SPRSP35G February   2019  – March 2021 DRA829J , DRA829V

ADVANCE INFORMATION  

  1. Features
  2. Applications
  3. Description
    1. 3.1 Functional Block Diagram
  4. Revision History
  5. Device Comparison
    1. 5.1 Related Products
  6. Terminal Configuration and Functions
    1. 6.1 Pin Diagram
    2. 6.2 Pin Attributes
    3. 6.3 Signal Descriptions
      1. 6.3.1  ADC
        1. 6.3.1.1 MCU Domain
      2. 6.3.2  DDRSS
        1. 6.3.2.1 MAIN Domain
      3. 6.3.3  GPIO
        1. 6.3.3.1 MAIN Domain
        2. 6.3.3.2 WKUP Domain
      4. 6.3.4  I2C
        1. 6.3.4.1 MAIN Domain
        2. 6.3.4.2 MCU Domain
        3. 6.3.4.3 WKUP Domain
      5. 6.3.5  I3C
        1. 6.3.5.1 MAIN Domain
        2. 6.3.5.2 MCU Domain
      6. 6.3.6  MCAN
        1. 6.3.6.1 MAIN Domain
        2. 6.3.6.2 MCU Domain
      7. 6.3.7  MCSPI
        1. 6.3.7.1 MAIN Domain
        2. 6.3.7.2 MCU Domain
      8. 6.3.8  UART
        1. 6.3.8.1 MAIN Domain
        2. 6.3.8.2 MCU Domain
        3. 6.3.8.3 WKUP Domain
      9. 6.3.9  MDIO
        1. 6.3.9.1 MCU Domain
      10. 6.3.10 CPSW2G
        1. 6.3.10.1 MCU Domain
      11. 6.3.11 CPSW9G
        1. 6.3.11.1 MAIN Domain
      12. 6.3.12 ECAP
        1. 6.3.12.1 MAIN Domain
      13. 6.3.13 EQEP
        1. 6.3.13.1 MAIN Domain
      14. 6.3.14 EHRPWM
        1. 6.3.14.1 MAIN Domain
      15. 6.3.15 USB
        1. 6.3.15.1 MAIN Domain
      16. 6.3.16 SERDES
        1. 6.3.16.1 MAIN Domain
      17. 6.3.17 OSPI
        1. 6.3.17.1 MCU Domain
      18. 6.3.18 Hyperbus
        1. 6.3.18.1 MCU Domain
      19. 6.3.19 GPMC
        1. 6.3.19.1 MAIN Domain
      20. 6.3.20 MMC
        1. 6.3.20.1 MAIN Domain
      21. 6.3.21 CPTS
        1. 6.3.21.1 MAIN Domain
      22. 6.3.22 UFS
        1. 6.3.22.1 MAIN Domain
      23. 6.3.23 PRU_ICSSG [Currently Not Supported]
        1. 6.3.23.1 MAIN Domain
      24. 6.3.24 MCASP
        1. 6.3.24.1 MAIN Domain
      25. 6.3.25 DSS
        1. 6.3.25.1 MAIN Domain
      26. 6.3.26 DP
        1. 6.3.26.1 MAIN Domain
      27. 6.3.27 Camera Streaming Interface Receiver (CSI_RX_IF) Subsystem
        1. 6.3.27.1 MAIN Domain
      28. 6.3.28 DSI_TX
        1. 6.3.28.1 MAIN Domain
      29. 6.3.29 VPFE
        1. 6.3.29.1 MAIN Domain
      30. 6.3.30 DMTIMER
        1. 6.3.30.1 MAIN Domain
        2. 6.3.30.2 MCU Domain
      31. 6.3.31 Emulation and Debug
        1. 6.3.31.1 MAIN Domain
      32. 6.3.32 System and Miscellaneous
        1. 6.3.32.1 Boot Mode Configuration
          1. 6.3.32.1.1 MAIN Domain
          2. 6.3.32.1.2 MCU Domain
        2. 6.3.32.2 Clock
          1. 6.3.32.2.1 MAIN Domain
          2. 6.3.32.2.2 WKUP Domain
        3. 6.3.32.3 System
          1. 6.3.32.3.1 MAIN Domain
          2. 6.3.32.3.2 WKUP Domain
        4. 6.3.32.4 EFUSE
      33. 6.3.33 Power Supply
    4. 6.4 Pin Multiplexing
    5. 6.5 Connections for Unused Pins
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Power-On-Hour (POH) Limits
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Operating Performance Points
    6. 7.6  Power Consumption Summary
    7. 7.7  Electrical Characteristics
      1. 7.7.1 USB2PHY Electrical Characteristics
      2. 7.7.2 SerDes 2-L-PHY/4-L-PHY Electrical Characteristics
      3. 7.7.3 UFS M-PHY Electrical Characteristics
      4. 7.7.4 eDP/DP AUX-PHY Electrical Characteristics
      5. 7.7.5 DDR0 Electrical Characteristics
    8. 7.8  VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 7.8.1 Recommended Operating Conditions for OTP eFuse Programming
      2. 7.8.2 Hardware Requirements
      3. 7.8.3 Programming Sequence
      4. 7.8.4 Impact to Your Hardware Warranty
    9. 7.9  Thermal Resistance Characteristics
      1. 7.9.1 Thermal Resistance Characteristics for ALF Package
    10. 7.10 Timing and Switching Characteristics
      1. 7.10.1 Timing Parameters and Information
      2. 7.10.2 Power Supply Sequencing
        1. 7.10.2.1 Power Supply Slew Rate Requirement
        2. 7.10.2.2 Combined MCU and Main Domains Power-Up Sequencing
        3. 7.10.2.3 Combined MCU and Main Domains Power- Down Sequencing
        4. 7.10.2.4 Independent MCU and Main Domains Power- Up Sequencing
        5. 7.10.2.5 Independent MCU and Main Domains, Primary Power- Down Sequencing
        6. 7.10.2.6 Entry and Exit of MCU Only State
        7. 7.10.2.7 Entry and Exit of DDR Retention State
      3. 7.10.3 System Timing
        1. 7.10.3.1 Reset Timing
        2. 7.10.3.2 Safety Signal Timing
        3. 7.10.3.3 Clock Timing
      4. 7.10.4 Clock Specifications
        1. 7.10.4.1 Input and Output Clocks / Oscillators
          1. 7.10.4.1.1 WKUP_OSC0 Internal Oscillator Clock Source
            1. 7.10.4.1.1.1 Load Capacitance
            2. 7.10.4.1.1.2 Shunt Capacitance
          2. 7.10.4.1.2 WKUP_OSC0 LVCMOS Digital Clock Source
          3. 7.10.4.1.3 Auxiliary OSC1 Internal Oscillator Clock Source
            1. 7.10.4.1.3.1 Load Capacitance
            2. 7.10.4.1.3.2 Shunt Capacitance
          4. 7.10.4.1.4 Auxiliary OSC1 LVCMOS Digital Clock Source
          5. 7.10.4.1.5 Auxiliary OSC1 Not Used
          6. 7.10.4.1.6 WKUP_LFOSC0 Internal Oscillator Clock Source
          7. 7.10.4.1.7 WKUP_LFOSC0 Not Used
        2. 7.10.4.2 Output Clocks
        3. 7.10.4.3 PLLs
        4. 7.10.4.4 Device Inputs and Outputs Module Clocks Frequencies
      5. 7.10.5 Peripherals
        1. 7.10.5.1  ATL
          1. 7.10.5.1.1 ATL_PCLK Timing Requirements
          2. 7.10.5.1.2 ATL_AWS[x] Timing Requirements
          3. 7.10.5.1.3 ATL_BWS[x] Timing Requirements
          4. 7.10.5.1.4 ATCLK[x] Switching Characteristics
        2. 7.10.5.2  VPFE
        3. 7.10.5.3  CPSW2G
          1. 7.10.5.3.1 CPSW2G MDIO Interface Timings
          2. 7.10.5.3.2 CPSW2G RMII Timings
            1. 7.10.5.3.2.1 CPSW2G RMII[x]_REF_CLK Timing Requirements – RMII Mode
            2. 7.10.5.3.2.2 CPSW2G RMII[x]_RXD[1:0], RMII[x]_CRS_DV, and RMII[x]_RX_ER Timing Requirements – RMII Mode
            3. 7.10.5.3.2.3 CPSW2G RMII[x]_TXD[1:0], and RMII[x]_TX_EN Switching Characteristics – RMII Mode
          3. 7.10.5.3.3 CPSW2G RGMII Timings
            1. 7.10.5.3.3.1 RGMII[x]_RXC Timing Requirements – RGMII Mode
            2. 7.10.5.3.3.2 CPSW2G Timing Requirements for RGMII[x]_RD[3:0], and RGMII[x]_RCTL – RGMII Mode
            3. 7.10.5.3.3.3 CPSW2G RGMII[x]_TXC Switching Characteristics – RGMII Mode
            4. 7.10.5.3.3.4 RGMII[x]_TD[3:0], and RGMII[x]_TX_CTL Switching Characteristics – RGMII Mode
        4. 7.10.5.4  CPSW9G
          1. 7.10.5.4.1 CPSW9G MDIO Interface Timings
          2. 7.10.5.4.2 CPSW9G RMII Timings
            1. 7.10.5.4.2.1 RMII[x]_REF_CLK Timing Requirements – RMII Mode
            2. 7.10.5.4.2.2 RMII[x]_RXD[1:0], RMII[x]_CRS_DV, and RMII[x]_RX_ER Timing Requirements – RMII Mode
            3. 7.10.5.4.2.3 RMII[x]_TXD[1:0], and RMII[x]_TXEN Switching Characteristics – RMII Mode
          3. 7.10.5.4.3 CPSW9G RGMII Timings
            1. 7.10.5.4.3.1 RGMII[x]_RXC Timing Requirements – RGMII Mode
            2. 7.10.5.4.3.2 RGMII[x]_RD[3:0] and RGMII[x]_RCTL Timing Requirements – RGMII Mode
            3. 7.10.5.4.3.3 RGMII[x]_TXC Switching Characteristics – RGMII Mode
            4. 7.10.5.4.3.4 RGMII[x]_TD[3:0] and RGMII[x]_TX_CTL Switching Characteristics – RGMII Mode
        5. 7.10.5.5  CSI-2
        6. 7.10.5.6  DDRSS
        7. 7.10.5.7  DSS
        8. 7.10.5.8  eCAP
          1. 7.10.5.8.1 Timing Requirements for eCAP
          2. 7.10.5.8.2 Switching Characteristics for eCAP
        9. 7.10.5.9  EPWM
          1. 7.10.5.9.1 Timing Requirements for eHRPWM
          2. 7.10.5.9.2 Switching Characteristics for eHRPWM
        10. 7.10.5.10 eQEP
          1. 7.10.5.10.1 Timing Requirements for eQEP
          2. 7.10.5.10.2 Switching Characteristics for eQEP
        11. 7.10.5.11 GPIO
          1. 7.10.5.11.1 GPIO Timing Requirements
          2. 7.10.5.11.2 GPIO Switching Characteristics
        12. 7.10.5.12 GPMC
          1. 7.10.5.12.1 GPMC and NOR Flash — Synchronous Mode
            1. 7.10.5.12.1.1 GPMC and NOR Flash Timing Requirements — Synchronous Mode
            2. 7.10.5.12.1.2 GPMC and NOR Flash Switching Characteristics – Synchronous Mode
          2. 7.10.5.12.2 GPMC and NOR Flash — Asynchronous Mode
            1. 7.10.5.12.2.1 GPMC and NOR Flash Timing Requirements – Asynchronous Mode
            2. 7.10.5.12.2.2 GPMC and NOR Flash Switching Characteristics – Asynchronous Mode
          3. 7.10.5.12.3 GPMC and NAND Flash — Asynchronous Mode
            1. 7.10.5.12.3.1 GPMC and NAND Flash Timing Requirements – Asynchronous Mode
            2. 7.10.5.12.3.2 GPMC and NAND Flash Switching Characteristics – Asynchronous Mode
        13. 7.10.5.13 HyperBus
          1. 7.10.5.13.1 Timing Requirements for HyperBus
          2. 7.10.5.13.2 HyperBus 166 MHz Switching Characteristics
          3. 7.10.5.13.3 HyperBus 100 MHz Switching Characteristics
        14. 7.10.5.14 I2C
        15. 7.10.5.15 I3C
        16. 7.10.5.16 MCAN
        17. 7.10.5.17 MCASP
        18. 7.10.5.18 MCSPI
          1. 7.10.5.18.1 MCSPI — Master Mode
          2. 7.10.5.18.2 MCSPI — Slave Mode
        19. 7.10.5.19 MMCSD
          1. 7.10.5.19.1 MMC0 - eMMC Interface
            1. 7.10.5.19.1.1 Legacy SDR Mode
            2. 7.10.5.19.1.2 High Speed SDR Mode
            3. 7.10.5.19.1.3 High Speed DDR Mode
            4. 7.10.5.19.1.4 HS200 Mode
          2. 7.10.5.19.2 MMC1/2 - SD/SDIO Interface
            1. 7.10.5.19.2.1 Default Speed Mode
            2. 7.10.5.19.2.2 High Speed Mode
            3. 7.10.5.19.2.3 UHS–I SDR12 Mode
            4. 7.10.5.19.2.4 UHS–I SDR25 Mode
            5. 7.10.5.19.2.5 UHS–I SDR50 Mode
            6. 7.10.5.19.2.6 UHS–I DDR50 Mode
        20. 7.10.5.20 CPTS
          1. 7.10.5.20.1 CPTS Timing Requirements
          2. 7.10.5.20.2 CPTS Switching Characteristics
        21. 7.10.5.21 OSPI
          1. 7.10.5.21.1 OSPI With Data Training
            1. 7.10.5.21.1.1 OSPI Switching Characteristics – Data Training
          2. 7.10.5.21.2 OSPI Without Data Training
            1. 7.10.5.21.2.1 OSPI Switching Characteristics – DDR Mode
            2. 7.10.5.21.2.2 OSPI Switching Characteristics – SDR Mode
            3. 7.10.5.21.2.3 OSPI Timing Requirements – DDR Mode
            4. 7.10.5.21.2.4 OSPI Timing Requirements – SDR Mode
        22. 7.10.5.22 OLDI
          1. 7.10.5.22.1 OLDI Switching Characteristics
        23. 7.10.5.23 PCIE
        24. 7.10.5.24 Timers
          1. 7.10.5.24.1 Timing Requirements for Timers
          2. 7.10.5.24.2 Switching Characteristics for Timers
        25. 7.10.5.25 UART
          1. 7.10.5.25.1 Timing Requirements for UART
          2. 7.10.5.25.2 UART Switching Characteristics
        26. 7.10.5.26 USB
      6. 7.10.6 Emulation and Debug
        1. 7.10.6.1 Trace
        2. 7.10.6.2 JTAG
          1. 7.10.6.2.1 JTAG Electrical Data and Timing
            1. 7.10.6.2.1.1 JTAG Timing Requirements
            2. 7.10.6.2.1.2 JTAG Switching Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Processor Subsystems
      1. 8.2.1 Arm Cortex-A72
      2. 8.2.2 Arm Cortex-R5F
      3. 8.2.3 DSP C71x
      4. 8.2.4 DSP C66x
    3. 8.3 Accelerators and Coprocessors
      1. 8.3.1 GPU
      2. 8.3.2 D5520MP2
      3. 8.3.3 VXE384MP2
    4. 8.4 Other Subsystems
      1. 8.4.1 MSMC
      2. 8.4.2 NAVSS
        1. 8.4.2.1 NAVSS0
        2. 8.4.2.2 MCU_NAVSS
        3. 8.4.2.3
      3. 8.4.3 PDMA Controller
      4. 8.4.4 Peripherals
        1. 8.4.4.1  ADC
        2. 8.4.4.2  ATL
        3. 8.4.4.3  CSI
          1. 8.4.4.3.1 Camera Streaming Interface Receiver (CSI_RX_IF) and MIPI DPHY Receiver (DPHY_RX)
          2. 8.4.4.3.2 Camera Streaming Interface Transmitter (CSI_TX_IF)
        4. 8.4.4.4  CPSW2G
        5. 8.4.4.5  CPSW9G
        6. 8.4.4.6  DCC
        7. 8.4.4.7  DDRSS
        8. 8.4.4.8  DSS
          1. 8.4.4.8.1 DSI
          2. 8.4.4.8.2 eDP
        9. 8.4.4.9  VPFE
        10. 8.4.4.10 eCAP
        11. 8.4.4.11 EPWM
        12. 8.4.4.12 ELM
        13. 8.4.4.13 ESM
        14. 8.4.4.14 eQEP
        15. 8.4.4.15 GPIO
        16. 8.4.4.16 GPMC
        17. 8.4.4.17 Hyperbus
        18. 8.4.4.18 I2C
        19. 8.4.4.19 I3C
        20. 8.4.4.20 MCAN
        21. 8.4.4.21 MCASP
        22. 8.4.4.22 MCRC Controller
        23. 8.4.4.23 MCSPI
        24. 8.4.4.24 MMC/SD
        25. 8.4.4.25 OSPI
        26. 8.4.4.26 PCIE
        27. 8.4.4.27 SerDes
        28. 8.4.4.28 WWDT
        29. 8.4.4.29 Timers
        30. 8.4.4.30 UART
        31. 8.4.4.31 USB
        32. 8.4.4.32 UFS
  9. Applications and Implementation
    1. 9.1 Power Supply Mapping
    2. 9.2 Device Connection and Layout Fundamentals
      1. 9.2.1 Power Supply Decoupling and Bulk Capacitors
        1. 9.2.1.1 Power Distribution Network Implementation Guidance
      2. 9.2.2 External Oscillator
      3. 9.2.3 JTAG and EMU
      4. 9.2.4 Reset
      5. 9.2.5 Unused Pins
      6. 9.2.6 Hardware Design Guide for AM752x/DRA829/TDA4VM Devices
    3. 9.3 Peripheral- and Interface-Specific Design Information
      1. 9.3.1 LPDDR4 Board Design and Layout Guidelines
      2. 9.3.2 OSPI and QSPI Board Design and Layout Guidelines
        1. 9.3.2.1 No Loopback and Internal Pad Loopback
        2. 9.3.2.2 External Board Loopback
        3. 9.3.2.3 DQS (only available in Octal Flash devices)
      3. 9.3.3 SERDES REFCLK Design Guidelines
      4. 9.3.4 USB VBUS Design Guidelines
      5. 9.3.5 System Power Supply Monitor Design Guidelines
      6. 9.3.6 High Speed Differential Signal Routing Guidance
      7. 9.3.7 External Capacitors
      8. 9.3.8 Thermal Solution Guidance
  10. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
      1. 10.1.1 Standard Package Symbolization
      2. 10.1.2 Device Naming Convention
    2. 10.2 Tools and Software
    3. 10.3 Documentation Support
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Glossary
  11. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ(パッケージ|ピン)
  • ALF|827
サーマルパッド・メカニカル・データ
発注情報

Revision History

Changes from December 15, 2020 to March 31, 2021 (from Revision F (December 2020) to Revision G (March 2021))

  • (Device Comparison): Removed DEVICE_ID rowGo
  • (Pin Attributes): Updated PU/PD type for SERDES, ADC12B, MLB, DPHY, 2LPHY, USB2PHY, MPHY, LFOSC, HFOSC, AUXPHY buffersGo
  • (CPSW2G): Added a Note with a reference to the CPTS Signal Descriptions table, as part of the SubsystemGo
  • Updated pin type for USB0/1_RCALIBGo
  • Updated title of CSI-2 interface in Signal DescriptionsGo
  • Added description for PMIC_POWER_EN0 in System0 Signal Descriptions tableGo
  • Updated pin type for VDDA_TEMP0_1, VDDA_TEMP2_3, VDDA_ADC0/1. Also updated descriptions for the temp sensor analog suppliesGo
  • (Pin Multiplexing): Updated WKUP_PADCONFIG register addresses in Pin Multiplexing table to show 0x4301C* addresses Go
  • Deleted Note referencing PRU_ICSSG, as the interface is not supported Go
  • Updated Latch-Up Performance mode description in Abs Max RatingsGo
  • Added a row under ESD parameter for corner pinsGo
  • (ESD Ratings): Updated/Changed the table to reflect AEC-Q100 Automotive specifications including corner pins CDM values.Go
  • Updated USB0_VBUS, USB1_VBUS recommended operating conditions valuesGo
  • Updated MIN values for VDDA_0P8_DLL_MMC0, VDDAR_CORE, VDDAR_MCU, and VDDAR_CPU. Go
  • Updated description for temp sensor analog supplies Go
  • (Speed Grade Maximum Frequency): Removed ICSS-G supportGo
  • Updated VIH, VIDTH, and VIDTL in the D-PHY Electrical Characteristics to reflect 2.5 GHz specification. Updated ADC12B Electrical Characteristics : removed TBD from SMPL_CLK parameter and moved 60 MHz from MAX column to TYP columnGo
  • Updated Iol limit in I2C Open Drain, Fail-Safe Electrical Characteristics table. Updated VDDA_ADC0/1 input leakage current limit in ADC12B Electrical Characteristics table. Go
  • Updated LVCMOS Electrical Characteristics table; added steady state voltage level for Vih and vilGo
  • Updated MLB Electrical Characteristics table to reflect LVCMOS characteristics as only GPIO mode is supported on this deviceGo
  • (System Timing): Added section (new)Go
  • (Reset Timing): Updated/Changed section including Timing Requirements tables, associated figures, addition of footnotes/notesGo
  • (WKUP_OSC0 Internal Oscillator Clock Source): Updated oscillator start-up time parameter description and value, and added a note to work with resonator/crystal vendors for validation Go
  • (OSC1 Crystal Electrical Characteristics Table): Updated OSC1 frequencies from finite values to a range from 19.2 MHz to 27 MHzGo
  • (WKUP_OSC0 Internal Oscillator Clock Source): Updated oscillator start-up time parameter description and value, and added a note to work with resonator/crystal vendors for validation Go
  • Removed note linked to WKUP_LFOSC0 Start Up TimeGo
  • Updated "PLL" and "Accelerators and Coprocessors" section and removed references to PRU_ICSS_GGo
  • Updated ATL parameter name in Timing Conditions, Timing Requirements, and Switching Characteristics table. Also updated reference modes for each parameters Go
  • (VPFE): Updated/Changed LVDSRX timing table and renamed as VPFE to maintain naming consistencyGo
  • (VPFE): Updated/Changed LVDSRX Input Timings imageGo
  • Updated parameter and diagrams for Timing Conditions, Timing Requirements, and Switching Characteristics for CPSW2G MDIO, RMII, RGMII modesGo
  • Updated/Changed timing tables, timing diagrams, and MDIO7 parameter table values.Go
  • Updated CPSW9G Timing Conditions table and Switching Characteristics table parameter namesGo
  • Updated CSI-2 section description to retain naming consistency with TRMGo
  • Updated DSS timing contidions, timing requirements, and switching characteristics tableGo
  • Updated parameter values and descriptions in ECAP timing and switching conditions tablesGo
  • Updated parameter and description in ePWM timing and switching characteristics requirementsGo
  • Updated eQEP timing and switching characteristics tableGo
  • Updated GPIO Timing Conditions, Timing Requirements, and Switching Characteristics tableGo
  • (GPMC) Updated GPMC Mode column and removed references to GPMC_FCLK_MUX, TIMEPARAGRANULARITY_X1. Updated note to show how to select CLK_SEL based on frequency. Updated GPMC_WAIT[j] description to show j =0, 1, 2, and 3. Go
  • Added PCB Requirements to HyperBus Timing Conditions tableGo
  • Updated timing parameter value, descriptions, and diagrams in Section 7.10.5.13, HyperBus Go
  • Removed I2C Timing Requirements table and indicated comformance to Philips I2C Bus Specification, rev 2.1Go
  • (I3C): Updated parameter names for both Open Drain and Push-Pull. Section reformatted into three tables: Timing Conditions, Timing Requirements. and Switching Characteristics with associated figures.Go
  • Updated parameter names and format in MCAN Timing Conditions and Switching Characteristics TableGo
  • Updated parameter description and added PCB Connectivity Requirements for MCASP timing conditions table. Updated timing requirements and switching characteristics table AHCLKR/X and ACLKR/X values and table formatGo
  • Updated parameter descriptions and formatting in timing conditions, timing requirements, and switching characteristics tables of MCSPI. Also removed notes that are not applicableGo
  • Updated MMC0 and MMC1/2 Timing Conditions, Timing Requirements and Switching Characteristics Tables for all modesGo
  • Updated input slew rate, output load, and PCB requirements in MMC0 Timing Conditions table. Also relaxd some values in Timing Requirements and Switching Characteristics TableGo
  • Updated/Changed title from "NAVSS" to "CPTS"Go
  • (CPTS): Updated/Change "NAVSS" section title to "CPTS"Go
  • (CPTS Timing Requirements): Updated/Changed Timing Reqirements section title, table, and associated figureGo
  • (CPTS Output): Updated/Changed Switching Characteristics title, table, and associated figureGo
  • Updated parameter names in Timers Timing Conditions tableGo
  • Updated UART Timing Conditions table parameter symbolsGo
  • Updated parameter timing descriptions in Timing Requirements for UART, Timing Requirements for UART , Section 7.10.5.25.2, Switching Characteristics Over Recommended Operating Conditions for UART, and added CTSn in timing diagramGo
  • (Trace) Renamed "Debug Trace" to "Trace," added PCB Connectivity Requirement and updated table formattingGo
  • Updated IEEE1149.1 JTAG chapter title to JTAG and added link referencing timing diagramGo
  • Removed AASRC section infoGo
  • (USB VBUS Design Guidelines): Added textnote to USB VBUS Detect Voltage Divider / Clamp Circuit figureGo