SBOS293H December   2003  – December 2015 OPA695

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Parameter Measurement Information
    1. 7.1 Differential Small Signal Measurement
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Wideband Current Feedback Operation
      2. 8.3.2 RF Specifications and Applications
      3. 8.3.3 Input Return Loss (S11)
      4. 8.3.4 Output Return Loss (S22)
      5. 8.3.5 Forward Gain (S21)
      6. 8.3.6 Reverse Isolation (S12)
      7. 8.3.7 Limits to Dynamic Range
        1. 8.3.7.1 -1-dB Compression
        2. 8.3.7.2 Two-Tone 3rd-Order Output Intermodulation Intercept (OP3)
        3. 8.3.7.3 Noise Figure
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 SAW Filter Buffer
      2. 9.1.2 LO Buffer Amplifier
      3. 9.1.3 Wideband Cable Driving Applications
        1. 9.1.3.1 Cable Modem Return Path Driver
        2. 9.1.3.2 RGB Video Line Driver
        3. 9.1.3.3 Arbitrary Waveform Driver
      4. 9.1.4 Differential I/O Applications
      5. 9.1.5 Operating Suggestions
        1. 9.1.5.1 Setting Resistor Values to Optimize Bandwidth
        2. 9.1.5.2 Output Current and Voltage
        3. 9.1.5.3 Driving Capacitive Loads
        4. 9.1.5.4 Distortion Performance
        5. 9.1.5.5 Noise Performance
        6. 9.1.5.6 DC Accuracy and Offset Control
        7. 9.1.5.7 Power Shutdown Operation
        8. 9.1.5.8 Thermal Analysis
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Saw Filter Buffer
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Input and ESD Protection
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Design-In Tools
        1. 12.1.1.1 Demonstration Fixtures
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.