JAJSFO4B August   2017  – December 2018 OPA2810

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
    1.     マルチチャネル・センサ・インターフェイス
  3. 3 概要
    1.     高調波歪みと周波数との関係
  4. 4 改訂履歴
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: 10 V
    6. 6.6  Electrical Characteristics: 24 V
    7. 6.7  Electrical Characteristics: 5 V
    8. 6.8  Typical Characteristics: VS = 10 V
    9. 6.9  Typical Characteristics: VS = 24 V
    10. 6.10 Typical Characteristics: VS = 5 V
    11. 6.11 Typical Characteristics: ±2.375 V to ±12 V Split Supply
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
      1. 7.2.1 ESD Protection
    3. 7.3 Feature Description
      1. 7.3.1 OPA2810 Comparison
    4. 7.4 Device Functional Modes
      1. 7.4.1 Split-Supply Operation (±2.375 V to ±13.5 V)
      2. 7.4.2 Single-Supply Operation (4.75 V to 27 V)
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Selection of Feedback Resistors
      2. 8.1.2 Noise Analysis and the Effect of Resistor Elements on Total Noise
    2. 8.2 Typical Applications
      1. 8.2.1 Transimpedance Amplifier
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
      2. 8.2.2 Multichannel Sensor Interface
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Thermal Considerations
    2. 10.2 Layout Example
  11. 11デバイスおよびドキュメントのサポート
    1. 11.1 ドキュメントのサポート
      1. 11.1.1 関連資料
    2. 11.2 ドキュメントの更新通知を受け取る方法
    3. 11.3 コミュニティ・リソース
    4. 11.4 商標
    5. 11.5 静電気放電に関する注意事項
    6. 11.6 Glossary
  12. 12メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

10.1.1 Thermal Considerations

The OPA2810 does not require heat sinking or airflow in most applications. Maximum allowed junction temperature sets the maximum allowed internal power dissipation. Do not allow the maximum junction temperature to exceed 150°C.

Operating junction temperature (TJ) is given by TA + PD × θJA. The total internal power dissipation (PD) is the sum of quiescent power (PDQ) and additional power dissipated in the output stage (PDL) to deliver load power. Quiescent power is the specified no-load supply current times the total supply voltage across the part. PDL depends on the required output signal and load but would, for a grounded resistive load, be at a maximum when the output is fixed at a voltage equal to half of either supply voltage (for equal split-supplies). Under this condition PDL = VS2 / (4 × RL) where RL includes feedback network loading.

The power in the output stage and not into the load that determines internal power dissipation.

As a worst-case example, compute the maximum TJ using an OPA2810-DGK (VSSOP package) configured as a unity gain buffer, operating on ±12-V supplies at an ambient temperature of 25°C and driving a grounded 500-Ω load.

PD = 24 V × 9 mA + 122 /(4 × 500 Ω) = 288 mW

Maximum TJ = 25°C + (0.288 W × 177.2°C/W) = 76°C, which is well below the maximum allowed junction temperature of 150oC.