JAJSCW7D January   2016  – November 2018 DRV8884

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      概略回路図
      2.      マイクロステッピング電流の波形
  4. 4 改訂履歴
  5. 5 概要（続き）
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Indexer Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Stepper Motor Driver Current Ratings
        1. 8.3.1.1 Peak Current Rating
        2. 8.3.1.2 RMS Current Rating
        3. 8.3.1.3 Full-Scale Current Rating
      2. 8.3.2  PWM Motor Drivers
      3. 8.3.3  Microstepping Indexer
      4. 8.3.4  Current Regulation
      5. 8.3.5  Controlling RREF With an MCU DAC
      6. 8.3.6  Decay Modes
        1. 8.3.6.1 Mode 1: Slow Decay for Increasing and Decreasing Current
        2. 8.3.6.2 Mode 2: Slow Decay for Increasing Current, Mixed Decay for Decreasing Current
        3. 8.3.6.3 Mode 3: Mixed Decay for Increasing and Decreasing Current
      7. 8.3.7  Blanking Time
      8. 8.3.8  Charge Pump
      9. 8.3.9  LDO Voltage Regulator
      10. 8.3.10 Logic and Multi-Level Pin Diagrams
      11. 8.3.11 Protection Circuits
        1. 8.3.11.1 VM UVLO
        2. 8.3.11.2 VCP Undervoltage Lockout (CPUV)
        3. 8.3.11.3 Overcurrent Protection (OCP)
        4. 8.3.11.4 Thermal Shutdown (TSD)
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Stepper Motor Speed
        2. 9.2.2.2 Current Regulation
        3. 9.2.2.3 Decay Modes
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Bulk Capacitance
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 ドキュメントのサポート
      1. 12.1.1 関連資料
    2. 12.2 ドキュメントの更新通知を受け取る方法
    3. 12.3 コミュニティ・リソース
    4. 12.4 商標
    5. 12.5 静電気放電に関する注意事項
    6. 12.6 Glossary
  13. 13メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

11.1 Layout Guidelines

The VM terminal should be bypassed to GND using a low-ESR ceramic bypass capacitor with a recommended value of 0.01 µF rated for VM. This capacitor should be placed as close to the VM pin as possible with a thick trace or ground plane connection to the device GND pin.

The VM pin must be bypassed to ground using a bulk capacitor rated for VM. This component may be an electrolytic.

A low-ESR ceramic capacitor must be placed in between the CPL and CPH pins. TI recommends a value of 0.022 µF rated for VM. Place this component as close as possible to the pins.

A low-ESR ceramic capacitor must be placed in between the VM and VCP pins. TI recommends a value of 0.22 µF rated for 16 V. Place this component as close as possible to the pins.

Bypass AVDD and DVDD to ground with a ceramic capacitor rated 6.3 V. Place this bypassing capacitor as close as possible to the pin.