SLAS900F October   2012  – December 2014 ADS42JB49 , ADS42JB69

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics: ADS42JB69 (16-Bit)
    6. 7.6  Electrical Characteristics: ADS42JB49 (14-Bit)
    7. 7.7  Electrical Characteristics: General
    8. 7.8  Digital Characteristics
    9. 7.9  Timing Characteristics
    10. 7.10 Typical Characteristics: ADS42JB69
    11. 7.11 Typical Characteristics: ADS42JB49
    12. 7.12 Typical Characteristics: Common
    13. 7.13 Typical Characteristics: Contour
      1. 7.13.1 Spurious-Free Dynamic Range (SFDR): General
      2. 7.13.2 Signal-to-Noise Ratio (SNR): ADS42JB69
      3. 7.13.3 Signal-to-Noise Ratio (SNR): ADS42JB49
  8. Parameter Measurement Information
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Digital Gain
      2. 9.3.2 Input Clock Divider
      3. 9.3.3 Overrange Indication
      4. 9.3.4 Pin Controls
    4. 9.4 Device Functional Modes
      1. 9.4.1 JESD204B Interface
        1. 9.4.1.1 JESD204B Initial Lane Alignment (ILA)
        2. 9.4.1.2 JESD204B Test Patterns
        3. 9.4.1.3 JESD204B Frame Assembly
        4. 9.4.1.4 JESD Link Configuration
          1. 9.4.1.4.1 Configuration for 2-Lane (20x) SERDES Mode
          2. 9.4.1.4.2 Configuration for 4-Lane (10x) SERDES Mode
        5. 9.4.1.5 CML Outputs
    5. 9.5 Programming
      1. 9.5.1 Device Configuration
      2. 9.5.2 Details of Serial Interface
        1. 9.5.2.1 Register Initialization
        2. 9.5.2.2 Serial Register Write
        3. 9.5.2.3 Serial Register Readout
    6. 9.6 Register Maps
      1. 9.6.1 Description of Serial Interface Registers
        1. 9.6.1.1  Register 6 (offset = 06h) [reset = 00h]
        2. 9.6.1.2  Register 7 (offset = 07h) [reset = 00h]
        3. 9.6.1.3  Register 8 (offset = 08h) [reset = 00h]
        4. 9.6.1.4  Register B (offset = 0Bh) [reset = 00h]
        5. 9.6.1.5  Register C (offset = 0Ch) [reset = 00h]
        6. 9.6.1.6  Register D (offset = 0Dh) [reset = 00h]
        7. 9.6.1.7  Register E (offset = 0Eh) [reset = 00h]
        8. 9.6.1.8  Register F (offset = 0Fh) [reset = 00h]
        9. 9.6.1.9  Register 10 (offset = 10h) [reset = 00h]
        10. 9.6.1.10 Register 11 (offset = 11h) [reset = 00h]
        11. 9.6.1.11 Register 12 (offset = 12h) [reset = 00h]
        12. 9.6.1.12 Register 13 (offset = 13h) [reset = 00h]
        13. 9.6.1.13 Register 1F (offset = 1Fh) [reset = FFh]
        14. 9.6.1.14 Register 26 (offset = 26h) [reset = 00h]
        15. 9.6.1.15 Register 27 (offset = 27h) [reset = 00h]
        16. 9.6.1.16 Register 2B (offset = 2Bh) [reset = 00h]
        17. 9.6.1.17 Register 2C (offset = 2Ch) [reset = 00h]
        18. 9.6.1.18 Register 2D (offset = 2Dh) [reset = 00h]
        19. 9.6.1.19 Register 30 (offset = 30h) [reset = 40h]
        20. 9.6.1.20 Register 36 (offset = 36h) [reset = 00h]
        21. 9.6.1.21 Register 37 (offset = 37h) [reset = 00h]
        22. 9.6.1.22 Register 38 (offset = 38h) [reset = 00h]
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Analog Input
          1. 10.2.2.1.1 Drive Circuit Requirements
          2. 10.2.2.1.2 Driving Circuit
        2. 10.2.2.2 Clock Input
          1. 10.2.2.2.1 SNR and Clock Jitter
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Device Nomenclature
        1. 13.1.1.1 Definition of Specifications
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Related Links
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

13 Device and Documentation Support

13.1 Device Support

13.1.1 Device Nomenclature

13.1.1.1 Definition of Specifications

    AC Power-Supply Rejection Ratio (AC PSRR):

    AC PSRR is the measure of rejection of variations in the supply voltage by the ADC. If ΔVSUP is the change in supply voltage and ΔVOUT is the resultant change of the ADC output code (referred to the input), then:

    Equation 5. q_psrr_las635.gif
    Analog Bandwidth:

    The analog input frequency at which the power of the fundamental is reduced by 3 dB with respect to the low-frequency value.

    Aperture Delay:

    The delay in time between the rising edge of the input sampling clock and the actual time at which the sampling occurs. This delay is different across channels. The maximum variation is specified as aperture delay variation (channel-to-channel).

    Aperture Uncertainty (Jitter):

    The sample-to-sample variation in aperture delay.

    Clock Pulse Width and Duty Cycle:

    The duty cycle of a clock signal is the ratio of the time the clock signal remains at a logic high (clock pulse width) to the period of the clock signal. Duty cycle is typically expressed as a percentage. A perfect differential sine-wave clock results in a 50% duty cycle.

    Common-Mode Rejection Ratio (CMRR):

    CMRR is the measure of rejection of variation in the analog input common-mode by the ADC. If ΔVCM_IN is the change in the common-mode voltage of the input pins and ΔVOUT is the resulting change of the ADC output code (referred to the input), then:

    Equation 6. q_cmrr_las635.gif
    Crosstalk (only for Multichannel ADCs):

    Crosstalk is a measure of the internal coupling of a signal from an adjacent channel into the channel of interest. Crosstalk is specified separately for coupling from the immediate neighboring channel (near-channel) and for coupling from channel across the package (far-channel). Crosstalk is usually measured by applying a full-scale signal in the adjacent channel. Crosstalk is the ratio of the power of the coupling signal (as measured at the output of the channel of interest) to the power of the signal applied at the adjacent channel input. Crosstalk is typically expressed in dBc.

    DC Power-Supply Rejection Ratio (DC PSRR):

    DC PSSR is the ratio of the change in offset error to a change in analog supply voltage. The dc PSRR is typically given in units of mV/V.

    Differential Nonlinearity (DNL):

    An ideal ADC exhibits code transitions at analog input values spaced exactly 1 LSB apart. The DNL is the deviation of any single step from this ideal value, measured in units of LSBs.

    Effective Number of Bits (ENOB):

    ENOB is a measure of the converter performance as compared to the theoretical limit based on quantization noise.

    Equation 7. q_enob_las635.gif
    Gain Error:

    Gain error is the deviation of the ADC actual input full-scale range from its ideal value. The gain error is given as a percentage of the ideal input full-scale range. Gain error has two components: error as a result of reference inaccuracy (EGREF) and error as a result of the channel (EGCHAN). Both errors are specified independently as EGREF and EGCHAN.

    To a first-order approximation, the total gain error is ETOTAL ~ EGREF + EGCHAN.

    For example, if ETOTAL = ±0.5%, the full-scale input varies from (1 – 0.5 / 100) x FSideal to (1 + 0.5 / 100) × FSideal.

    Integral Nonlinearity (INL):

    The INL is the deviation of the ADC transfer function from a best fit line determined by a least squares curve fit of that transfer function, measured in units of LSBs.

    Maximum Conversion Rate:

    The maximum sampling rate at which specified operation is given. All parametric testing is performed at this sampling rate unless otherwise noted.

    Minimum Conversion Rate:

    The minimum sampling rate at which the ADC functions.

    Offset Error:

    The offset error is the difference, given in number of LSBs, between the ADC actual average idle channel output code and the ideal average idle channel output code. This quantity is often mapped into millivolts.

    Signal-to-Noise and Distortion (SINAD):

    SINAD is the ratio of the power of the fundamental (PS) to the power of all the other spectral components including noise (PN) and distortion (PD), but excluding dc.

    Equation 8. q_snr_las635.gif
    Equation 9. q_sinad_las635.gif

    SINAD is either given in units of dBc (dB to carrier) when the absolute power of the fundamental is used as the reference, or dBFS (dB to full-scale) when the power of the fundamental is extrapolated to the converter full-scale range.

    Signal-to-Noise Ratio (SNR):

    SNR is the ratio of the power of the fundamental (PS) to the noise floor power (PN), excluding the power at dc and the first nine harmonics.

    SNR is either given in units of dBc (dB to carrier) when the absolute power of the fundamental is used as the reference, or dBFS (dB to full-scale) when the power of the fundamental is extrapolated to the converter full-scale range.

    Spurious-Free Dynamic Range (SFDR):

    The ratio of the power of the fundamental to the highest other spectral component (either spur or harmonic). SFDR is typically given in units of dBc (dB to carrier).

    Temperature Drift:

    The temperature drift coefficient (with respect to gain error and offset error) specifies the change per degree Celsius of the parameter from TMIN to TMAX. Temperature drift is calculated by dividing the maximum deviation of the parameter across the TMIN to TMAX range by the difference TMAX – TMIN.

    Total Harmonic Distortion (THD):

    THD is the ratio of the power of the fundamental (PS) to the power of the first nine harmonics (PD).

    Equation 10. q_thd_las635.gif

    THD is typically given in units of dBc (dB to carrier).

    Two-Tone Intermodulation Distortion (IMD3):

    IMD3 is the ratio of the power of the fundamental (at frequencies f1 and f2) to the power of the worst spectral component at either frequency 2f1 – f2 or 2f2 – f1. IMD3 is either given in units of dBc (dB to carrier) when the absolute power of the fundamental is used as the reference, or dBFS (dB to full-scale) when the power of the fundamental is extrapolated to the converter full-scale range.

    Voltage Overload Recovery:

    The number of clock cycles taken to recover to less than 1% error after an overload on the analog inputs. This is tested by separately applying a sine wave signal with 6 dB positive and negative overload. The deviation of the first few samples after the overload (from the expected values) is noted.

13.2 Documentation Support

13.2.1 Related Documentation

LMK04828 Data Sheet, SNAS605

13.3 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 40. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
ADS42JB49 Click here Click here Click here Click here Click here
ADS42JB69 Click here Click here Click here Click here Click here

13.4 Trademarks

All other trademarks are the property of their respective owners.

13.5 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

13.6 Glossary

SLYZ022TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.