SBOS477B December   2011  – December 2016 OPA1652 , OPA1654

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: OPA1652
    5. 6.5 Thermal Information: OPA1654
    6. 6.6 Electrical Characteristics: VS = ±15 V
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Phase Reversal Protection
      2. 7.3.2 Input Protection
      3. 7.3.3 Electrical Overstress
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operating Voltage
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Noise Performance
      2. 8.1.2 Total Harmonic Distortion Measurements
      3. 8.1.3 Capacitive Loads
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Power Dissipation
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 TINA-TI™ (Free Software Download)
        2. 11.1.1.2 DIP Adapter EVM
        3. 11.1.1.3 Universal Operational Amplifier EVM
        4. 11.1.1.4 Smart Amplifier Speaker Characterization Board Evaluation Module
        5. 11.1.1.5 TI Precision Designs
        6. 11.1.1.6 WEBENCH Filter Designer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Community Resource
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

4 Revision History

Changes from A Revision (August 2016) to B Revision

  • Added new SON (8) package and body size information to Device Information tableGo
  • Added new pinout drawing for OPA1652 DRG (WSON) package Go
  • Added thermal information for the DRG (WSON) package in the Thermal Information tableGo