JAJSF42B April   2018  – June 2019 DLPC3478

PRODUCTION DATA.  

  1. 特長
  2. アプリケーション
  3. 概要
    1.     Device Images
      1.      標準的なスタンドアロン・システム
  4. 改訂履歴
  5. Pin Configuration and Functions
    1.     Pin Functions – Board Level Test, Debug, and Initialization
    2.     Pin Functions – Parallel Port Input Data and Control
    3.     Pin Functions - DSI Input Data and Clock
    4.     Pin Functions – DMD Reset and Bias Control
    5.     Pin Functions – DMD Sub-LVDS Interface
    6.     Pin Functions – Peripheral Interface
    7.     Pin Functions – GPIO Peripheral Interface
    8.     Pin Functions – Clock and PLL Support
    9.     Pin Functions – Power and Ground
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics over Recommended Operating Conditions
    6. 6.6  Electrical Characteristics
    7. 6.7  High-Speed Sub-LVDS Electrical Characteristics
    8. 6.8  Low-Speed SDR Electrical Characteristics
    9. 6.9  System Oscillators Timing Requirements
    10. 6.10 Power-Up and Reset Timing Requirements
    11. 6.11 Parallel Interface Frame Timing Requirements
    12. 6.12 Parallel Interface General Timing Requirements
    13. 6.13 BT656 Interface General Timing Requirements
    14. 6.14 Flash Interface Timing Requirements
  7. Parameter Measurement Information
    1. 7.1 HOST_IRQ Usage Model
    2. 7.2 Input Source
      1. 7.2.1 Input Source - Frame Rates and 3-D Display Orientation
      2. 7.2.2 Parallel Interface Supports Six Data Transfer Formats
        1. 7.2.2.1 PDATA Bus – Parallel Interface Bit Mapping Modes
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Pattern Display
        1. 8.3.1.1 External Pattern Mode
          1. 8.3.1.1.1 8-bit Monochrome Patterns
          2. 8.3.1.1.2 1-Bit Monochrome Patterns
        2. 8.3.1.2 Internal Pattern Mode
          1. 8.3.1.2.1 Free Running Mode
          2. 8.3.1.2.2 Trigger In Mode
      2. 8.3.2 Interface Timing Requirements
        1. 8.3.2.1 Parallel Interface
    4. 8.4 Serial Flash Interface
      1. 8.4.1  Serial Flash Programming
      2. 8.4.2  SPI Signal Routing
      3. 8.4.3  I2C Interface Performance
      4. 8.4.4  Content-Adaptive Illumination Control
      5. 8.4.5  Local Area Brightness Boost
      6. 8.4.6  3-D Glasses Operation
      7. 8.4.7  DMD (Sub-LVDS) Interface
      8. 8.4.8  Calibration and Debug Support
      9. 8.4.9  DMD Interface Considerations
      10. 8.4.10 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 DLPC3478 System Design Consideration
    2. 9.2 Typical Application
      1. 9.2.1 3D Depth Scanner with DLP Using External Pattern Streaming Mode
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 3D Depth Scanner Using Internal Pattern Streaming Mode
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curve
  10. 10Power Supply Recommendations
    1. 10.1 System Power-Up and Power-Down Sequence
    2. 10.2 DLPC3478 Power-Up Initialization Sequence
    3. 10.3 DMD Fast PARK Control (PARKZ)
    4. 10.4 Hot Plug Usage
    5. 10.5 Maximum Signal Transition Time
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Layout Guidelines for Internal ASIC PLL Power
      2. 11.1.2 DLPC3478 Reference Clock
        1. 11.1.2.1 Recommended Crystal Oscillator Configuration
      3. 11.1.3 General PCB Recommendations
      4. 11.1.4 General Handling Guidelines for Unused CMOS-Type Pins
      5. 11.1.5 Maximum Pin-to-Pin, PCB Interconnects Etch Lengths
      6. 11.1.6 Number of Layer Changes
      7. 11.1.7 Stubs
      8. 11.1.8 Terminations
      9. 11.1.9 Routing Vias
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 デバイス・サポート
      1. 12.1.1 デベロッパー・ネットワークの製品に関する免責事項
      2. 12.1.2 デバイスの項目表記
        1. 12.1.2.1 デバイスのマーキング
      3. 12.1.3 ビデオ・タイミング・パラメータの定義
    2. 12.2 関連リンク
    3. 12.3 コミュニティ・リソース
    4. 12.4 商標
    5. 12.5 静電気放電に関する注意事項
    6. 12.6 Glossary
  13. 13メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

High-Speed Sub-LVDS Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER MIN NOM MAX UNIT
VCM Steady-state common mode voltage 0.8 0.9 1.0 V
VCM (Δpp)(1) VCM change peak-to-peak (during switching) 75 mV
VCM (Δss)(1) VCM change steady state –10 10 mV
|VOD|(2) Differential output voltage magnitude 200 mV
VOD (Δ) VOD change (between logic states) –10 10 mV
VOH Single-ended output voltage high 1.00 V
VOL Single-ended output voltage low 0.80 V
tR(2) Differential output rise time 250 ps
tF(2) Differential output fall time 250 ps
tMAX Max switching rate 1200 Mbps
DCout Output duty cycle 45% 50% 55%
Txterm(1) Internal differential termination 80 100 120 Ω
Txload 100-Ω differential PCB trace
(50-Ω transmission lines)
0.5 6 inches
Definition of VCM changes:DLPC3478 Vcm_changes_LPS038.gif \
Note that VOD is the differential voltage swing measured across a 100-Ω termination resistance connected directly between the transmitter differential pins. |VOD| is the magnitude of this voltage swing relative to 0. Rise and fall times are defined for the differential VOD signal as follows: DLPC3478 Vod_signal_LPS038.gif