SBOS730A April   2015  – May 2015 LMH6401

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Options
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 SPI Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Setup Diagrams
    2. 8.2 Output Measurement Reference Points
    3. 8.3 ATE Testing and DC Measurements
    4. 8.4 Frequency Response
    5. 8.5 Distortion
    6. 8.6 Noise Figure
    7. 8.7 Pulse Response, Slew Rate, and Overdrive Recovery
    8. 8.8 Power Down
    9. 8.9 VOCM Frequency Response
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
    4. 9.4 Device Functional Modes
      1. 9.4.1 Power-On Reset (POR)
      2. 9.4.2 Power-Down (PD)
      3. 9.4.3 Thermal Feedback Control
      4. 9.4.4 Gain Control
    5. 9.5 Programming
      1. 9.5.1 Details of the Serial Interface
      2. 9.5.2 Timing Diagrams
    6. 9.6 Register Maps
      1. 9.6.1 Revision ID (address = 0h, Read-Only) [default = 03h]
      2. 9.6.2 Product ID (address = 1h, Read-Only) [default = 00h]
      3. 9.6.3 Gain Control (address = 2h) [default = 20h]
      4. 9.6.4 Reserved (address = 3h) [default = 8Ch]
      5. 9.6.5 Thermal Feedback Gain Control (address = 4h) [default = 27h]
      6. 9.6.6 Thermal Feedback Frequency Control (address = 5h) [default = 45h]
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Analog Input Characteristics
      2. 10.1.2 Analog Output Characteristics
        1. 10.1.2.1 Driving Capacitive Loads
      3. 10.1.3 Thermal Feedback Control
        1. 10.1.3.1 Step Response Optimization using Thermal Feedback Control
      4. 10.1.4 Thermal Considerations
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Driving ADCs
          1. 10.2.2.1.1 SNR Considerations
          2. 10.2.2.1.2 SFDR Considerations
          3. 10.2.2.1.3 ADC Input Common-Mode Voltage Considerations—AC-Coupled Input
          4. 10.2.2.1.4 ADC Input Common-Mode Voltage Considerations—DC-Coupled Input
      3. 10.2.3 Application Curves
    3. 10.3 Do's and Don'ts
      1. 10.3.1 Do:
      2. 10.3.2 Don't:
  11. 11Power-Supply Recommendations
    1. 11.1 Single-Supply Operation
    2. 11.2 Split-Supply Operation
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Examples
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Community Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

13 Device and Documentation Support

13.1 Documentation Support

13.1.1 Related Documentation

For related documentation see the following:

  • ADS12D1800RF Data Sheet, SNAS518
  • ADC12J1600, ADC12J2700 Data Sheet, SLAS969
  • ADC12J4000 Data Sheet, SLAS989
  • ADS54J40 Data Sheet, SBAS714
  • ADS54J60 Data Sheet, SBAS706
  • LMH3401 Data Sheet, SBOS695
  • LMH5401 Data Sheet, SBOS710
  • LMH6517 Data Sheet, SNOSB19
  • LMH6521 Data Sheet, SNOSB47
  • LMH6554 Data Sheet, SNOSB30
  • LMH6881 Data Sheet, SNOSC72
  • LMR70503 Data Sheet, SNVS850
  • TPS72301 Data Sheet, SLVS346
  • AN-2188 Between the Amplifier and the ADC: Managing Filter Loss in Communications Systems, SNOA567
  • AN-2235 Circuit Board Design for LMH6517/21/22 and Other High-Speed IF/RF Feedback Amplifiers, SNOA869
  • LMH6401EVM Evaluation Module, SLOU406

13.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

13.3 Trademarks

E2E is a trademark of Texas Instruments.

Marki is a trademark of Marki Microwave, Inc.

SPI is a trademark of Motorola Mobility LLC.

All other trademarks are the property of their respective owners.

13.4 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

13.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.