JAJS198K October   2006  – September 2018 OPA211

PRODUCTION DATA.  

  1. 特長
  2. アプリケーション
  3. 概要
    1.     Device Images
      1.      入力電圧ノイズ密度と周波数との関係
  4. 改訂履歴
  5. 概要(続き)
  6. Pin Configuration and Functions
    1.     Pin Functions: OPA211
    2.     Pin Functions: OPA2211
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information: OPA211
    5. 7.5 Thermal Information: OPA2211
    6. 7.6 Electrical Characteristics: VS = ±2.25 to ±18 V (OPAx211)
    7. 7.7 Electrical Characteristics: VS = ±2.25 to ±18 V for High-Grade OPAx211
    8. 7.8 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Total Harmonic Distortion Measurements
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Operating Voltage
      2. 9.1.2 Input Protection
      3. 9.1.3 Noise Performance
      4. 9.1.4 Basic Noise Calculations
      5. 9.1.5 EMI Rejection
      6. 9.1.6 EMIRR +IN Test Configuration
      7. 9.1.7 Electrical Overstress
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 SON Layout Guidelines
    2. 11.2 Layout Example
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 デバイス・サポート
      1. 12.1.1 開発サポート
        1. 12.1.1.1 TINA-TI(無料のダウンロード・ソフトウェア)
        2. 12.1.1.2 TI Precision Designs
        3. 12.1.1.3 WEBENCH Filter Designer
    2. 12.2 ドキュメントのサポート
      1. 12.2.1 関連資料
    3. 12.3 関連リンク
    4. 12.4 ドキュメントの更新通知を受け取る方法
    5. 12.5 コミュニティ・リソース
    6. 12.6 商標
    7. 12.7 静電気放電に関する注意事項
    8. 12.8 Glossary
  13. 13メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Layout Guidelines

For best operational performance of the device, use good PCB layout practices, including:

  • Noise can propagate into analog circuitry through the power pins of the circuit as a whole and operational amplifier itself. Bypass capacitors are used to reduce the coupled noise by providing low-impedance power sources local to the analog circuitry.
    • Connect low-ESR, 0.1-µF ceramic bypass capacitors between each supply pin and ground, placed as close to the device as possible. A single bypass capacitor from V+ to ground is applicable for single-supply applications.
  • Separate grounding for analog and digital portions of circuitry is one of the simplest and most-effective methods of noise suppression. One or more layers on multilayer PCBs are usually devoted to ground planes. A ground plane helps distribute heat and reduces EMI noise pick-up. Make sure to physically separate digital and analog grounds paying attention to the flow of the ground current. For more detailed information, see Circuit Board Layout Techniques.
  • In order to reduce parasitic coupling, run the input traces as far away from the supply or output traces as possible. If these traces cannot be kept separate, crossing the sensitive trace perpendicular is much better as opposed to in parallel with the noisy trace.
  • Place the external components as close to the device as possible. As shown in Figure 51, keeping RF and RG close to the inverting input minimizes parasitic capacitance.
  • Keep the length of input traces as short as possible. Always remember that the input traces are the most sensitive part of the circuit.
  • Consider a driven, low-impedance guard ring around the critical traces. A guard ring can significantly reduce leakage currents from nearby traces that are at different potentials.
  • Cleaning the PCB following board assembly is recommended for best performance.
  • Any precision integrated circuit may experience performance shifts due to moisture ingress into the plastic package. Following any aqueous PCB cleaning process, baking the PCB assembly is recommended to remove moisture introduced into the device packaging during the cleaning process. A low temperature, post cleaning bake at 85°C for 30 minutes is sufficient for most circumstances.