JAJSDI7B July 2017 – October 2018 TAS2505-Q1
PRODUCTION DATA.
デバイスごとのパッケージ図は、PDF版データシートをご参照ください。
Solder the Thermal PAD to GND plane. The plane will work as heat sink. For details about the corner pads size and location, refer to the メカニカル、パッケージ、および注文情報 at the end of this document.
CORNER | DESCRIPTION |
---|---|
A1 | Internally connected to thermal pad. Leave floating or connect to the same plane as thermal pad. |
A2 | |
A3 | |
A4 |