JAJSFS8 July   2018 BQ25601D

PRODUCTION DATA.  

  1. 特長
  2. アプリケーション
  3. 概要
    1.     アプリケーション概略図
  4. 改訂履歴
  5. 概要(続き)
  6. Device Comparison Table
  7. Pin Configuration and Functions
    1.     Pin Functions
  8. Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal information
    5. 8.5 Electrical Characteristics
    6. 8.6 Timing Requirements
    7. 8.7 Typical Characteristics
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Power-On-Reset (POR)
      2. 9.3.2 Device Power Up from Battery without Input Source
      3. 9.3.3 Power Up from Input Source
        1. 9.3.3.1 Power Up REGN Regulation
        2. 9.3.3.2 Poor Source Qualification
        3. 9.3.3.3 Input Source Type Detection
          1. 9.3.3.3.1 D+/D– Detection Sets Input Current Limit in BQ25601D
        4. 9.3.3.4 Input Voltage Limit Threshold Setting (VINDPM Threshold)
        5. 9.3.3.5 Converter Power-Up
      4. 9.3.4 Boost Mode Operation From Battery
      5. 9.3.5 Host Mode and Standalone Power Management
        1. 9.3.5.1 Host Mode and Default Mode in BQ25601D
      6. 9.3.6 Power Path Management
      7. 9.3.7 Battery Charging Management
        1. 9.3.7.1 Autonomous Charging Cycle
        2. 9.3.7.2 Battery Charging Profile
        3. 9.3.7.3 Charging Termination
        4. 9.3.7.4 Thermistor Qualification
        5. 9.3.7.5 JEITA Guideline Compliance During Charging Mode
        6. 9.3.7.6 Boost Mode Thermistor Monitor during Battery Discharge Mode
        7. 9.3.7.7 Charging Safety Timer
    4. 9.4 Device Functional Modes
      1. 9.4.1 Narrow VDC Architecture
      2. 9.4.2 Dynamic Power Management
      3. 9.4.3 Supplement Mode
      4. 9.4.4 Shipping Mode and QON Pin
        1. 9.4.4.1 BATFET Disable Mode (Shipping Mode)
        2. 9.4.4.2 BATFET Enable (Exit Shipping Mode)
        3. 9.4.4.3 BATFET Full System Reset
        4. 9.4.4.4 QON Pin Operations
      5. 9.4.5 Status Outputs (PG, STAT, INT)
        1. 9.4.5.1 Power Good indicator ( PGPin PG_STAT Bit)
        2. 9.4.5.2 Charging Status indicator (STAT)
        3. 9.4.5.3 Interrupt to Host (INT)
    5. 9.5 Protections
      1. 9.5.1 Voltage and Current Monitoring in Converter Operation
        1. 9.5.1.1 Voltage and Current Monitoring in Buck Mode
          1. 9.5.1.1.1 Input Overvoltage (ACOV)
          2. 9.5.1.1.2 System Overvoltage Protection (SYSOVP)
      2. 9.5.2 Voltage and Current Monitoring in Boost Mode
        1. 9.5.2.1 VBUS Soft Start
        2. 9.5.2.2 VBUS Output Protection
        3. 9.5.2.3 Boost Mode Overvoltage Protection
      3. 9.5.3 Thermal Regulation and Thermal Shutdown
        1. 9.5.3.1 Thermal Protection in Buck Mode
        2. 9.5.3.2 Thermal Protection in Boost Mode
      4. 9.5.4 Battery Protection
        1. 9.5.4.1 Battery overvoltage Protection (BATOVP)
        2. 9.5.4.2 Battery Over-Discharge Protection
        3. 9.5.4.3 System Over-Current Protection
    6. 9.6 Programming
      1. 9.6.1 Serial Interface
        1. 9.6.1.1 Data Validity
        2. 9.6.1.2 START and STOP Conditions
        3. 9.6.1.3 Byte Format
        4. 9.6.1.4 Acknowledge (ACK) and Not Acknowledge (NACK)
        5. 9.6.1.5 Slave Address and Data Direction Bit
        6. 9.6.1.6 Single Read and Write
        7. 9.6.1.7 Multi-Read and Multi-Write
    7. 9.7 Register Maps
      1. 9.7.1  REG00 (address = 00) [reset = 00010111]
        1. Table 6. REG00 Field Descriptions
      2. 9.7.2  REG01 (address = 01) [reset = 00011010]
        1. Table 7. REG01 Field Descriptions
      3. 9.7.3  REG02 (address = 02) [reset = 10100010]
        1. Table 8. REG02 Field Descriptions
      4. 9.7.4  REG03 (address = 03) [reset = 00100010]
        1. Table 9. REG03 Field Descriptions
      5. 9.7.5  REG04 (address = 04) [reset = 01011000]
        1. Table 10. REG04 Field Descriptions
      6. 9.7.6  REG05 (address = 05) [reset = 10011111]
        1. Table 11. REG05 Field Descriptions
      7. 9.7.7  REG06 (address = 06) [reset = 01100110]
        1. Table 12. REG06 Field Descriptions
      8. 9.7.8  REG07 (address = 07) [reset = 01001100]
        1. Table 13. REG07 Field Descriptions
      9. 9.7.9  REG08 (address = 08) [reset = xxxxxxxx]
        1. Table 14. REG08 Field Descriptions
      10. 9.7.10 REG09 (address = 09) [reset = xxxxxxxx]
        1. Table 15. REG09 Field Descriptions
      11. 9.7.11 REG0A (address = 0A) [reset = xxxxxx00]
        1. Table 16. REG0A Field Descriptions
      12. 9.7.12 REG0B (address = 0B) [reset = 00111xxx]
        1. Table 17. REG0B Field Descriptions
  10. 10Application and Implementation
    1. 10.1 Application information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Custom Design With WEBENCH® Tools
        2. 10.2.2.2 Inductor Selection
        3. 10.2.2.3 Input Capacitor
        4. 10.2.2.4 Output Capacitor
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13デバイスおよびドキュメントのサポート
    1. 13.1 デバイス・サポート
      1. 13.1.1 開発サポート
        1. 13.1.1.1 WEBENCH®ツールによるカスタム設計
    2. 13.2 ドキュメントのサポート
      1. 13.2.1 関連資料
    3. 13.3 ドキュメントの更新通知を受け取る方法
    4. 13.4 コミュニティ・リソース
    5. 13.5 商標
    6. 13.6 静電気放電に関する注意事項
    7. 13.7 Glossary
  14. 14メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Layout Guidelines

The switching node rise and fall times should be minimized for minimum switching loss. Proper layout of the components to minimize high frequency current path loop (see Figure 61) is important to prevent electrical and magnetic field radiation and high frequency resonant problems. Follow this specific order carefully to achieve the proper layout.

  1. Place input capacitor as close as possible to PMID pin and GND pin connections and use shortest copper trace connection or GND plane.
  2. Place inductor input pin to SW pin as close as possible. Minimize the copper area of this trace to lower electrical and magnetic field radiation but make the trace wide enough to carry the charging current. Do not use multiple layers in parallel for this connection. Minimize parasitic capacitance from this area to any other trace or plane.
  3. Put output capacitor near to the inductor and the device. Ground connections need to be tied to the IC ground with a short copper trace connection or GND plane.
  4. Route analog ground separately from power ground. Connect analog ground and connect power ground separately. Connect analog ground and power ground together using thermal pad as the single ground connection point. Or using a 0-Ω resistor to tie analog ground to power ground.
  5. Use single ground connection to tie charger power ground to charger analog ground. Just beneath the device. Use ground copper pour but avoid power pins to reduce inductive and capacitive noise coupling.
  6. Place decoupling capacitors next to the IC pins and make trace connection as short as possible.
  7. It is critical that the exposed thermal pad on the backside of the device package be soldered to the PCB ground. Ensure that there are sufficient thermal vias directly under the IC, connecting to the ground plane on the other layers.
  8. Ensure that the number and sizes of vias allow enough copper for a given current path.

See the EVM user's guide SLUUBL4 for the recommended component placement with trace and via locations. For the VQFN information, refer to SCBA017 and SLUA271.