JAJSF42B April   2018  – June 2019 DLPC3478

PRODUCTION DATA.  

  1. 特長
  2. アプリケーション
  3. 概要
    1.     Device Images
      1.      標準的なスタンドアロン・システム
  4. 改訂履歴
  5. Pin Configuration and Functions
    1.     Pin Functions – Board Level Test, Debug, and Initialization
    2.     Pin Functions – Parallel Port Input Data and Control
    3.     Pin Functions - DSI Input Data and Clock
    4.     Pin Functions – DMD Reset and Bias Control
    5.     Pin Functions – DMD Sub-LVDS Interface
    6.     Pin Functions – Peripheral Interface
    7.     Pin Functions – GPIO Peripheral Interface
    8.     Pin Functions – Clock and PLL Support
    9.     Pin Functions – Power and Ground
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics over Recommended Operating Conditions
    6. 6.6  Electrical Characteristics
    7. 6.7  High-Speed Sub-LVDS Electrical Characteristics
    8. 6.8  Low-Speed SDR Electrical Characteristics
    9. 6.9  System Oscillators Timing Requirements
    10. 6.10 Power-Up and Reset Timing Requirements
    11. 6.11 Parallel Interface Frame Timing Requirements
    12. 6.12 Parallel Interface General Timing Requirements
    13. 6.13 BT656 Interface General Timing Requirements
    14. 6.14 Flash Interface Timing Requirements
  7. Parameter Measurement Information
    1. 7.1 HOST_IRQ Usage Model
    2. 7.2 Input Source
      1. 7.2.1 Input Source - Frame Rates and 3-D Display Orientation
      2. 7.2.2 Parallel Interface Supports Six Data Transfer Formats
        1. 7.2.2.1 PDATA Bus – Parallel Interface Bit Mapping Modes
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Pattern Display
        1. 8.3.1.1 External Pattern Mode
          1. 8.3.1.1.1 8-bit Monochrome Patterns
          2. 8.3.1.1.2 1-Bit Monochrome Patterns
        2. 8.3.1.2 Internal Pattern Mode
          1. 8.3.1.2.1 Free Running Mode
          2. 8.3.1.2.2 Trigger In Mode
      2. 8.3.2 Interface Timing Requirements
        1. 8.3.2.1 Parallel Interface
    4. 8.4 Serial Flash Interface
      1. 8.4.1  Serial Flash Programming
      2. 8.4.2  SPI Signal Routing
      3. 8.4.3  I2C Interface Performance
      4. 8.4.4  Content-Adaptive Illumination Control
      5. 8.4.5  Local Area Brightness Boost
      6. 8.4.6  3-D Glasses Operation
      7. 8.4.7  DMD (Sub-LVDS) Interface
      8. 8.4.8  Calibration and Debug Support
      9. 8.4.9  DMD Interface Considerations
      10. 8.4.10 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 DLPC3478 System Design Consideration
    2. 9.2 Typical Application
      1. 9.2.1 3D Depth Scanner with DLP Using External Pattern Streaming Mode
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 3D Depth Scanner Using Internal Pattern Streaming Mode
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curve
  10. 10Power Supply Recommendations
    1. 10.1 System Power-Up and Power-Down Sequence
    2. 10.2 DLPC3478 Power-Up Initialization Sequence
    3. 10.3 DMD Fast PARK Control (PARKZ)
    4. 10.4 Hot Plug Usage
    5. 10.5 Maximum Signal Transition Time
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Layout Guidelines for Internal ASIC PLL Power
      2. 11.1.2 DLPC3478 Reference Clock
        1. 11.1.2.1 Recommended Crystal Oscillator Configuration
      3. 11.1.3 General PCB Recommendations
      4. 11.1.4 General Handling Guidelines for Unused CMOS-Type Pins
      5. 11.1.5 Maximum Pin-to-Pin, PCB Interconnects Etch Lengths
      6. 11.1.6 Number of Layer Changes
      7. 11.1.7 Stubs
      8. 11.1.8 Terminations
      9. 11.1.9 Routing Vias
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 デバイス・サポート
      1. 12.1.1 デベロッパー・ネットワークの製品に関する免責事項
      2. 12.1.2 デバイスの項目表記
        1. 12.1.2.1 デバイスのマーキング
      3. 12.1.3 ビデオ・タイミング・パラメータの定義
    2. 12.2 関連リンク
    3. 12.3 コミュニティ・リソース
    4. 12.4 商標
    5. 12.5 静電気放電に関する注意事項
    6. 12.6 Glossary
  13. 13メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

SPI Signal Routing

The DLPC3478 device supports two SPI slave devices on the SPI0 interface, specifically, a serial flash and the DLPA200x or DLPA300x. This requires routing associated SPI signals to two locations while attempting to operate up to 36 MHz. Take special care to ensure that reflections do not compromise signal integrity. Follow these recommendations.

  • Split the SPI0_CLK PCB signal trace from the DLPC3478 source to each slave device into separate routes as close to the DLPC3478 device as possible. Ensure that the SPI0_CLK trace length to each device are equal in total length.
  • Split the SPI0_DOUT PCB signal trace from the DLPC3478 device source to each slave device into separate routes as close to the DLPC3478 device as possible. Ensure that the SPI0_DOUT trace length to each device are equal in total length (use the same strategy as listed for SPI0_CLK).
  • Ensure the SPI0_DIN PCB signal trace from each slave device to the point where they intersect on the return to the DLPC3478 device are equal in length and as short as possible. Ensure that each slave device shares a common trace back to the DLPC3478 device.
  • SPI0_CSZ0 and SPI0_CSZ1 need no special treatment because they are dedicated signals and drive only one device.