JAJSF42B April   2018  – June 2019 DLPC3478

PRODUCTION DATA.  

  1. 特長
  2. アプリケーション
  3. 概要
    1.     Device Images
      1.      標準的なスタンドアロン・システム
  4. 改訂履歴
  5. Pin Configuration and Functions
    1.     Pin Functions – Board Level Test, Debug, and Initialization
    2.     Pin Functions – Parallel Port Input Data and Control
    3.     Pin Functions - DSI Input Data and Clock
    4.     Pin Functions – DMD Reset and Bias Control
    5.     Pin Functions – DMD Sub-LVDS Interface
    6.     Pin Functions – Peripheral Interface
    7.     Pin Functions – GPIO Peripheral Interface
    8.     Pin Functions – Clock and PLL Support
    9.     Pin Functions – Power and Ground
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics over Recommended Operating Conditions
    6. 6.6  Electrical Characteristics
    7. 6.7  High-Speed Sub-LVDS Electrical Characteristics
    8. 6.8  Low-Speed SDR Electrical Characteristics
    9. 6.9  System Oscillators Timing Requirements
    10. 6.10 Power-Up and Reset Timing Requirements
    11. 6.11 Parallel Interface Frame Timing Requirements
    12. 6.12 Parallel Interface General Timing Requirements
    13. 6.13 BT656 Interface General Timing Requirements
    14. 6.14 Flash Interface Timing Requirements
  7. Parameter Measurement Information
    1. 7.1 HOST_IRQ Usage Model
    2. 7.2 Input Source
      1. 7.2.1 Input Source - Frame Rates and 3-D Display Orientation
      2. 7.2.2 Parallel Interface Supports Six Data Transfer Formats
        1. 7.2.2.1 PDATA Bus – Parallel Interface Bit Mapping Modes
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Pattern Display
        1. 8.3.1.1 External Pattern Mode
          1. 8.3.1.1.1 8-bit Monochrome Patterns
          2. 8.3.1.1.2 1-Bit Monochrome Patterns
        2. 8.3.1.2 Internal Pattern Mode
          1. 8.3.1.2.1 Free Running Mode
          2. 8.3.1.2.2 Trigger In Mode
      2. 8.3.2 Interface Timing Requirements
        1. 8.3.2.1 Parallel Interface
    4. 8.4 Serial Flash Interface
      1. 8.4.1  Serial Flash Programming
      2. 8.4.2  SPI Signal Routing
      3. 8.4.3  I2C Interface Performance
      4. 8.4.4  Content-Adaptive Illumination Control
      5. 8.4.5  Local Area Brightness Boost
      6. 8.4.6  3-D Glasses Operation
      7. 8.4.7  DMD (Sub-LVDS) Interface
      8. 8.4.8  Calibration and Debug Support
      9. 8.4.9  DMD Interface Considerations
      10. 8.4.10 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 DLPC3478 System Design Consideration
    2. 9.2 Typical Application
      1. 9.2.1 3D Depth Scanner with DLP Using External Pattern Streaming Mode
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 3D Depth Scanner Using Internal Pattern Streaming Mode
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curve
  10. 10Power Supply Recommendations
    1. 10.1 System Power-Up and Power-Down Sequence
    2. 10.2 DLPC3478 Power-Up Initialization Sequence
    3. 10.3 DMD Fast PARK Control (PARKZ)
    4. 10.4 Hot Plug Usage
    5. 10.5 Maximum Signal Transition Time
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Layout Guidelines for Internal ASIC PLL Power
      2. 11.1.2 DLPC3478 Reference Clock
        1. 11.1.2.1 Recommended Crystal Oscillator Configuration
      3. 11.1.3 General PCB Recommendations
      4. 11.1.4 General Handling Guidelines for Unused CMOS-Type Pins
      5. 11.1.5 Maximum Pin-to-Pin, PCB Interconnects Etch Lengths
      6. 11.1.6 Number of Layer Changes
      7. 11.1.7 Stubs
      8. 11.1.8 Terminations
      9. 11.1.9 Routing Vias
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 デバイス・サポート
      1. 12.1.1 デベロッパー・ネットワークの製品に関する免責事項
      2. 12.1.2 デバイスの項目表記
        1. 12.1.2.1 デバイスのマーキング
      3. 12.1.3 ビデオ・タイミング・パラメータの定義
    2. 12.2 関連リンク
    3. 12.3 コミュニティ・リソース
    4. 12.4 商標
    5. 12.5 静電気放電に関する注意事項
    6. 12.6 Glossary
  13. 13メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

DMD Interface Considerations

The sub-LVDS HS interface waveform quality and timing on the DLPC3478 device ASIC is dependent on the total length of the interconnect system, the spacing between traces, the characteristic impedance, etch losses, and how well matched the lengths are across the interface. Thus, ensuring positive timing margin requires attention to many factors.

As an example, DMD interface system timing margin can be calculated as follows:

Equation 2. Setup Margin = (DLPC3478 output setup) – (DMD input setup) – (PCB routing mismatch) – (PCB SI degradation)
Equation 3. Hold-time Margin = (DLPC3478 output hold) – (DMD input hold) – (PCB routing mismatch) – (PCB SI degradation)

where

    The data sheets for the DMD devices include I/O timing parameters and DMD I/O timing parameters. Similarly, PCB routing mismatch can be budgeted and met through controlled PCB routing. However, PCB SI degradation is a more complicated adjustment.

    In an attempt to minimize the signal integrity analysis that would otherwise be required, use these PCB design guidelines as a reference of an interconnect system to satisfy both waveform quality and timing requirements (accounting for both PCB routing mismatch and PCB SI degradation). Be sure to compare any variation from these recommendations with PCB signal integrity analysis or lab measurements.

    DLPC3478 stack-up_details_LPS038.gif
    DMD_HS Differential Signals DMD_LS Signals
    Figure 30. DMD Interface Board Stack-Up Details