JAJSAY9L February   2009  – May 2018 LM26420

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      LM26420デュアル降圧DC/DCコンバータ
      2.      LM26420の効率(最高93%)
  4. 4 改訂履歴
  5. 5 Pin Configuration and Functions
    1.     Pin Functions: 16-Pin WQFN
    2.     Pin Functions 20-Pin HTSSOP
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings (LM26420X/Y)
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics Per Buck
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Soft Start
      2. 7.3.2 Power Good
      3. 7.3.3 Precision Enable
    4. 7.4 Device Functional Modes
      1. 7.4.1 Output Overvoltage Protection
      2. 7.4.2 Undervoltage Lockout
      3. 7.4.3 Current Limit
      4. 7.4.4 Thermal Shutdown
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Programming Output Voltage
      2. 8.1.2 VINC Filtering Components
      3. 8.1.3 Using Precision Enable and Power Good
      4. 8.1.4 Overcurrent Protection
    2. 8.2 Typical Applications
      1. 8.2.1 LM26420X 2.2-MHz, 0.8-V Typical High-Efficiency Application Circuit
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Custom Design With WEBENCH® Tools
          2. 8.2.1.2.2 Inductor Selection
          3. 8.2.1.2.3 Input Capacitor Selection
          4. 8.2.1.2.4 Output Capacitor
          5. 8.2.1.2.5 Calculating Efficiency and Junction Temperature
        3. 8.2.1.3 Application Curves
      2. 8.2.2 LM26420X 2.2-MHz, 1.8-V Typical High-Efficiency Application Circuit
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
      3. 8.2.3 LM26420X 2.2-MHz, 2.5-V Typical High-Efficiency Application Circuit
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
        3. 8.2.3.3 Application Curves
      4. 8.2.4 LM26420Y 550 kHz, 0.8-V Typical High-Efficiency Application Circuit
        1. 8.2.4.1 Design Requirements
        2. 8.2.4.2 Detailed Design Procedure
        3. 8.2.4.3 Application Curves
      5. 8.2.5 LM26420Y 550-kHz, 1.8-V Typical High-Efficiency Application Circuit
        1. 8.2.5.1 Design Requirements
        2. 8.2.5.2 Detailed Design Procedure
        3. 8.2.5.3 Application Curves
      6. 8.2.6 LM26420Y 550-kHz, 2.5-V Typical High-Efficiency Application Circuit
        1. 8.2.6.1 Design Requirements
        2. 8.2.6.2 Detailed Design Procedure
        3. 8.2.6.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
      1. 10.3.1 Method 1: Silicon Junction Temperature Determination
      2. 10.3.2 Thermal Shutdown Temperature Determination
  11. 11デバイスおよびドキュメントのサポート
    1. 11.1 デバイス・サポート
      1. 11.1.1 デベロッパー・ネットワークの製品に関する免責事項
      2. 11.1.2 WEBENCH®ツールによるカスタム設計
    2. 11.2 ドキュメントのサポート
      1. 11.2.1 関連資料
    3. 11.3 ドキュメントの更新通知を受け取る方法
    4. 11.4 コミュニティ・リソース
    5. 11.5 商標
    6. 11.6 静電気放電に関する注意事項
    7. 11.7 Glossary
  12. 12メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

4 改訂履歴

Changes from K Revision (April 2016) to L Revision

  • 車載用データシートを別のドキュメント(SNVSB35)に分離し、SNVS579からは車載用固有の内容を削除Go
  • Added WEBENCHへのリンクGo

Changes from J Revision (September 2015) to K Revision

  • Changed RθJA value from 35°C/W to 38.5°C/W for PWP package and from 40°C/W to 36.2°C/W; replaced RθJC values with 2 new rows (and new values); added additional thermal valuesGo
  • Changed "C1" to "C2" on Figure 42Go
  • Changed "C1" to "C2" on Figure 51Go
  • Deleted "C7" and "C8" from Table 6 Go

Changes from I Revision (June 2015) to J Revision

  • fixed error in WQFN Pin Functions - shifted "Description" column down one row and added back description for VIND1 pinGo
  • Changed reference from "Typical Applications" to "Table 1". Go
  • Deleted definition for RDS (not part of equation 15) Go

Changes from H Revision (August 2014) to I Revision

  • Changed 「特長」にCISPR25の箇条書きを追加、タイトルの「周波数」を「効率」にGo
  • Changed moved Storage temperature to Absolute Maximum Ratings tableGo
  • Changed figure 36 caption Go
  • Added part number to caption wordingGo
  • Added application note Go
  • Changed title of Thermal Guidelines to Thermal Considerations and moved the section to the correct location.Go
  • Added 「関連資料」および「コミュニティ・リソース」サブセクションGo

Changes from G Revision (July 2014) to H Revision

  • Changed percent sign to suffix Go

Changes from F Revision (March 2013) to G Revision

  • Changed 新しいTIデータシートのガイドラインに合わせてフォーマットを変更、「製品情報」表、「取り扱い定格」表、「レイアウト」セクション、「デバイスおよびドキュメントのサポート」セクションを追加、「機能説明」を「詳細説明」に、「アプリケーション」を「アプリケーションと実装」セクションに形式をGo
  • Changed to new equationGo