JAJSL15N July   1997  – April 2021 SN65LVDS31 , SN65LVDS3487 , SN65LVDS9638

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 概要 (続き)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings #GUID-35E89C88-1E48-404C-8AB6-22CCA817C2ED/SLLS2613609
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: SN55LVDS31
    6. 7.6 Electrical Characteristics: SN65LVDSxxxx
    7. 7.7 Switching Characteristics: SN55LVDS31
    8. 7.8 Switching Characteristics: SN65LVDSxxxx
    9. 7.9 Typical Characteristics
      1. 7.9.1 17
  8. 8 Parameter Measurement Information
    1. 8.1 19
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Driver Disabled Output
      2. 9.3.2 NC Pins
      3. 9.3.3 Unused Enable Pins
      4. 9.3.4 Driver Equivalent Schematics
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Point-to-Point Communications
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Driver Supply Voltage
          2. 10.2.1.2.2 Driver Bypass Capacitance
          3. 10.2.1.2.3 Driver Output Voltage
          4. 10.2.1.2.4 Interconnecting Media
          5. 10.2.1.2.5 PCB Transmission Lines
          6. 10.2.1.2.6 Termination Resistor
          7. 10.2.1.2.7 Driver NC Pins
        3. 10.2.1.3 Application Curve
      2. 10.2.2 Multidrop Communications
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
          1. 10.2.2.2.1 Interconnecting Media
        3. 10.2.2.3 Application Curve
  11. 11Power Supply Recommendations
    1. 11.1 49
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Microstrip vs. Stripline Topologies
      2. 12.1.2 Dielectric Type and Board Construction
      3. 12.1.3 Recommended Stack Layout
      4. 12.1.4 Separation Between Traces
      5. 12.1.5 Crosstalk and Ground Bounce Minimization
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Other LVDS Products
    2. 13.2 Documentation Support
      1. 13.2.1 Related Information
      2. 13.2.2 ドキュメントの更新通知を受け取る方法
      3. 13.2.3 Related Links
    3. 13.3 サポート・リソース
    4. 13.4 Trademarks
    5. 13.5 静電気放電に関する注意事項
    6. 13.6 用語集
  14. 14Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • PW|16
  • NS|16
  • D|16
サーマルパッド・メカニカル・データ
発注情報

12.1.5 Crosstalk and Ground Bounce Minimization

To reduce crosstalk, it is important to provide a return path to high-frequency currents that is as close as possible to its originating trace. A ground plane usually achieves this. Because the returning currents always choose the path of lowest inductance, they are most likely to return directly under the original trace, thus minimizing crosstalk. Lowering the area of the current loop lowers the potential for crosstalk. Traces kept as short as possible with an uninterrupted ground plane running beneath them emit the minimum amount of electromagnetic field strength. Discontinuities in the ground plane increase the return path inductance and should be avoided.