JAJSIC3D October   1997  – December 2019 OPA548

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
    1.     概略回路図
  3. 3 概要
  4. 4 改訂履歴
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Adjustable Current Limit
      2. 7.3.2 Enable/Status (E/S) Pin
      3. 7.3.3 Thermal Shutdown Status
    4. 7.4 Device Functional Modes
      1. 7.4.1 Output Disable
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Basic Circuit Connections
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Power Supply Requirements
          2. 8.2.1.2.2 Gain Setting and Input Configuration
          3. 8.2.1.2.3 Current Limit
          4. 8.2.1.2.4 Safe-Operating-Area
          5. 8.2.1.2.5 Heat Sinking
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Monitoring Single- and Dual-Supplies
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Output Disable and Thermal Shutdown Status
      3. 8.2.3 Programmable Power Supply
    3. 8.3 System Examples
  9. 9 Power Supply Recommendations
    1. 9.1 Output Stage Compensation
    2. 9.2 Output Protection
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Safe Operating Area
      2. 10.1.2 Amplifier Mounting
      3. 10.1.3 Power Dissipation
      4. 10.1.4 Thermal Considerations
      5. 10.1.5 Heat Sinking
        1. 10.1.5.1 Heat Sink Selection Example
    2. 10.2 Layout Example
  11. 11デバイスおよびドキュメントのサポート
    1. 11.1 デバイス・サポート
      1. 11.1.1 デベロッパー・ネットワークの製品に関する免責事項
    2. 11.2 ドキュメントのサポート
      1. 11.2.1 関連資料
    3. 11.3 ドキュメントの更新通知を受け取る方法
    4. 11.4 サポート・リソース
    5. 11.5 商標
    6. 11.6 静電気放電に関する注意事項
    7. 11.7 Glossary
  12. 12メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

8 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.