JAJSCX0C October   2015  – November 2018 DRV8885

PRODUCTION DATA.  

  1. 特長
  2. アプリケーション
  3. 概要
    1.     Device Images
      1.      概略回路図
      2.      マイクロステッピング電流の波形
  4. 改訂履歴
  5. 概要(続き)
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Indexer Timing Requirements
    7. 7.7 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Stepper Motor Driver Current Ratings
        1. 8.3.1.1 Peak Current Rating
        2. 8.3.1.2 RMS Current Rating
        3. 8.3.1.3 Full-Scale Current Rating
      2. 8.3.2  PWM Motor Drivers
      3. 8.3.3  Microstepping Indexer
      4. 8.3.4  Current Regulation
      5. 8.3.5  Controlling RREF With an MCU
      6. 8.3.6  Decay Modes
        1. 8.3.6.1 Mode 1: Slow Decay for Increasing and Decreasing Current
        2. 8.3.6.2 Mode 2: Slow Decay for Increasing Current, Mixed Decay for Decreasing Current
        3. 8.3.6.3 Mode 3: Mixed Decay for Increasing and Decreasing Current
      7. 8.3.7  Blanking Time
      8. 8.3.8  Charge Pump
      9. 8.3.9  LDO Voltage Regulator
      10. 8.3.10 Logic and Multi-Level Pin Diagrams
      11. 8.3.11 Protection Circuits
        1. 8.3.11.1 VM Undervoltage Lockout (UVLO)
        2. 8.3.11.2 VCP Undervoltage Lockout (CPUV)
        3. 8.3.11.3 Overcurrent Protection (OCP)
        4. 8.3.11.4 Thermal Shutdown (TSD)
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Stepper Motor Speed
        2. 9.2.2.2 Current Regulation
        3. 9.2.2.3 Decay Modes
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Bulk Capacitance
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 ドキュメントのサポート
      1. 12.1.1 関連資料
    2. 12.2 ドキュメントの更新通知を受け取る方法
    3. 12.3 コミュニティ・リソース
    4. 12.4 商標
    5. 12.5 静電気放電に関する注意事項
    6. 12.6 Glossary
  13. 13メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

改訂履歴

Changes from B Revision (July 2018) to C Revision

  • Changed デバイスのステータスを「事前情報」から「量産データ」にGo

Changes from A Revision (April 2016) to B Revision

  • Added WQFNパッケージ・オプションGo
  • Deleted and internal indexer from the description of the ENABLE pin in the Pin Functions tableGo
  • Changed until ENABLE is deasserted to until ENABLE is asserted in the Device Functional Modes sectionGo
  • Added 「ドキュメントの更新通知を受け取る方法」セクションGo

Changes from * Revision (October 2015) to A Revision

  • Updated peak drive current based on OCPGo
  • Updated RPD and RPU values Go
  • Fixed chopping current equationGo
  • Added "Controlling RREF with a PWM Resource"Go
  • Fixed resistance values in tri-level input pin diagramGo