JAJSDM1E August   2017  – March 2019 ISO7760 , ISO7761 , ISO7762 , ISO7763

PRODUCTION DATA.  

  1. 特長
  2. アプリケーション
  3. 概要
    1.     概略回路図
  4. 改訂履歴
  5. 概要(続き)
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Ratings
    6. 7.6  Insulation Specifications
    7. 7.7  Safety-Related Certifications
    8. 7.8  Safety Limiting Values
    9. 7.9  Electrical Characteristics—5-V Supply
    10. 7.10 Supply Current Characteristics—5-V Supply
    11. 7.11 Electrical Characteristics—3.3-V Supply
    12. 7.12 Supply Current Characteristics—3.3-V Supply
    13. 7.13 Electrical Characteristics—2.5-V Supply
    14. 7.14 Supply Current Characteristics—2.5-V Supply
    15. 7.15 Switching Characteristics—5-V Supply
    16. 7.16 Switching Characteristics—3.3-V Supply
    17. 7.17 Switching Characteristics—2.5-V Supply
    18. 7.18 Insulation Characteristics Curves
    19. 7.19 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 9.4 Device Functional Modes
      1. 9.4.1 Device I/O Schematics
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
        1. 10.2.3.1 Insulation Lifetime
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 PCB Material
    2. 12.2 Layout Example
  13. 13デバイスおよびドキュメントのサポート
    1. 13.1 ドキュメントのサポート
      1. 13.1.1 関連資料
    2. 13.2 関連リンク
    3. 13.3 ドキュメントの更新通知を受け取る方法
    4. 13.4 コミュニティ・リソース
    5. 13.5 商標
    6. 13.6 静電気放電に関する注意事項
    7. 13.7 Glossary
  14. 14メカニカル、パッケージ、および注文情報

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ(パッケージ|ピン)
  • DBQ|16
  • DW|16
サーマルパッド・メカニカル・データ
発注情報

Safety Limiting Values

Safety limiting intends to minimize potential damage to the isolation barrier upon failure of input or output circuitry.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
DW-16 PACKAGE
IS Safety input, output, or supply current(1) RθJA = 60.3 °C/W, VI = 5.5 V, TJ = 150°C, TA = 25°C,
see Figure 1
377 mA
RθJA = 60.3 °C/W, VI = 3.6 V, TJ = 150°C, TA = 25°C,
see Figure 1
576
RθJA = 60.3 °C/W, VI = 2.75 V, TJ = 150°C, TA = 25°C,
see Figure 1
754
PS Safety input, output, or total power(1) RθJA = 60.3 °C/W, TJ = 150°C, TA = 25°C, see Figure 3 2073 mW
TS Maximum safety temperature(1) 150 °C
DBQ-16 PACKAGE
IS Safety input, output, or supply current(1) RθJA = 86.5 °C/W, VI = 5.5 V, TJ = 150°C, TA = 25°C,
see Figure 2
263 mA
RθJA = 86.5 °C/W, VI = 3.6 V, TJ = 150°C, TA = 25°C,
see Figure 2
401
RθJA = 86.5 °C/W, VI = 2.75 V, TJ = 150°C, TA = 25°C,
see Figure 2
525
PS Safety input, output, or total power(1) RθJA = 86.5 °C/W, TJ = 150°C, TA = 25°C, see Figure 4 1445 mW
TS Maximum safety temperature(1) 150 °C
The maximum safety temperature, TS, has the same value as the maximum junction temperature, TJ, specified for the device. The IS and PS parameters represent the safety current and safety power respectively. The maximum limits of IS and PS should not be exceeded. These limits vary with the ambient temperature, TA.
 
The junction-to-air thermal resistance, RθJA, in the Thermal Information table is that of a device installed on a high-K test board for leaded surface-mount packages. Use these equations to calculate the value for each parameter:
 
TJ = TA + RθJA × P, where P is the power dissipated in the device.
 
TJ(max) = TS = TA + RθJA × PS, where TJ(max) is the maximum allowed junction temperature.
 
PS = IS × VI, where VI is the maximum input voltage.