JAJSIG7D january   2020  – july 2023 CC2642R-Q1

PRODUCTION DATA  

  1.   1
  2. 特長
  3. アプリケーション
  4. 概要
  5. Functional Block Diagram
  6. Revision History
  7. Device Comparison
  8. Terminal Configuration and Functions
    1. 7.1 Pin Diagram – RTC and RGZ Package (Top View)
    2. 7.2 Signal Descriptions
    3. 7.3 Connections for Unused Pins and Modules
  9. Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Power Supply and Modules
    5. 8.5  Power Consumption - Power Modes
    6. 8.6  Power Consumption - Radio Modes
    7. 8.7  Nonvolatile (Flash) Memory Characteristics
    8. 8.8  Thermal Resistance Characteristics
    9. 8.9  Bluetooth Low Energy Receive (RX)
    10. 8.10 Bluetooth Low Energy - Transmit (TX)
    11. 8.11 Timing and Switching Characteristics
      1. 8.11.1 Reset Timing
      2. 8.11.2 Wakeup Timing
      3. 8.11.3 Clock Specifications
        1. 8.11.3.1 48 MHz Crystal Oscillator (XOSC_HF)
        2. 8.11.3.2 48 MHz RC Oscillator (RCOSC_HF)
        3. 8.11.3.3 2 MHz RC Oscillator (RCOSC_MF)
        4. 8.11.3.4 32.768 kHz Crystal Oscillator (XOSC_LF)
        5. 8.11.3.5 32 kHz RC Oscillator (RCOSC_LF)
      4. 8.11.4 Synchronous Serial Interface (SSI) Characteristics
        1. 8.11.4.1 Synchronous Serial Interface (SSI) Characteristics
        2.       34
      5. 8.11.5 UART
        1. 8.11.5.1 UART Characteristics
    12. 8.12 Peripheral Characteristics
      1. 8.12.1 ADC
        1.       Analog-to-Digital Converter (ADC) Characteristics
      2. 8.12.2 DAC
        1. 8.12.2.1 Digital-to-Analog Converter (DAC) Characteristics
      3. 8.12.3 Temperature and Battery Monitor
        1. 8.12.3.1 Temperature Sensor
        2. 8.12.3.2 Battery Monitor
      4. 8.12.4 Comparators
        1. 8.12.4.1 Continuous Time Comparator
        2. 8.12.4.2 Low-Power Clocked Comparator
      5. 8.12.5 Current Source
        1. 8.12.5.1 Programmable Current Source
      6. 8.12.6 GPIO
        1. 8.12.6.1 GPIO DC Characteristics
    13. 8.13 Typical Characteristics
      1. 8.13.1 MCU Current
      2. 8.13.2 RX Current
      3. 8.13.3 TX Current
      4. 8.13.4 RX Performance
      5. 8.13.5 TX Performance
      6. 8.13.6 ADC Performance
  10. Detailed Description
    1. 9.1  Overview
    2. 9.2  System CPU
    3. 9.3  Radio (RF Core)
      1. 9.3.1 Bluetooth 5 low energy
    4. 9.4  Memory
    5. 9.5  Sensor Controller
    6. 9.6  Cryptography
    7. 9.7  Timers
    8. 9.8  Serial Peripherals and I/O
    9. 9.9  Battery and Temperature Monitor
    10. 9.10 µDMA
    11. 9.11 Debug
    12. 9.12 Power Management
    13. 9.13 Clock Systems
    14. 9.14 Network Processor
  11. 10Application, Implementation, and Layout
    1. 10.1 Reference Designs
    2. 10.2 Junction Temperature Calculation
  12. 11Device and Documentation Support
    1. 11.1 Device Nomenclature
    2. 11.2 Tools and Software
      1. 11.2.1 SimpleLink™ Microcontroller Platform
    3. 11.3 Documentation Support
    4. 11.4 サポート・リソース
    5. 11.5 Trademarks
    6. 11.6 静電気放電に関する注意事項
    7. 11.7 用語集
  13. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Memory

The up to 352-KB nonvolatile (Flash) memory provides storage for code and data. The flash memory is in-system programmable and erasable. The last flash memory sector must contain a Customer Configuration section (CCFG) that is used by boot ROM and TI provided drivers to configure the device. This configuration is done through the ccfg.c source file that is included in all TI provided examples.

The ultra-low leakage system static RAM (SRAM) is split into up to five 16-KB blocks and can be used for both storage of data and execution of code. Retention of SRAM contents in Standby power mode is enabled by default and included in Standby mode power consumption numbers. Parity checking for detection of bit errors in memory is built-in, which reduces chip-level soft errors and thereby increases reliability. System SRAM is always initialized to zeroes upon code execution from boot.

To improve code execution speed and lower power when executing code from nonvolatile memory, a 4-way nonassociative 8-KB cache is enabled by default to cache and prefetch instructions read by the system CPU. The cache can be used as a general-purpose RAM by enabling this feature in the Customer Configuration Area (CCFG).

There is a 4-KB ultra-low leakage SRAM available for use with the Sensor Controller Engine which is typically used for storing Sensor Controller programs, data and configuration parameters. This RAM is also accessible by the system CPU. The Sensor Controller RAM is not cleared to zeroes between system resets.

The ROM includes a TI-RTOS kernel and low-level drivers, as well as significant parts of selected radio stacks, which frees up flash memory for the application. The ROM also contains a serial (SPI and UART) bootloader that can be used for initial programming of the device.