SBAS542D April   2011  – July 2015 AMC1200

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Insulation Characteristics
      2. 7.3.2 IEC 61000-4-5 Ratings
      3. 7.3.3 IEC 60664-1 Ratings
      4. 7.3.4 Package Characteristics
      5. 7.3.5 IEC Safety Limiting Values
      6. 7.3.6 Regulatory Information
      7. 7.3.7 Isolation Amplifier
      8. 7.3.8 Analog Input
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Motor Control
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Isolated Voltage Measurement
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

4 Revision History

Changes from C Revision (September 2013) to D Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go

Changes from B Revision (August 2012) to C Revision

  • Deleted device graphicGo
  • Added DWV (SOIC-9) package to documentGo
  • Changed last paragraph of Description sectionGo
  • Added DWV pin out drawingGo
  • Added DWV column to Thermal Information tableGo
  • Added row for DWV package to L(I01) and L(I02) parameters in Package Characteristics tableGo

Changes from A Revision (August 2011) to B Revision

  • Changed Isolation Voltage feature bulletGo
  • Added AMC1200B device to data sheetGo
  • Changed title for Figure 25Go
  • Changed CTI parameter minimum value in Electrical Characteristics from ≥ 175 to ≥ 400Go

Changes from * Revision (April 2011) to A Revision

  • Changed sign for maximum junction temperature from minus to plus (typo)Go
  • Added "0.5-V step" to test condition for Rise/fall time parameterGo
  • Changed Figure 12Go
  • Changed Figure 13Go
  • Changed surge immunity parameter from ±4000 to ±6000Go