incurs a negative offset of the set magnitude.
Bits 11:0 OM(11:0): Offset Magnitude. These bits determine the magnitude of the offset set at the ADC output (straight binary coding). The range is from 0 mV for OM(11:0) = 0d to 45 mV for OM(11:0) = 4095d in steps of approximately 11 µV. Monotonicity is specified by design only for the 9 MSBs.
Code Offset [mV]
0000 0000 0000 (default) 0
1000 0000 0000 22.5
1111 1111 1111 45

Table 5-21 Q-channel Full-Scale Range Adjust

Addr: Bh (1011b) POR state: 4000h
Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Name Res FM(14:0)
POR 0 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0
Bit 15 Reserved. Must be set to 0b.
Bits 14:0 FM(14:0): FSR Magnitude. These bits increase the ADC full-scale range magnitude (straight binary coding.) The range is from 600 mV (0d) to 1000 mV (32767d) with the default setting at 800 mV (16384d). Monotonicity is specified by design only for the 9 MSBs. The mid-range (low) setting in ECM corresponds to the nominal (low) setting in Non-ECM. A greater range of FSR values is available in ECM, that is, FSR values greater than 800 mV. See VIN_FSR in Electrical Characteristics: Analog Input/Output and Reference for characterization details.
Code FSR [mV]
000 0000 0000 0000 600
100 0000 0000 0000 (default) 800
111 1111 1111 1111 1000

Table 5-22 Aperture Delay Coarse Adjust

Addr: Ch (1100b) POR state: 0004h
Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Name CAM(11:0) STA DCC Res
POR 0 0 0 0 0 0 0 0 0 0 0 0 0 1 0 0
Bits 15:4 CAM(11:0): Coarse Adjust Magnitude. This 12-bit value determines the amount of delay that will be applied to the input CLK signal. The range is 0 ps delay for CAM(11:0) = 0d to a maximum delay of 825 ps for CAM(11:0) = 2431d (±95 ps due to PVT variation) in steps of approximately 340 fs. For code CAM(11:0) = 2432d and above, the delay saturates and the maximum delay applies. Additional, finer delay steps are available in register Dh. The STA (Bit 3) must be selected to enable this function.
Bit 3 STA: Select tAD Adjust. Set this bit to 1b to enable the tAD adjust feature, which will make both coarse and fine adjustment settings, that is, CAM(11:0) and FAM(5:0), available.
Bit 2 DCC: Duty Cycle Correct. This bit can be set to 0b to disable the automatic duty-cycle stabilizer feature of the chip. This feature is enabled by default.
Bits 1:0 Reserved. Must be set to 0b.

Table 5-23 Aperture Delay Fine Adjust

Addr: Dh (1101b) POR state: 0000h
Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Name FAM(5:0) Res Res
POR 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
Bits 15:10 FAM(5:0): Fine Aperture Adjust Magnitude. This 6-bit value determines the amount of additional delay that will be applied to the input CLK when the Clock Phase Adjust feature is enabled through STA (Addr: Ch, Bit 3). The range is straight binary from 0 ps delay for FAM(5:0) = 0d to 2.3 ps delay for FAM(5:0) = 63d (±300 fs due to PVT variation) in steps of approximately 36 fs.
Bits 9:0 Reserved. Must be set as shown.

Table 5-24 AutoSync(1)

Addr: Eh (1110b) POR state: 0003h
Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Name DRC(8:0) DCK Res SP(1:0) ES DOC DR
POR 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1
(1) This feature functionality is not tested in production test; performance is tested in the specified/default mode only.
Bits 15:7 DRC(8:0): Delay Reference Clock (8:0). These bits may be used to increase the delay on the input reference clock when synchronizing multiple ADCs. The delay may be set from a minimum of 0s (0d) to a maximum of 1200 ps (319d). The delay remains the maximum of 1200 ps for any codes above or equal to 319d. See Synchronizing Multiple ADC12D1600/1000RFS in a System for more information.
Bit 6 DCK: DESCLKIQ Mode. Set this bit to 1b to enable Dual-Edge Sampling, in which the Sampling Clock samples the I- and Q-channels 180º out of phase with respect to one another, that is, the DESCLKIQ Mode. To select the DESCLKIQ Mode, Addr: 0h, Bits <7:5> must also be set to 000b. See Input Control and Adjust for more information. (1)
Bit 5 Reserved. Must be set as shown.
Bits 4:3 SP(1:0): Select Phase. These bits select the phase of the reference clock which is latched. The codes correspond to the following phase shift:
00 = 0°
01 = 90°
10 = 180°
11 = 270°
Bit 2 ES: Enable Slave. Set this bit to 1b to enable the Slave Mode of operation. In this mode, the internal divided clocks are synchronized with the reference clock coming from the master ADC. The master clock is applied on the input pins RCLK. If this bit is set to 0b, then the device is in Master Mode.
Bit 1 DOC: Disable Output reference Clocks. Setting this bit to 0b sends a CLK/4 signal on RCOut1 and RCOut2. The default setting of 1b disables these output drivers. This bit functions as described, regardless of whether the device is operating in Master or Slave Mode, as determined by ES (Bit 2).
Bit 0 DR: Disable Reset. The default setting of 1b leaves the DCLK_RST functionality disabled. Set this bit to 0b to enable DCLK_RST functionality.

Table 5-25 Reserved

Addr: Fh (1111b) POR state: 001Dh
Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Name Res
POR 0 0 0 0 0 0 0 0 0 0 0 1 1 1 0 1
Bits 15:0 Reserved. This address is read only.