SNVS188I May   2004  – October 2017 LM2623

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration And Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Gated Oscillator Control Scheme.
      2. 7.3.2 Cycle-To-Cycle Pfm
      3. 7.3.3 Shutdown
      4. 7.3.4 Internal Current Limit And Thermal Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Pulse Frequency Modulation (Pfm)
      2. 7.4.2 Low Voltage Start-Up
  8. 8 Applications And Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Non-Linear Effect
        2. 8.2.2.2 Choosing The Correct C3 Capacitor
        3. 8.2.2.3 Setting The Output Voltage
        4. 8.2.2.4 VDD Supply
        5. 8.2.2.5 Setting The Switching Frequency
        6. 8.2.2.6 Output Diode Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Boost Output Capacitor Placement
      2. 10.1.2 Schottky Diode Placement
      3. 10.1.3 Boost Input / VDD Capacitor Placement
    2. 10.2 Layout Example
    3. 10.3 WSON Package Devices
  11. 11Device And Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, And Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

4 Revision History

Changes from H Revision (November 2014) to I Revision

  • Changed Handling Ratings table to ESD Ratings to comply with current formatGo
  • Moved Storage temperature spec to Abs Max table Go
  • Added separate row for SW pin HBM ESD rating Go
  • Added condition to Recommended Operating Conditions table Go
  • Changed Updated RθJA value for NHE package from "40 – 56" to "46.5"°C/W and DGK package from "240" to 152.5" °C/W; added additional thermal informationGo

Changes from G Revision (December 2005) to H Revision

  • Added Device Information and Handling Rating tables, Feature Description, Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sections; moved some curves to Application Curves sectionGo