JAJSF42B April   2018  – June 2019 DLPC3478

PRODUCTION DATA.  

  1. 特長
  2. アプリケーション
  3. 概要
    1.     Device Images
      1.      標準的なスタンドアロン・システム
  4. 改訂履歴
  5. Pin Configuration and Functions
    1.     Pin Functions – Board Level Test, Debug, and Initialization
    2.     Pin Functions – Parallel Port Input Data and Control
    3.     Pin Functions - DSI Input Data and Clock
    4.     Pin Functions – DMD Reset and Bias Control
    5.     Pin Functions – DMD Sub-LVDS Interface
    6.     Pin Functions – Peripheral Interface
    7.     Pin Functions – GPIO Peripheral Interface
    8.     Pin Functions – Clock and PLL Support
    9.     Pin Functions – Power and Ground
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics over Recommended Operating Conditions
    6. 6.6  Electrical Characteristics
    7. 6.7  High-Speed Sub-LVDS Electrical Characteristics
    8. 6.8  Low-Speed SDR Electrical Characteristics
    9. 6.9  System Oscillators Timing Requirements
    10. 6.10 Power-Up and Reset Timing Requirements
    11. 6.11 Parallel Interface Frame Timing Requirements
    12. 6.12 Parallel Interface General Timing Requirements
    13. 6.13 BT656 Interface General Timing Requirements
    14. 6.14 Flash Interface Timing Requirements
  7. Parameter Measurement Information
    1. 7.1 HOST_IRQ Usage Model
    2. 7.2 Input Source
      1. 7.2.1 Input Source - Frame Rates and 3-D Display Orientation
      2. 7.2.2 Parallel Interface Supports Six Data Transfer Formats
        1. 7.2.2.1 PDATA Bus – Parallel Interface Bit Mapping Modes
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Pattern Display
        1. 8.3.1.1 External Pattern Mode
          1. 8.3.1.1.1 8-bit Monochrome Patterns
          2. 8.3.1.1.2 1-Bit Monochrome Patterns
        2. 8.3.1.2 Internal Pattern Mode
          1. 8.3.1.2.1 Free Running Mode
          2. 8.3.1.2.2 Trigger In Mode
      2. 8.3.2 Interface Timing Requirements
        1. 8.3.2.1 Parallel Interface
    4. 8.4 Serial Flash Interface
      1. 8.4.1  Serial Flash Programming
      2. 8.4.2  SPI Signal Routing
      3. 8.4.3  I2C Interface Performance
      4. 8.4.4  Content-Adaptive Illumination Control
      5. 8.4.5  Local Area Brightness Boost
      6. 8.4.6  3-D Glasses Operation
      7. 8.4.7  DMD (Sub-LVDS) Interface
      8. 8.4.8  Calibration and Debug Support
      9. 8.4.9  DMD Interface Considerations
      10. 8.4.10 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 DLPC3478 System Design Consideration
    2. 9.2 Typical Application
      1. 9.2.1 3D Depth Scanner with DLP Using External Pattern Streaming Mode
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 3D Depth Scanner Using Internal Pattern Streaming Mode
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curve
  10. 10Power Supply Recommendations
    1. 10.1 System Power-Up and Power-Down Sequence
    2. 10.2 DLPC3478 Power-Up Initialization Sequence
    3. 10.3 DMD Fast PARK Control (PARKZ)
    4. 10.4 Hot Plug Usage
    5. 10.5 Maximum Signal Transition Time
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Layout Guidelines for Internal ASIC PLL Power
      2. 11.1.2 DLPC3478 Reference Clock
        1. 11.1.2.1 Recommended Crystal Oscillator Configuration
      3. 11.1.3 General PCB Recommendations
      4. 11.1.4 General Handling Guidelines for Unused CMOS-Type Pins
      5. 11.1.5 Maximum Pin-to-Pin, PCB Interconnects Etch Lengths
      6. 11.1.6 Number of Layer Changes
      7. 11.1.7 Stubs
      8. 11.1.8 Terminations
      9. 11.1.9 Routing Vias
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 デバイス・サポート
      1. 12.1.1 デベロッパー・ネットワークの製品に関する免責事項
      2. 12.1.2 デバイスの項目表記
        1. 12.1.2.1 デバイスのマーキング
      3. 12.1.3 ビデオ・タイミング・パラメータの定義
    2. 12.2 関連リンク
    3. 12.3 コミュニティ・リソース
    4. 12.4 商標
    5. 12.5 静電気放電に関する注意事項
    6. 12.6 Glossary
  13. 13メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Thermal Considerations

The underlying thermal limitation for the DLPC3478 is that the maximum operating junction temperature (TJ) not be exceeded (this is defined in the ). This temperature is dependent on operating ambient temperature, airflow, PCB design (including the component layout density and the amount of copper used), power dissipation of the DLPC3478, and power dissipation of surrounding components. The DLPC3478’s package is designed primarily to extract heat through the power and ground planes of the PCB. Thus, copper content and airflow over the PCB are important factors.

The recommended maximum operating ambient temperature (TA) is provided primarily as a design target and is based on maximum DLPC3478 power dissipation and RθJA at 0 m/s of forced airflow, where RθJA is the thermal resistance of the package as measured using a JEDEC standard high-k 2s2p PCB with two, 1-oz. power planes. This JEDEC test PCB is not necessarily representative of the DLPC3478 PCB; the reported thermal resistance may not be accurate in the actual product application. Although the actual thermal resistance may be different, it is the best information available during the design phase to estimate thermal performance. However, after the PCB is designed and the product is built, TI highly recommended that thermal performance be measured and validated.

To do this, measure the top center case temperature under the worse case product scenario (max power dissipation, max voltage, max ambient temperature) and validated not to exceed the maximum recommended case temperature (TC). This specification is based on the measured φJT for the DLPC3478 package and provides a relatively accurate correlation to junction temperature. Take care when measuring this case temperature to prevent accidental cooling of the package surface. TI recommends a small (approximately 40 gauge) thermocouple. The bead and thermocouple wire typically contact the top of the package and are covered with a minimal amount of thermally conductive epoxy. Route the wires closely along the package and the board surface to avoid cooling the bead through the wires.