JAJSFB8D January   2016  – Feburary 2019 MUX36D04 , MUX36S08

PRODUCTION DATA.  

  1. 特長
  2. アプリケーション
  3. 概要
    1.     Device Images
      1.      概略回路図
      2.      リーク電流と温度
  4. 改訂履歴
  5. 概要(続き)
  6. Device Comparison Table
  7. Pin Configuration and Functions
    1.     Pin Functions: MUX36S08
    2.     Pin Functions: MUX36D04
  8. Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics: Dual Supply
    6. 8.6 Electrical Characteristics: Single Supply
    7. 8.7 Typical Characteristics
  9. Parameter Measurement Information
    1. 9.1  Truth Tables
    2. 9.2  On-Resistance
    3. 9.3  Off-Leakage Current
    4. 9.4  On-Leakage Current
    5. 9.5  Differential On-Leakage Current
    6. 9.6  Transition Time
    7. 9.7  Break-Before-Make Delay
    8. 9.8  Turn-On and Turn-Off Time
    9. 9.9  Charge Injection
    10. 9.10 Off Isolation
    11. 9.11 Channel-to-Channel Crosstalk
    12. 9.12 Bandwidth
    13. 9.13 THD + Noise
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1 Ultralow Leakage Current
      2. 10.3.2 Ultralow Charge Injection
      3. 10.3.3 Bidirectional Operation
      4. 10.3.4 Rail-to-Rail Operation
    4. 10.4 Device Functional Modes
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
      2. 11.2.2 Detailed Design Procedure
      3. 11.2.3 Application Curve
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Example
  14. 14デバイスおよびドキュメントのサポート
    1. 14.1 ドキュメントのサポート
      1. 14.1.1 関連資料
    2. 14.2 関連リンク
    3. 14.3 ドキュメントの更新通知を受け取る方法
    4. 14.4 コミュニティ・リソース
    5. 14.5 商標
    6. 14.6 静電気放電に関する注意事項
    7. 14.7 Glossary
  15. 15メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Thermal Information

THERMAL METRIC(1) MUX36S08 and MUX36D04 UNIT
PW (TSSOP) RUM (WQFN) RRJ (WQFN)
16 PINS 16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 103.8 37.3 46.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 36.8 31.6 37.7 °C/W
RθJB Junction-to-board thermal resistance 49.8 16.2 21.7 °C/W
ψJT Junction-to-top characterization parameter 2.7 0.5 0.7 °C/W
ψJB Junction-to-board characterization parameter 49.1 16.2 21.7 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A 6.1 6.2 °C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.