JAJSN80E August   2009  – May 2022 TCA9535

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
      1.      Parameter Measurement Information
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 5-V Tolerant I/O Ports
      2. 7.3.2 Hardware Address Pins
      3. 7.3.3 Interrupt ( INT) Output
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-On Reset (POR)
      2. 7.4.2 Powered-Up
    5. 7.5 Programming
      1. 7.5.1 I2C Interface
        1. 7.5.1.1 Bus Transactions
          1. 7.5.1.1.1 Writes
          2. 7.5.1.1.2 Reads
      2. 7.5.2 Device Address
      3. 7.5.3 Control Register and Command Byte
    6. 7.6 Register Maps
      1. 7.6.1 Register Descriptions
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Calculating Junction Temperature and Power Dissipation
        2. 8.2.1.2 Minimizing ICC When I/O is Used to Control LED
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 サポート・リソース
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC(1)TCA9535UNIT
PW (TSSOP)DB
(SSOP)		RTW (WQFN)RGE (VQFN)
24 PINS24 PINS24 PINS24 PINS
RθJAJunction-to-ambient thermal resistance108.892.943.648.4°C/W
RθJC(top)Junction-to-case (top) thermal resistance5453.546.258.1°C/W
RθJBJunction-to-board thermal resistance62.850.422.127.1°C/W
ψJTJunction-to-top characterization parameter11.121.91.53.3°C/W
ψJBJunction-to-board characterization parameter62.350.122.227.2°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistanceN/AN/A10.715.3°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.